EP4CGX150CF23I6N vs EP4CGX150CF23I7 Comparison

Detailed side-by-side comparison of EP4CGX150CF23I6N by Intel and EP4CGX150CF23I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX150CF23I6N EP4CGX150CF23I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $175.80 $192.00
Family Cyclone IV GX Cyclone IV GX
Logic Elements 149760 149,760
Embedded Memory 6635520 bits (6.6 Mbit) 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block)
User I/Os 270 (per DigiKey listing) - 720 per family datasheet max β€”
Number of Pins 484 β€”
Package Type FBGA (FineLine Ball Grid Array) β€”
Process Technology 60 nm 60 nm low-power CMOS
Core Voltage 1.2 V β€”
Transceiver Channels 8 (up to 3.125 Gbps) β€”
PLLs 4 4 user PLLs + 4 transceiver PLLs
18x18 Multipliers Up to 360 β€”
Memory Blocks M9K (9 Kbit each) β€”
Configuration Modes JTAG, AS, PS, FPP β€”
Operating Temperature -40C to +100C (Industrial) -40C to +100C (industrial)
Speed Grade 6 I7 (industrial, fast)
RoHS Status Compliant Compliant
Mounting Type Surface Mount Surface Mount (BGA)
Hard IP Blocks PCIe Gen1 (x1/x2/x4), memory controller β€”
DSP Blocks (18x18 Multipliers) β€” 360
Maximum User I/O Pins β€” 270
Transceivers β€” 8 channels, up to 3.125 Gbps
PCIe Hard IP β€” 1 Gen1 x4 controller
Core Supply Voltage β€” 1.2 V
Package β€” 484-pin Fine-pitch BGA (FBGA-484, F23)
MSL Level β€” 3 (per JEDEC J-STD-020)

Datasheets & Resources

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