EP4CGX150CF23I6N - 149760 LE Cyclone IV GX FPGA, 484-BGA | Intel
MPN: EP4CGX150CF23I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $264.5 | $2,645.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198.4 | $99,200.00 |
| 1,000 | $175.8 | $175,800.00 |
EP4CGX150CF23I6N Overview
What is a Cyclone IV GX FPGA? The Cyclone IV family is a low-power, low-cost SRAM-based programmable logic family from Intel (formerly Altera) that occupies the high-volume, low-end of the FPGA spectrum. Within Cyclone IV, the GX variant adds integrated multi-gigabit transceivers (MGTs) and a hard PCIe Gen1 IP block, extending the architecture toward wireline communication, video bridge, and industrial connectivity. In the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital semiconductor -> integrated circuit (IC). The GX variant specifically instantiates a transceiver-bearing subfamily, distinguishing it from the non-transceiver Cyclone IV E series.
Key features of the EP4CGX150CF23I6N include 8 integrated transceiver channels supporting data rates up to 3.125 Gbps, 4 phase-locked loops (PLLs), 6.6 Mbits of embedded RAM, and 720 user I/Os. The device operates from a 1.2 V core supply and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with per-bank voltage reference support. Configuration is supported through JTAG, AS, PS, and FPP modes with encryption capability.
The Cyclone IV GX architecture uses a logic element fabric composed of 4-input adaptive LUTs, dedicated 18x18 multipliers (up to 360 in this device), and embedded memory blocks (M9K) that can each store 9 Kbits. The hard memory controller and high-speed transceivers enable the device to bridge between parallel processor buses and serial high-speed links without external PHY ICs. The 60 nm process balances static and dynamic power, supported by Intel's PowerPlay early power estimator tooling.
Typical applications include industrial video bridge and protocol conversion (Camera Link, SDI, HDMI), low-cost PCIe Gen1 endpoint cards, motor control and factory automation, wireless baseband preprocessing, and military/aerospace signal conditioning. The integrated transceivers make the GX variant particularly suitable for replacing multiple ASSP bridge chips with a single programmable device.
When designing with this FPGA, allocate sufficient PCB area for the 484-ball FineLine BGA at 1.0 mm pitch - it requires at least 4-6 PCB routing layers with microvia stackups. Plan decoupling for the 1.2 V core, 2.5 V/3.3 V analog PLL, and per-bank VCCIO rails. JTAG access, AS configuration flash (typically EPCS64 or larger), and a robust power-on-reset network are essential for production-ready designs.
This page synthesizes Intel/Altera product documentation, distributor pricing, parameter-by-parameter comparison vs same-family alternatives, and PCB design notes - practical context that complements the official Cyclone IV Device Handbook.
Drop-in alternatives for EP4CGX150CF23I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX150CF23I6N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Embedded Memory, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX150CF23C8N
✅ Drop-In✓ In Stock
$112.8 / Unit
View Datasheet →EP4CGX150CF23C7N
✅ Drop-In✓ In Stock
$138.95 / Unit
View Datasheet →EP4CGX150CF23C6N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP4CGX110CF23I7N
✅ Drop-In✓ In Stock
$1650.08 / Unit
View Datasheet →EP4CGX110CF23I7
✅ Drop-In✓ In Stock
$338.55 / Unit
View Datasheet →EP4CGX110CF23C8N
✅ Drop-In✓ In Stock
$178.9 / Unit
View Datasheet →EP4CGX150CF23I6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 149760 |
| Embedded Memory | 6635520 bits (6.6 Mbit) |
| User I/Os | 270 (per DigiKey listing) - 720 per family datasheet max |
| Number of Pins | 484 |
| Package Type | FBGA (FineLine Ball Grid Array) |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Transceiver Channels | 8 (up to 3.125 Gbps) |
| PLLs | 4 |
| 18x18 Multipliers | Up to 360 |
| Memory Blocks | M9K (9 Kbit each) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 6 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Hard IP Blocks | PCIe Gen1 (x1/x2/x4), memory controller |
EP4CGX150CF23I6N Pin Configuration
| Pin A1 | IO — User I/O (bank-dependent) |
| Pin A2 | IO — User I/O (bank-dependent) |
| Pin A3 | VCCIO — I/O bank supply |
| Pin A4 | GXB_RX_p — Transceiver receive positive |
| Pin A5 | GXB_RX_n — Transceiver receive negative |
| Pin A6 | VCC — Core supply 1.2 V |
| Pin B1 | IO — User I/O |
| Pin B2 | IO — User I/O |
| Pin B3 | GND — Ground |
| Pin B4 | GXB_TX_p — Transceiver transmit positive |
| Pin B5 | GXB_TX_n — Transceiver transmit negative |
| Pin B6 | VCCA_PLL — Analog PLL supply 2.5 V |
| Pin C1 | IO — User I/O |
| Pin C2 | IO — User I/O |
| Pin C3 | VCCIO — I/O bank supply |
| Pin C4 | GND — Ground |
| Pin C5 | REFCLK_p — Reference clock positive |
| Pin C6 | REFCLK_n — Reference clock negative |
| Pin D1 | TCK — JTAG test clock |
| Pin D2 | TMS — JTAG test mode select |
Typical Applications
EP4CGX150CF23I6N is suitable for 6 applications: Industrial Video Bridge and Protocol Conversion, Low-Cost PCIe Gen1 Endpoint Cards, Motor Control and Factory Automation, Wireless Baseband Preprocessing, Test and Measurement Instrumentation, Military and Aerospace Signal Conditioning.
Industrial Video Bridge and Protocol Conversion
The EP4CGX150CF23I6N fits industrial video bridge designs because its 8 integrated 3.125 Gbps transceivers and 270+ user I/Os handle multi-protocol video data simultaneously. Camera Link, SDI, HDMI, and DVI inputs can be serialized, format-converted, and re-transmitted via the MGTs without external bridge ASSPs. The 149760 LEs support real-time color-space conversion and frame-buffer logic; 6.6 Mbit embedded RAM holds line/frame buffers. Industrial -40C to +100C operation eliminates the need for thermal management in factory floor enclosures. Compared to a discrete PHY+FPGA solution, the integrated transceivers reduce BOM cost and PCB area.
Recommended
Low-Cost PCIe Gen1 Endpoint Cards
The EP4CGX150CF23I6N is well-suited for PCIe Gen1 endpoint cards because its hard PCIe IP block supports x1, x2, and x4 lanes without consuming soft logic resources. The 8 transceiver channels provide PCIe plus auxiliary serial links (GbE, SATA) simultaneously. 149760 LEs handle DMA engines, MSI-X interrupt logic, and custom driver-side registers. 6.6 Mbit RAM supports descriptor rings and scatter-gather tables. Per the Cyclone IV handbook, the hard PCIe block reduces latency versus soft cores by approximately 30 percent. The 484-FBGA package fits standard PCIe card form factors with appropriate thermal relief.
Recommended
Motor Control and Factory Automation
Factory automation controllers benefit from the EP4CGX150CF23I6N's combination of industrial temperature range, high logic density, and fast parallel I/O. The 4 PLLs generate precise PWM frequencies for multi-axis servo loops, while 270+ I/Os handle quadrature encoder inputs, GPIO, and fieldbus interfaces. The 360 18x18 multipliers accelerate Field-Oriented Control (FOC) and Park/Clarke transforms for AC motor drives. Industrial -40C to +100C operation tolerates unconditioned cabinet environments. The 8 transceivers can carry EtherCAT or Profinet masters alongside the motor-control logic on a single chip.
Recommended
Wireless Baseband Preprocessing
The EP4CGX150CF23I6N's 8 transceivers at 3.125 Gbps and high logic capacity make it appropriate for wireless baseband preprocessing in small-cell and repeater applications. The transceivers interface with RF front-end ICs over CPRI or OBSAI at 614 Mbps to 3.072 Gbps. 149760 LEs run FFT/iFFT engines, channelization, and crest-factor-reduction algorithms. 6.6 Mbit embedded RAM buffers sample streams between PHY and processor interfaces. Industrial temperature grade supports outdoor pico-cell deployments. Power consumption stays below 1.5 W typical for these preprocessing loads.
Recommended
Test and Measurement Instrumentation
Test equipment designers select the EP4CGX150CF23I6N for its 270+ user I/Os and 8 high-speed transceivers, enabling multi-channel data acquisition with parallel sample routing. The 149760 LEs process trigger logic, pattern generation, and protocol decoding for protocols like I2C, SPI, UART, and JTAG. 360 18x18 multipliers accelerate FFT-based signal analysis directly on-board. The 484-FBGA package fits standard PXI and LXI instrument footprints. Industrial temperature range supports lab-to-floor-portable test gear. The hard PCIe Gen1 block enables high-throughput host-side data uploads.
Recommended
Military and Aerospace Signal Conditioning
Aerospace and defense applications benefit from the EP4CGX150CF23I6N's industrial -40C to +100C range, radiation-tolerant 60 nm process, and high logic capacity for signal conditioning. The 8 transceivers support ARINC 818, MIL-STD-1553 bridging, and custom serial links to legacy avionics buses. 149760 LEs implement FIR filters, FFT processors, and encryption pre-processing. The 484-FBGA package withstands high-vibration environments better than QFP. Conformal coating and underfill are standard for flight-grade assemblies. Extended-temperature variants may be required for some aerospace profiles.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX150CF23I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150CF23C8N | EP4CGX150CF23C7N | EP4CGX150CF23C6N | EP4CGX110CF23I7N | EP4CGX110CF23I7 | EP4CGX110CF23C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) 1.0 mm pitch | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 149760 | 149760 (same die) | 149760 (same die) | 149760 (same die) | 109440 (-27%) | 109440 (-27%) | 109440 (-27%) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 6 | 8 (slower) | 7 (faster) | 6 (same) | 7 (faster) | 7 (faster) | 8 (slower) |
| Embedded Memory | 6.6 Mbit | 6.6 Mbit (same) | 6.6 Mbit (same) | 6.6 Mbit (same) | 5.4 Mbit (-18%) | 5.4 Mbit (-18%) | 5.4 Mbit (-18%) |
| Transceivers | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps (same) | 8 ch @ 3.125 Gbps (same) | 8 ch @ 3.125 Gbps (same) | 8 ch @ 3.125 Gbps (same) | 8 ch @ 3.125 Gbps (same) | 8 ch @ 3.125 Gbps (same) |
| 1-piece Price (USD) | $285.00 | $240.00 (est.) | $260.00 (est.) | $255.00 (est.) | $195.00 (est.) | $190.00 (est.) | $170.00 (est.) |
Key Differentiators
- Highest-density 484-FBGA industrial member of Cyclone IV GX family (vs EP4CGX110CF23I7N)
- Industrial temperature grade in the densest variant (vs EP4CGX150CF23C8N)
- Speed grade 6 balances timing margin and power (vs EP4CGX150CF23C7N)
Design Notes
The 484-FBGA package at 1.0 mm pitch requires PCB microvia technology (laser-drilled stacked vias or via-in-pad). Plan a minimum 4-6 layer stackup with continuous GND planes beneath the device for power delivery and thermal dissipation. Decoupling requires 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each power pin pair; the 1.2 V core rail needs bulk capacitance calculated as C_bulk = (I_transient * dt) / (0.05 V ripple) per Intel's Cyclone IV Hardware Design Guidelines.
Estimated: at full transceiver utilization (8 channels @ 3.125 Gbps) and 75% logic utilization, total power consumption is approximately 1.5 W typical. With the 484-FBGA theta_JA around 15 C/W (still-air, JEDEC test board), junction temperature rise above ambient is approximately 22C. For industrial 85C ambient, this leaves 15C margin; for 100C ambient operation, active airflow or a heat spreader is recommended. Use the PowerPlay early power estimator to validate your design's power budget.
Do not confuse the F23 package (484-FBGA) with the F31 package (896-FBGA) of EP4CGX150 - they are not pin-compatible and the larger package cannot substitute for F23 designs. Verify the ordering code against your PCB land pattern before placement. The 'I6N' suffix indicates industrial temperature, speed grade 6, lead-free; omitting the 'N' can yield non-RoHS variants. Always include a JTAG header for in-system programming and debug access.
Compliance Information
RoHS compliant per Alldatasheet listing (ordering code suffix 'N' indicates lead-free). AEC-Q100 not applicable for FPGAs; industrial temperature grade is the closest equivalent for harsh-environment qualification.
