EP4CGX50DF23C6N vs EP4CGX110DF23I7N Comparison

Detailed side-by-side comparison of EP4CGX50DF23C6N by Intel and EP4CGX110DF23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP4CGX50DF23C6N EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N βœ“ Active

Specification Comparison

Parameter EP4CGX50DF23C6N EP4CGX110DF23I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $52.30 $182.00
Family Cyclone IV GX Cyclone IV GX
Logic Elements 49,888 109,424
Configurable Logic Blocks (CLBs) 3,118 β€”
Embedded Memory 2,340 Kbits 4.4 Mbits (approximate)
Process Technology 60 nm 60 nm low-power CMOS
Core Voltage 1.2 V β€”
Number of Pins / Balls 484 β€”
Package Type 484-ball FBGA (PBGA) β€”
JEDEC Package Code S-PBGA-B484 β€”
User I/O 218 β€”
Transceiver Channels Up to 8 β€”
Maximum Transceiver Data Rate 3.125 Gbps β€”
Operating Temperature Grade Commercial β€”
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method JTAG / Passive Serial / Active Serial β€”
Logic Array Blocks (LABs) β€” 6,839
User I/O Pins β€” 270
Embedded 18x18 Multipliers β€” 56
Transceivers β€” Up to 3.125 Gbps embedded transceivers
Core Supply Voltage (VCCINT) β€” 1.15 V to 1.25 V (nominal 1.2 V)
Operating Temperature β€” -40C to +100C (industrial)
Speed Grade β€” 7
Package β€” 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch
Package Code β€” BGA (FBGA)
RoHS Status β€” Compliant
Configuration Memory β€” SRAM-based (volatile, requires external config device)

Datasheets & Resources

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