Intel

EP4CGX110DF23I7N - 110K LE Cyclone IV GX FPGA, 484-FBGA | Intel

MPN: EP4CGX110DF23I7N ✓ Active

In Stock Ships in 1-3 business days

1.15 V to 1.25 V (nominal 1.2 V) Vdss 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch Package 7 Speed 4.4 Mbits (approximate) Memory

From $182 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$285	$285.00
10	$261	$2,610.00
100	$232	$23,200.00
500	$205	$102,500.00
1,000	$182	$182,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP4CGX110DF23I7N Overview

The Intel EP4CGX110DF23I7N is a high-density, low-power Field-Programmable Gate Array (FPGA) from the Cyclone IV GX family, fabricated on a 60 nm process and housed in a 484-ball plastic FBGA package measuring 23 x 23 mm with a 1.00 mm terminal pitch. The device integrates approximately 109,424 logic elements distributed across 6,839 Logic Array Blocks (LABs), 270 user I/O pins, and embedded transceivers capable of up to 3.125 Gbps, targeting cost-sensitive applications that still require high-speed serial connectivity.

What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened I/O peripherals. Unlike fixed-function ASICs, FPGAs are reprogrammed in the field via HDL bitstreams, allowing rapid prototyping and post-deployment updates. Within the broader semiconductor taxonomy, FPGAs sit between microcontrollers (sequential execution) and ASICs (fixed function) — offering hardware parallelism for data-path intensive workloads. The Cyclone IV GX family specifically targets low static and dynamic power, making it suitable for volume production across industrial, communications, and consumer markets.

Key features of the EP4CGX110DF23I7N include up to 3.125 Gbps embedded transceivers for protocols such as PCIe Gen1, Gigabit Ethernet, CPRI, and JESD204B; up to 4.4 Mbits of embedded memory; 56 embedded 18x18 multipliers for DSP operations; and a 1.2 V core supply (1.15 V to 1.25 V range). The device supports industrial temperature operation from -40C to +100C and is offered in the speed grade 7 (slower-than-8), which trades timing margin for cost savings in non-critical-speed applications.

The architecture is built around a low-leakage 60 nm process, allowing Intel (formerly Altera) to position this part below the Cyclone III family in power while integrating multi-gigabit transceivers that previously required a higher-tier device. The transceiver block supports multiple physical interfaces through soft IP, and the FPGA fabric provides abundant logic for protocol adaptation, FIFO buffering, and state-machine control.

Typical applications for the EP4CGX110DF23I7N include industrial video bridging and image processing, low-cost PCIe endpoint cards, motor control and industrial Ethernet gateways, software-defined radio front-end pre-processing, and FPGA-based prototyping for ASIC verification. The combination of high logic density, integrated transceivers, and industrial-grade temperature range makes it well suited for designs that previously required a discrete PHY or a larger FPGA.

When designing with this device, careful attention must be paid to transceiver reference clock jitter, PCB routing for 3.125 Gbps SERDES lanes, and power-rail sequencing between the 1.2 V core and 2.5/3.3 V I/O banks. Quartus II software (with Cyclone IV device support) is required for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.

Drop-in alternatives for EP4CGX110DF23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX110DF23I7N (same form factor and footprint) — differing in Package, Operating Temperature, Embedded Memory, Process Technology, Speed Grade.

EP4CE115F23I7N

Intel

Package: 484-FBGA (F23) 23x23 mm, 1.0 mm pitch

Process Technology: 60 nm low-power CMOS (TSMC)