EP4CGX50DF27C6N vs EP4CGX50DF27C7N Comparison
Detailed side-by-side comparison of EP4CGX50DF27C6N by Intel and EP4CGX50DF27C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX50DF27C6N | EP4CGX50DF27C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.00 | $58.60 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Logic Array Blocks (LAB) | 3,118 | [DATA_NEEDED: LAB count for EP4CGX50] |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | β |
| Embedded Memory Blocks | M9K | β |
| Embedded 18x18 Multipliers | 140 | β |
| User I/O Pins | 310 | β |
| Transceivers | Up to 8 channels, 3.125 Gbps | Yes (3.125 Gbps GX channels, package-dependent) |
| PLLs | 4 | β |
| Global Clocks | 20 | β |
| Core Voltage | 1.2 V | β |
| Speed Grade | C6 (commercial) | β |
| Process Technology | 60 nm low-power | β |
| Package | 672-ball FineLine BGA (FBGA) | 672-pin FBGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (commercial) | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Total Embedded Memory Bits | β | 2,562,048 |
| User I/O Pins (max) | β | 310 |
| Core Supply Voltage | β | 1.2 V |
| Process Node | β | 60 nm |
| Operating Temperature (Commercial 'C') | β | 0C to +85C |
| PLL Count | β | 6 |
| Hard Memory Controller | β | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | β | Yes |