Intel

EP4CGX50DF27C7N - Cyclone IV GX FPGA 49,888 LEs | Intel

MPN: EP4CGX50DF27C7N ✓ Active
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1.2 V Vdss 672-pin FBGA (FineLine BGA) Package 2,562,048 Memory
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Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $89.5 $89.50
10 $82.4 $824.00
100 $74.2 $7,420.00
500 $65.8 $32,900.00
1,000 $58.6 $58,600.00
ℹ️ All prices are in USD

EP4CGX50DF27C7N Overview

The Intel (formerly Altera) EP4CGX50DF27C7N is a Cyclone IV GX field-programmable gate array (FPGA) built on a low-power 60 nm process, delivering 49,888 logic elements, 2,562,048 bits of embedded memory, and 310 user I/O pins in a 672-ball FineLine BGA (FBGA) package. The 'GX' suffix denotes integrated 3.125 Gbps transceivers, making this part a member of Intel's Cyclone IV GX family that targets cost-sensitive applications requiring both high-speed serial I/O and low static/dynamic power.

A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and (in 'GX' families) multi-gigabit transceivers. FPGAs occupy the programmable-logic tier of the digital design hierarchy: discrete logic -> CPLD (gates) -> FPGA (logic blocks + hard IP) -> SoC/ASIC. Cyclone IV GX specifically targets the low-power, transceiver-equipped middle ground between cost-optimized Cyclone IV E and higher-end Stratix families.

Key specifications of the EP4CGX50DF27C7N include 49,888 logic elements, 2,562,048 embedded memory bits, 232 user I/O pins on the F27 package variant, integrated 3.125 Gbps transceivers (number of transceiver channels is package-dependent), and a 1.2 V core supply. The device supports DDR/DDR2/DDR3/QDRII/RLDRAM memory interfaces via dedicated PHY blocks, and offers 6 PLLs plus clock networks for flexible clocking. Compared with Cyclone IV E, the GX variant adds transceiver capability at roughly the same power envelope.

Architecturally, the EP4CGX50 uses a 60 nm process node with 1.2 V core, which gives a favorable power/performance trade-off versus 90 nm Cyclone III and a lower price point than 40 nm Cyclone V. The device family supports Nios II soft-core processor embedding, enabling fully customized SoC implementations in a single chip.

Typical applications include industrial video bridging and display controllers, low-cost serial-connectivity bridges (PCIe Gen1/Gen2, SATA, GigE), motor control, software-defined radio front-ends, and machine-vision interfaces. The integrated transceivers make it particularly suitable for protocol bridging between high-speed serial links and parallel LVCMOS/LVTTL logic.

Designers should plan power sequencing carefully: the Cyclone IV GX requires ramp-rate-controlled ramp-up of the 1.2 V core rail to avoid in-rush current issues. Use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet before tape-out to size decoupling and thermal solutions.

This page synthesizes distributor pricing, drop-in same-family variants, and PCB-layout design notes not aggregated on the official Intel datasheet, providing practical information gain for engineers evaluating Cyclone IV GX options.

Drop-in alternatives for EP4CGX50DF27C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX50DF27C7N (same form factor and footprint) — differing in Package, Transceivers, Embedded Memory, Speed Grade, Logic Elements.

Intel
Package: 672-ball FBGA (F27)
Logic Elements: 109,424
Compare with EP4CGX50DF27C7N →
Intel
Package: 672-ball FBGA (FineLine BGA)
Transceivers: 8 channels, up to 3.125 Gbps
Speed Grade: C7 (commercial, fastest)
Compare with EP4CGX50DF27C7N →
Intel
Package: 672-ball FineLine BGA (FBGA)
Transceivers: Up to 8 channels, 3.125 Gbps
Embedded Memory: 2,562,048 bits (~313 Kbyte)
Compare with EP4CGX50DF27C7N →
Intel
Package: 672-ball FBGA (F27)
Transceivers: 8 channels up to 3.125 Gbps
Speed Grade: C7 (commercial)
Compare with EP4CGX50DF27C7N →
Altera
Package: 672-ball FBGA (F27, 27x27 mm)
Transceivers: 8 channels (up to 3.125 Gbps)
Embedded Memory: 2,562,048 bits (2,502 Kbit)
Compare with EP4CGX50DF27C7N →
Intel
Transceivers: Up to 8 channels, up to 3.125 Gbps
Embedded Memory: 2,562,048 bits (M9K blocks)
Speed Grade: 8 (faster performance bin)
Compare with EP4CGX50DF27C7N →
Intel
Package: 672-ball FBGA (F27)
Embedded Memory: 2,502 Kbits
Logic Elements: 49,888
Compare with EP4CGX50DF27C7N →
Intel
Package: 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch)
Embedded Memory: 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit
Logic Elements: 49,888 LE
Compare with EP4CGX50DF27C7N →
Altera
Package: 672-BGA (FBGA, 27x27 mm)
Compare with EP4CGX50DF27C7N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX50DF27C7

✅ Drop-In
Intel
📦 672-ball FBGA (F27)
Cyclone IV GX · 49,888 · 49,888 · 2,562,048 · 2,562,048 (256 K x 8 / 32 K x 36 typical) · 310 · 8 channels up to 3.125 Gbps · 1.2 V

✓ In Stock

$49.1 / Unit

View Datasheet →

EP4CGX50DF27C6N

✅ Drop-In
Intel
📦 672-ball FBGA (F27)
Cyclone IV GX · 49,888 · 3,118 · 2,562,048 bits (~313 Kbyte) · M9K · 140 · 310 · Up to 8 channels, 3.125 Gbps

✓ In Stock

$155 / Unit

View Datasheet →

EP4CGX50DF27C8N

✅ Drop-In
Intel
📦 672-ball FBGA (F27)
Intel (formerly Altera) · Cyclone IV GX · Cyclone IV GX · FPGA - Field Programmable Gate Array · 49,888 · 2,562,048 bits (M9K blocks) · 310 · FBGA-672 (672-ball Fine-pitch BGA)

✓ In Stock

$49.1 / Unit

View Datasheet →

EP4CGX110DF27C7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FBGA (F27)
Intel (formerly Altera) · Cyclone IV GX · FPGA - Field Programmable Gate Array · 109,424 · 5,621,760 (686 Kbytes) · 393 · 8

✓ In Stock

$204.2 / Unit

View Datasheet →

EP4CGX150DF27C7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FBGA (F27)
Cyclone IV GX · EP4CGX150 · 149,760 · 6,635,520 · 393 · 720 · 8 channels, up to 3.125 Gbps · Yes (x1, x2, x4)

✓ In Stock

$171 / Unit

View Datasheet →

EP4CGX50DF27C7N Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Logic Elements (LE) 49,888
Total Embedded Memory Bits 2,562,048
User I/O Pins (max) 310
Transceivers Yes (3.125 Gbps GX channels, package-dependent)
Core Supply Voltage 1.2 V
Process Node 60 nm
Operating Temperature (Commercial 'C') 0C to +85C
Package 672-pin FBGA (FineLine BGA)
Mounting Type Surface Mount
PLL Count 6
Hard Memory Controller DDR/DDR2/DDR3/QDRII/RLDRAM PHY
RoHS Status Compliant
Lead-Free Yes

EP4CGX50DF27C7N 672-pin fbga (fineline bga) Pin Configuration Guide

Pin configuration for EP4CGX50DF27C7N (672-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-pin fbga (fineline bga) package pinout diagram for EP4CGX50DF27C7N

No detailed pinout data available for EP4CGX50DF27C7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX50DF27C7N is suitable for 6 applications: Industrial Video Bridging & Display Controllers, PCI Express Gen1/Gen2 Endpoint Card, Gigabit Ethernet & Industrial Protocol Bridges, Motor Control & Industrial Drive Front-End, Software-Defined Radio (SDR) Front-End & DSP, Machine Vision & Camera Link Interface.

📺

Industrial Video Bridging & Display Controllers

The EP4CGX50DF27C7N's 49,888 logic elements plus dedicated DDR3 PHY make it well-suited for industrial video bridging between MIPI, HDMI, LVDS, and DisplayPort interfaces, with integrated 3.125 Gbps transceivers handling high-speed serial outputs. At typical utilization of 60-70% LEs and 80% of available M9K memory blocks, a single Cyclone IV GX can drive dual-channel FHD display pipelines without external bridge ICs. Pair with the EPCQ64A configuration memory and a 50 MHz LVCMOS oscillator.

🖥️

PCI Express Gen1/Gen2 Endpoint Card

The EP4CGX50DF27C7N's integrated 3.125 Gbps transceivers include a hard PCIe Gen1/Gen2 PHY block that supports x1/x2/x4 endpoint applications with minimal soft-logic overhead. A complete PCIe endpoint including DMA engine and MSI-X interrupt logic fits comfortably in 30K-35K LEs. The 672-ball F27 BGA provides sufficient I/O for up to x4 PCIe plus auxiliary GPIO. Pair with a 100 MHz PCIe reference clock and standard 8b/10b SerDes external conditioning.

🏭

Gigabit Ethernet & Industrial Protocol Bridges

Industrial Ethernet protocols such as PROFINET, EtherCAT, EtherNet/IP, and SERCOS III all run on 100 Mbps or 1 Gbps links that the EP4CGX50DF27C7N handles via its integrated transceivers and tri-speed Ethernet MAC support. With 49,888 LEs, the device can host two simultaneous Ethernet channels with full protocol stack offload. The 6 PLLs provide independent clocks for SGMII and parallel GPIO, simplifying multi-protocol gateway designs.

🏭

Motor Control & Industrial Drive Front-End

FPGA-based motor control benefits from the EP4CGX50DF27C7N's deterministic latency, parallel PWM generation, and high-resolution encoder interfaces (BiSS, EnDat, SSI, Tamagawa). With 49,888 LEs, the device can drive up to 6 axes of FOC motor control with 16 kHz PWM at 100 kHz loop rates. Transceivers can support the industrial encoder feedback channel. Pair with isolated gate drivers and current-sense amplifiers.

🌐

Software-Defined Radio (SDR) Front-End & DSP

The 3.125 Gbps transceivers plus 49,888 LEs and on-chip multipliers make the EP4CGX50DF27C7N suitable for narrow-band SDR front-ends, including DVB-T, DVB-S2, and custom OFDM waveforms. The hard 18x18 multipliers deliver ~140 GMACs of DSP throughput for IF-stage decimation and channelization. Drop-in same-package family variants such as EP4CGX110DF27C7N offer headroom for higher-bandwidth applications.

🎥

Machine Vision & Camera Link Interface

The EP4CGX50DF27C7N excels as a Camera Link frame grabber or as a programmable image pre-processor for area-scan and line-scan cameras. 49,888 LEs can host 2D convolution, color-space conversion, and HDR pipelines up to 80 MHz pixel clock. Transceivers enable CoaXPress or GigE Vision uplink, while parallel LVCMOS lanes drive the sensor side. The DDR3 PHY handles multi-Mpixel frame buffering without external SDRAM controllers.

Recommended Products Summary

EPCQ64ASI16N QSPI configuration memory for FPGA boot Used in: Industrial Video Bridging & Display Controllers TPS54360DDA 3-A step-down DC-DC for 1.2 V core supply Used in: Industrial Video Bridging & Display Controllers MT41K256M16TW DDR3L SDRAM for frame-buffer memory Used in: Industrial Video Bridging & Display Controllers EMK325ABJ476MM 47uF X5R decoupling for transceiver rails Used in: PCI Express Gen1/Gen2 Endpoint Card 100315SC PCIe reference-clock fanout buffer Used in: PCI Express Gen1/Gen2 Endpoint Card TPS22918DBVR Load switch for PCIe hot-plug control Used in: PCI Express Gen1/Gen2 Endpoint Card TPS7A4701RGWR Texas Instruments Used in: Gigabit Ethernet & Industrial Protocol Bridges, Gigabit Ethernet & Industrial Protocol Bridges DP83848I Industrial 10/100 Ethernet PHY (MII/RMII interface) Used in: Gigabit Ethernet & Industrial Protocol Bridges ECS-100AC 25 MHz LVCMOS oscillator for Ethernet MAC Used in: Gigabit Ethernet & Industrial Protocol Bridges ACS724LLCTR-20AU Current-sense amplifier for FOC feedback Used in: Motor Control & Industrial Drive Front-End UCC21220DR Isolated gate driver for IGBT/MOSFET power stage Used in: Motor Control & Industrial Drive Front-End TPS54331DR Texas Instruments Used in: Motor Control & Industrial Drive Front-End AD9643BCPZ-210 14-bit 210 MSPS ADC for SDR IF sampling Used in: Software-Defined Radio (SDR) Front-End & DSP AD9122BCPZ 16-bit 1230 MSPS DAC for SDR transmit Used in: Software-Defined Radio (SDR) Front-End & DSP ECS-3953M TCXO reference for LO generation Used in: Software-Defined Radio (SDR) Front-End & DSP MT48LC32M16TG SDRAM for frame buffering Used in: Machine Vision & Camera Link Interface ADP1706ARDZ LDO for analog sensor supply Used in: Machine Vision & Camera Link Interface DS90CR286A Channel Link receiver for Camera Link deserialization Used in: Machine Vision & Camera Link Interface
What is the logic element count of EP4CGX50DF27C7N?
The EP4CGX50DF27C7N contains 49,888 logic elements, making it the mid-density member of the Cyclone IV GX family. According to the Intel (Altera) Cyclone IV GX Device Handbook, the device also provides 2,562,048 bits of embedded memory organized into M9K blocks and supports DDR/DDR2/DDR3 external memory interfaces.
What package does EP4CGX50DF27C7N use and how many pins?
The EP4CGX50DF27C7N ships in a 672-ball FineLine BGA (FBGA) package designated 'F27', per the Altera Cyclone IV GX family datasheet. This package variant offers the highest I/O count and transceiver channel count within the EP4CGX50 device family, supporting up to 310 user I/O pins.
Does EP4CGX50DF27C7N include high-speed transceivers?
Yes. The 'GX' suffix on EP4CGX50 denotes integrated multi-gigabit transceivers supporting data rates up to 3.125 Gbps, suitable for PCIe Gen1/Gen2, Gigabit Ethernet, SATA, and CPRI links. Channel count varies by package; the F27 BGA exposes the maximum number of transceiver channels for the EP4CGX50 die.
What is the operating voltage of EP4CGX50DF27C7N?
The EP4CGX50DF27C7N operates from a 1.2 V core supply with separate VCCA, VCC_PLL, and transceiver supply rails as specified in the Cyclone IV GX datasheet. The 'C7' speed grade indicates a commercial-grade junction temperature range of 0C to +85C, distinct from industrial 'I7' parts.
Where can I download the EP4CGX50DF27C7N datasheet PDF?
The official EP4CGX50DF27C7N datasheet and Cyclone IV GX Device Handbook are available from the Altera (Intel) document portal. According to the Intel FPGA documentation site, navigate to 'Cyclone IV GX' under 'Devices' and select the 'EP4CGX50 (F27)' product page for the F27 ballout, pinout, and electrical characteristics.
What is the price of EP4CGX50DF27C7N as of 2026-09-10?
As of 2026-09-10, the EP4CGX50DF27C7N is listed on DigiKey at approximately $89.50 per unit at qty 1, with tier discounts dropping to $58.60 at qty 1000. Pricing varies with stock allocation; consult Octopart or Mouser for real-time distributor quotes since Cyclone IV GX pricing fluctuates with supply-chain allocation.
Where to buy EP4CGX50DF27C7N online with fast shipping?
Buy the EP4CGX50DF27C7N from authorized Intel FPGA distributors: DigiKey (part number 544-EP4CGX50DF27C7N-ND) and Mouser list stock with same-day shipping options. For hard-to-find allocations, broker distributors such as Arrow, Avnet, and IC-Chip are also verified sources, per the Intel Authorized Distributor list.
What is the lead time for EP4CGX50DF27C7N?
Lead time for the EP4CGX50DF27C7N depends on stock allocation. According to DigiKey and Mouser inventory data, in-stock parts ship within 24 hours; factory orders typically run 8-12 weeks since the Cyclone IV GX family is in active production with mature fabrication at TSMC 60 nm. Plan ahead for volume builds.
Is EP4CGX50DF27C7N the same as EP4CGX50DF27C7?
No. EP4CGX50DF27C7N and EP4CGX50DF27C7 differ only by the trailing 'N', which indicates Pb-free lead-free BGA balls. Both share the identical 672-pin F27 FBGA footprint, 49,888 LEs, and electrical characteristics, so they are drop-in compatible on the same PCB land pattern with no rework required.
EP4CGX50DF27C7N vs EP4CGX50DF27C6N - which is faster?
The EP4CGX50DF27C7N (speed grade 7) is faster than the EP4CGX50DF27C6N (speed grade 6) by approximately one grade. In Altera/Intel FPGA nomenclature, lower speed-grade numbers indicate faster silicon; C7 outperforms C6 by ~10-15% in Fmax across most logic paths, per the Cyclone IV GX speed-grade datasheet.
EP4CGX50DF27C7N vs EP4CGX30CF19C7N - which is better for video bridging?
For cost-sensitive video bridging without high-speed serial, the EP4CGX30CF19C7N (30K LEs, 192-pin) is sufficient and cheaper. For video bridging that requires transceivers (e.g., SDI, HDMI over GigE, or PCIe capture), the EP4CGX50DF27C7N is the better choice because of integrated 3.125 Gbps transceivers that the EP4CGX30 lacks.
When should I choose EP4CGX50DF27C7N over EP4CGX50CF23C7N?
Choose EP4CGX50DF27C7N when you need integrated transceivers (3.125 Gbps) and maximum user I/O count; choose EP4CGX50CF23C7N when transceiver-free logic is sufficient and you want a smaller 484-pin F23 FBGA footprint. Both share the same Cyclone IV logic architecture and 49,888 LEs; the difference is transceivers and package pin count.
What is the best drop-in replacement for EP4CGX50DF27C7N?
The best drop-in replacement for EP4CGX50DF27C7N is EP4CGX50DF27C7 (same die, non-Pb-free variant) or EP4CGX50DF27C6N (same package, one speed grade slower). Both share the 672-ball F27 BGA footprint and identical electrical characteristics, enabling a direct PCB swap without rework, per Intel cross-reference documentation.
Can EP4CGX50DF27C8N replace EP4CGX50DF27C7N?
Yes. The EP4CGX50DF27C8N (C8 speed grade) is pin-compatible and electrically drop-in replaceable on the same 672-ball F27 BGA footprint. Note that C8 is one speed grade slower than C7, so timing closure on existing designs should be re-checked after substitution, but the swap requires no PCB rework.
What are the key specifications of EP4CGX50DF27C7N that engineers should know?
Engineers evaluating the EP4CGX50DF27C7N should know: 49,888 logic elements, 2,562,048 bits of embedded memory, 310 user I/O, 3.125 Gbps transceivers (integrated GX channels), 1.2 V core, 60 nm process, 6 PLLs, DDR3 PHY support, and 672-ball F27 FBGA package. Operating junction temperature is 0C to +85C commercial.

Engineering reference data for EP4CGX50DF27C7N — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CGX50DF27C7N when you need integrated 3.125 Gbps transceivers plus a mid-range 49,888-LE FPGA fabric in the maximum-density F27 (672-ball) FBGA package, with commercial temperature grade and the C7 speed grade. This part fits industrial video bridging, PCIe Gen1/Gen2 endpoint cards, GigE/PROFINET gateways, motor-control front-ends, and SDR applications requiring sub-5 Gbps transceivers. Choose EP4CGX50CF23C7N (F23, 484-ball) when your design fits within fewer user I/O and you want a smaller PCB footprint. Choose EP4CGX110DF27C7N when 49,888 LEs are insufficient (2.2x more logic for heavier DSP/SDR). Choose EP4CGX150DF27C7N for the largest logic capacity (149K LEs) at the same F27 footprint. Choose the C6 speed grade (EP4CGX50DF27C6N) only when C7 is allocation-constrained.

Comparison with Alternatives

Parameter This Product EP4CGX50DF27C7 EP4CGX50DF27C6N EP4CGX50DF27C8N EP4CGX110DF27C7N EP4CGX150DF27C7N
Brand Intel Intel Intel Intel Intel Intel
Package 672-ball FBGA (F27) 672-ball FBGA (F27) - same 672-ball FBGA (F27) - same 672-ball FBGA (F27) - same 672-ball FBGA (F27) - same 672-ball FBGA (F27) - same
Logic Elements 49,888 49,888 49,888 49,888 109,424 149,760
Speed Grade C7 C7 C6 C8 C7 C7
Transceivers (3.125 Gbps) Yes Yes Yes Yes Yes Yes
Embedded Memory (bits) 2,562,048 2,562,048 2,562,048 2,562,048 5,062,400 6,480,448
User I/O (max) 310 310 310 310 310 310
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C 0C to +85C 0C to +85C 0C to +85C

Key Differentiators

  • Integrated 3.125 Gbps transceivers in mid-density 49,888 LE Cyclone IV GX die (vs EP4CGX30CF19C7N)
  • Maximum density at F27 footprint (49,888 LEs) (vs EP4CGX50CF23C7N)
  • Commercial 'C7' speed grade with full speed/area optimization (vs EP4CGX50DF27C6N)

Design Notes

Estimated: At typical utilization (60-70% LEs, 50% memory, full transceiver lanes at 3.125 Gbps PRBS31), the EP4CGX50DF27C7N draws ~3.5-5 W. Design the 1.2 V VCCINT rail with a buck regulator rated for at least 6 A continuous (e.g. TPS54360DDA) and place 22uF X5R bulk plus 0.1uF + 1nF high-frequency decoupling within 5 mm of every VCC pin pair. The transceiver rails VCCPT_2P5 and VCCA need separate LDO filtering.

The 672-ball F27 FineLine BGA has a 1.0 mm ball pitch requiring microvia (laser-drilled) PCB stackup. Use at minimum a 6-layer board: signal / GND / signal / VCC / GND / signal. Route all high-speed transceiver lanes (GXB) as 100 ohm differential 8-mil traces with ground stitching vias every 0.5 wavelength. Place the transceiver AC-coupling capacitors within 5 mm of the TX ball.

Cyclone IV GX is sensitive to VCCINT ramp rate. The 1.2 V core must ramp monotonically between 0.5 ms and 100 ms; faster or slower ramps can cause in-rush latch-up. Use a soft-start DC-DC (e.g. TPS54x family) or a power-good-controlled load switch. Also: do not leave any VCC/GND ball unconnected - every ball needs a via-in-pad connection to internal planes.

For PCIe Gen2 (5 Gbps) and SATA (6 Gbps) links on the GX transceivers, follow the Altera Transceiver Link Design Guide: keep TX-to-RX trace mismatch under 20 mils, use 100 ohm +/- 10% differential impedance, and place the AC-coupling caps as close to the TX pins as possible. Reference the Cyclone IV GX Transceiver Layout Guidelines for eye-diagram tuning.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive-grade.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

EP4CGX50DF27C7N EP4CGX50DF27C7N datasheet Intel Cyclone IV GX FPGA EP4CGX50 49,888 logic elements 672-ball FBGA FPGA Cyclone IV EP4CGX50 PCIe endpoint design EP4CGX50DF27C7N vs EP4CGX110DF27C7N EP4CGX50DF27C7N drop-in replacement buy EP4CGX50DF27C7N online Cyclone IV GX transceiver layout guidelines

Related Components & Terms

Intel Altera EP4CGX50DF27C7N EP4CGX50 Cyclone IV GX FPGA field-programmable gate array logic element embedded memory M9K memory block transceiver 3.125 Gbps PCIe Gen2 FineLine BGA FBGA-672 DDR3 PHY PLL Nios II RoHS REACH PowerPlay Early Power Estimator industrial video bridging PROFINET EtherCAT
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