EP4SGX110DF29I3G vs EP4SGX110DF29C3G Comparison
Detailed side-by-side comparison of EP4SGX110DF29I3G by Intel and EP4SGX110DF29C3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX110DF29I3G | EP4SGX110DF29C3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,995.00 | $2,610.50 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 105,600 | β |
| Adaptive Logic Modules (ALM) | 41,250 | β |
| Embedded Memory Bits | 9,793,536 | β |
| Embedded Memory Blocks (M9K) | 660 | β |
| DSP Blocks | 660 (18x18 multipliers) | 266 (18x18 multipliers) |
| Maximum User I/O | 372 | β |
| Transceivers | 16 (up to 8.5 Gbps) | β |
| PCIe Hard IP | Gen2 x4 (8.5 Gbps) | β |
| Package | 780-ball FCBGA, 29x29 mm | β |
| Package Code | DF29 | β |
| Operating Temperature | -40C to +100C (Industrial I3 grade) | Commercial (0C to +85C) - per C3 grade suffix |
| Speed Grade | 3 | β |
| Mounting Type | Surface Mount | Surface Mount (Flip-Chip BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | β | 105,600 |
| Adaptive Logic Modules (ALMs) | β | 4,224 LABs |
| Total Memory Bits | β | 9,793,536 |
| User I/O Count | β | 372 |
| Package Type | β | 780-BBGA, FCBGA (Flip-Chip) |
| Package Pin/Ball Count | β | 780 |
| Supply Voltage | β | 0.9 V core |
| Transceiver Data Rate | β | Up to 8.5 Gbps |
| Transceiver Count | β | [DATA_NEEDED: number of transceivers] |