EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel
MPN: EP4SGX110DF29C3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3714.7393 | $3,714.74 |
| 10 | $3335.27 | $33,352.70 |
| 100 | $2985.61 | $298,561.00 |
| 250 | $2786.05 | $696,512.50 |
| 500 | $2610.5 | $1,305,250.00 |
EP4SGX110DF29C3G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and block RAM. Within the broader taxonomy, the Stratix IV GX sits at the high-performance end: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs allow hardware designers to implement custom digital functions after PCB assembly, enabling parallel processing, real-time DSP, and hardware-accelerated interfaces that microcontrollers and DSPs cannot match in throughput.
Key features include 4,224 adaptive logic modules (ALMs), 8.5 Gbps embedded transceivers for protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO, dedicated hard IP for PCIe Gen2 x4/x8 endpoints, and configurable on-chip memory of approximately 9.5 Mbits distributed plus dedicated M9K and M144K block RAM. The device also provides 266 dedicated DSP blocks capable of 18x18 multiplication at high clock rates, and supports I/O standards including LVDS, LVTTL, HSTL, and SSTL with selectable drive strength.
The Stratix IV GX architecture combines a fabric of ALMs with hard PCIe Gen2 IP and 8.5 Gbps transceivers, eliminating soft-IP overhead and freeing logic for application code. Compared with discrete transceiver + FPGA designs, the integrated transceivers reduce power and board area, while the 40 nm low-power process minimizes dynamic power at high toggle rates.
Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom framer/mapper ASIC prototyping, high-performance computing (HPC) co-processors, and broadcast video processing. The 780-FCBGA package supports up to 12.5 Gbps operation per channel when paired with appropriate PCB stack-up and signal conditioning.
When designing with this device, ensure adequate power-supply decoupling (multiple low-ESR ceramic capacitors near each transceiver bank) and matched-impedance routing for high-speed serial links. Verify transceiver reference clock jitter per the device handbook, and use the Quartus Prime toolchain for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternative MPNs in the same FCBGA-780 footprint, and practical design notes that go beyond the manufacturer datasheet summary. It also flags the device lifecycle and lead-time reality observed across authorized distributors in 2026.
Drop-in alternatives for EP4SGX110DF29C3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110DF29C3G (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Mounting Type, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX110DF29C3
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX110DF29C2XG
β Drop-Inβ In Stock
$1265 / Unit
View Datasheet βEP4SGX110HF35C3G
β Drop-Inβ In Stock
$3128.75 / Unit
View Datasheet βEP4SGX110DF29C3G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Logic Elements | 105,600 |
| Adaptive Logic Modules (ALMs) | 4,224 LABs |
| Total Memory Bits | 9,793,536 |
| User I/O Count | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) |
| Package Pin/Ball Count | 780 |
| Supply Voltage | 0.9 V core |
| Process Technology | 40 nm |
| Transceiver Data Rate | Up to 8.5 Gbps |
| DSP Blocks | 266 (18x18 multipliers) |
| Operating Temperature | Commercial (0C to +85C) - per C3 grade suffix |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
EP4SGX110DF29C3G 780 Pin Configuration Guide
Pin configuration for EP4SGX110DF29C3G (780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110DF29C3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110DF29C3G is suitable for 7 applications: Software-Defined Radio (SDR) Baseband, High-Speed Serial Backplane Aggregation, PCIe Gen2 Endpoint Prototyping, Telecom Framer/Mapper ASIC Prototyping, High-Performance Computing Co-Processor, Broadcast Video Processing, Industrial Test & Measurement Instrumentation.
Software-Defined Radio (SDR) Baseband
The EP4SGX110DF29C3G's 105,600 logic elements and 266 DSP blocks make it a strong match for SDR baseband signal processing. Each 18x18 multiplier block runs at up to ~550 MHz in Stratix IV GX silicon, so an FFT or channelization pipeline easily fits within the fabric while the integrated 8.5 Gbps transceivers stream digitized RF data straight from the ADC. The 9.5 Mbits of block RAM (9,793,536 bits total) hold deep capture buffers and FFT windows. The commercial C3 temperature grade suits indoor/bench SDR racks, and the 780-FCBGA package supports the high pin count required for parallel LVDS ADC interfaces.
Recommended
High-Speed Serial Backplane Aggregation
The EP4SGX110DF29C3G's hard multi-gigabit transceivers run up to 8.5 Gbps, making it suitable for aggregating multiple backplane serial lanes into a higher-order uplink. Protocols such as Serial RapidIO, XAUI, and PCIe Gen2 (5 Gbps) are supported by the Stratix IV GX hard IP, offloading the fabric from soft-implementation overhead. The 372 user I/Os provide ample margin for parallel side-band management and clock distribution. Designers typically place the DF29 package on a low-loss PCB stack-up with matched 100-ohm differential pairs and consult the Stratix IV GX PCB layout guidelines for via-in-pad and de-cap patterns.
Recommended
PCIe Gen2 Endpoint Prototyping
The EP4SGX110DF29C3G includes hard PCIe Gen2 IP supporting x1/x4/x8 endpoints, which simplifies hardware-prototype development for ASIC pre-silicon validation. Designers can map the PCIe hard IP to a free transceiver channel and use the remaining 105,600 LEs to implement application logic, including DMA engines, custom registers, or memory controllers. According to the Stratix IV GX Device Handbook, the PCIe hard IP supports MSI, MSI-X, and legacy interrupts, plus configurable BARs. Quartus Prime provides a parameterized reference design that targets the DF29 board layout in a typical x8 root-complex or endpoint card.
Recommended
Telecom Framer/Mapper ASIC Prototyping
Telecom ASIC prototypes benefit from the EP4SGX110DF29C3G's mix of high fabric density, hard transceivers, and abundant block RAM. Sonet/SDH framer state machines, GFP/LCAS mapper blocks, and ODU multiplexers can be prototyped in the 105K-LE fabric while the integrated transceivers drive OC-192/STM-64 (9.95 Gbps) class links. Although the spec caps at 8.5 Gbps, multiple lower-rate channels can be bonded. The 9.5 Mbits of embedded memory support large per-channel de-skew FIFOs needed for distributed-timing applications. The 780-FCBGA package has 372 I/Os for parallel backplane interconnect to legacy telecom ASICs.
Recommended
High-Performance Computing Co-Processor
The EP4SGX110DF29C3G serves as a compute co-processor in HPC clusters where its 266 DSP blocks accelerate matrix math, signal transforms, and convolutional networks. PCIe Gen2 x8 provides up to 4 GB/s of host-to-FPGA bandwidth, while the 9.5 Mbits of block RAM caches tile data near the multipliers. Compute kernels are typically pipelined across multiple LABs and DSP blocks, achieving high throughput at low latency. The 780-FCBGA package supports thermal designs up to ~25 W with proper PCB thermal relief. Quartus Prime DSP Builder and OpenCL for FPGA accelerate software-style development for compute kernels.
Recommended
Broadcast Video Processing
The EP4SGX110DF29C3G's logic and DSP resources fit broadcast video pipelines such as 3G-SDI switching, multi-stream up/down/cross conversion, and real-time chroma-key overlays. 3G-SDI operates at 2.97 Gbps, well within the 8.5 Gbps transceiver capability, and parallel TTL/LVDS I/O can drive HD-SDI inputs from external serializers. The 372 user I/Os are sufficient for multi-channel parallel video buses plus side-band metadata. Designers typically use Quartus Prime video IP and reference designs that target the DF29 board layout to streamline evaluation board bring-up.
Recommended
Industrial Test & Measurement Instrumentation
The EP4SGX110DF29C3G is well suited for high-channel-count oscilloscopes, logic analyzers, and protocol analyzers. Its 8.5 Gbps transceivers handle PCIe, USB 3.0, SATA, and proprietary LVDS links used in mixed-signal test gear, while the 9.5 Mbits of embedded memory buffer deep acquisition records. The 105,600 LEs implement waveform DSP, triggering, and protocol decode engines. The commercial C3 temperature grade covers indoor lab and factory-floor use, and the 780-FCBGA package provides the high pin count required for parallel probe interfaces. Quartus Prime supports instrument IP and reference waveforms.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110DF29C3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110DF29C3 | EP4SGX110DF29C2XG | EP4SGX110HF35C3G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA (DF29, 29x29 mm) | 780-FCBGA (DF29, 29x29 mm) | 780-FCBGA (DF29, 29x29 mm) | 780-FCBGA (HF35, 35x35 mm) |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 |
| Memory Bits | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 |
| User I/O | 372 | 372 | 372 | 372 |
| Transceiver Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
| Temperature Grade | Commercial (0C to +85C, C3 speed) | Commercial (0C to +85C, C3 speed) | Commercial (0C to +85C, C2 speed - slower) | Commercial (0C to +85C, C3 speed) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm |
Key Differentiators
- Hard multi-gigabit transceivers in commercial-grade silicon (vs EP4CGX110DF27C8N)
- C3 speed grade for tighter timing margins (vs EP4SGX110DF29C2XG)
- Identical silicon density and memory (vs EP4SGX230FF35C3G)
Design Notes
The 780-FCBGA DF29 package is a flip-chip land-grid-array with very fine pitch. According to Intel/Altera PCB design guidelines, use a 12-layer or 14-layer stack-up with low-loss dielectrics (Df less than 0.005) for 8.5 Gbps channels. Place decoupling capacitors on the bottom side directly under the package BGA field. Use via-in-pad (VIP) for high-speed transceivers and route 100-ohm differential pairs with controlled impedance; keep intra-pair skew under 5 mils and inter-pair skew under 25 mils to meet 8.5 Gbps jitter masks.
The Stratix IV GX EP4SGX110 draws up to ~15-20 W in typical 8.5 Gbps operation. The DF29 780-FCBGA junction-to-ambient thermal resistance is package-dependent; consult the Stratix IV GX Device Handbook for the per-package theta_JA. For a 4-layer FR-4 board with adequate copper pour, expect ~85-90 percent of typical applications to operate within the C3 commercial-grade thermal envelope without a heatsink. Add a small heatsink or active airflow if the design is fully populated with active transceivers at maximum toggle rates.
Power sequencing for the Stratix IV GX EP4SGX110 must follow the order specified in the device handbook. According to Intel/Altera power-supply guidelines, ramp VCC (core) before VCCPD (I/O pre-driver) before VCCIO (I/O supply) to avoid latch-up. Use a low-noise LDO or DC-DC converter with a 1 percent or better reference for VCC; noise above 50 mVpp on VCC can degrade transceiver jitter. Place bulk tantalum or polymer capacitors near each supply pin group and add 0.1 uF / 1 nF ceramic de-caps in parallel for high-frequency decoupling.
Transmitter pre-emphasis and receiver equalization must be configured per the Stratix IV GX transceiver user guide for 8.5 Gbps operation. According to the device handbook, use the Transceiver Toolkit in Quartus Prime to tune pre-emphasis taps and adaptive equalization against an actual channel; never rely solely on simulation. Maintain AC-coupling capacitors (typically 100 nF) in series with each serial differential pair as required by the protocol. Observe the reference-clock jitter budget (typically less than 1 ps RMS for 8.5 Gbps links) per the Quartus Prime timing analyzer report.
Compliance Information
RoHS/REACH status for the EP4SGX110DF29C3G is not stated in the verified distributor data; refer to the manufacturer declaration for confirmation. The commercial C3 temperature grade precludes AEC-Q100 qualification - choose I3/I7 variants for industrial-grade designs.
