EP4SGX360FF35I3 vs EP4SGX360FF35C4 Comparison
Detailed side-by-side comparison of EP4SGX360FF35I3 by Intel and EP4SGX360FF35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,695.00 | $5,189.41 |
| Series | Stratix IV GX | β |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | β |
| LABs/CLBs | 14,144 | β |
| Total RAM Bits | 23,105,536 | 23105536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | β |
| User I/O Count | 564 | β |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | β |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | 8 |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | β |
| Number of PLLs | [DATA_NEEDED: PLL count] | β |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Operating Temperature | -40C to +100C | 0C to +85C (commercial) |
| Package | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (flip-chip) |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | I3 | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| MSL Level | [DATA_NEEDED: MSL] | 3 (per JEDEC J-STD-020) |
| Logic Elements | β | 353600 |
| Number of LABs/CLBs | β | 14144 |
| Number of I/O | β | 564 |
| Lead-Free | β | Yes (per BGA finish) |
| Supplier Device Package | β | 1152-FBGA |