EP4SGX360FF35I3 - Stratix IV GX 353.6K LE FPGA | Intel
MPN: EP4SGX360FF35I3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2280 | $22,800.00 |
| 100 | $1995 | $199,500.00 |
| 500 | $1820 | $910,000.00 |
| 1,000 | $1695 | $1,695,000.00 |
EP4SGX360FF35I3 Overview
An FPGA is a reprogrammable integrated circuit whose logic function is defined by a configuration bitstream rather than fixed masks. The Stratix IV GX family extends this concept by combining general-purpose logic fabric with hardened transceivers, PCIe hard IP blocks, and dedicated DSP blocks, positioning it between pure software processors and fixed-function ASICs in the silicon hierarchy: FPGA -> programmable logic -> reconfigurable compute -> semiconductor. This architecture enables hardware-level parallelism for signal processing pipelines without the NRE cost of ASIC tape-outs.
Key features of the EP4SGX360FF35I3 include 8.5-Mb embedded memory distributed across M9K and M144K blocks, multi-gigabit transceivers capable of up to 8.5 Gbps data rates, eight PLL regions for clock synthesis, and an industrial temperature grade rated from -40C to +100C. The Flip-Chip FBGA package provides the high-pin-count, low-inductance interconnect required for transceiver-heavy designs operating at multi-gigabit line rates.
Typical applications include Software Defined Radio (SDR), wireline backhaul, baseband processing, high-performance computing accelerators, and broadcast video systems. The wide operating temperature range and integrated transceivers also make it suitable for industrial imaging and test-and-measurement equipment where deterministic latency and parallel DSP throughput are required.
When designing with this device, ensure the PCB ball escape pattern meets the 1.0 mm pitch BGA layout rules and that transceiver channels are routed with controlled-impedance differential pairs to comply with the Stratix IV GX PCB guidelines.
Drop-in alternatives for EP4SGX360FF35I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FF35I3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360FF35C3N
✅ Drop-In✓ In Stock
$7610 / Unit
View Datasheet →EP4SGX360FF35C4N
✅ Drop-In✓ In Stock
$3550 / Unit
View Datasheet →EP4SGX360FF35C4
✅ Drop-In✓ In Stock
$5189.41 / Unit
View Datasheet →EP4SGX360FF35C3
✅ Drop-In✓ In Stock
$2285 / Unit
View Datasheet →EP4SGX360HF35I3G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX360FF35C2XN
✅ Drop-In✓ In Stock
$2600 / Unit
View Datasheet →EP4SGX360FF35I3 Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| LABs/CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| User I/O Count | 564 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Temperature | -40C to +100C |
| Package | 1152-BBGA, FCBGA (Flip-Chip) |
| Mounting Type | Surface Mount |
| Speed Grade | I3 |
EP4SGX360FF35I3 1152-bbga, fcbga (flip-chip) Pin Configuration Guide
Pin configuration for EP4SGX360FF35I3 (1152-bbga, fcbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FF35I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FF35I3 is suitable for 7 applications: Software Defined Radio (SDR), Military Radar and Signal Intelligence, Wireline Backhaul and High-Speed Serial Aggregation, ASIC Prototyping and Emulation, Broadcast Video Processing and Display Walls, High-Performance Computing and Hardware Acceleration, Medical Imaging and Diagnostic Equipment.
Software Defined Radio (SDR)
The EP4SGX360FF35I3 is well-suited for Software Defined Radio baseband processing where its 353,600 logic elements and 23.1 Mbit embedded RAM can host wideband FFT engines and channelizer filters in parallel. The integrated multi-gigabit transceivers (up to 8.5 Gbps) enable direct ADC-to-FPGA links for LTE and 5G NR base stations, while the 564 user I/Os expose the wide parallel datapath needed for IQ sample handling. Designers typically pair the FPGA with external DDR3 memory for buffering and an RF front-end ADC such as the AD9625 or ADC12J2700. Estimated: with 100% transceiver utilization and industrial temperature operation, the Stratix IV GX delivers deterministic latency below 5 microseconds per pipeline stage, which is critical for low-latency control loops in cognitive-radio platforms.
Recommended
Military Radar and Signal Intelligence
For military radar, ESM, and ELINT applications, the EP4SGX360FF35I3 provides the logic density required to implement adaptive beamforming, pulse compression, and direction-finding algorithms in a single device. The 40 nm Stratix IV GX architecture offers radiation-tolerant design options when paired with industrial-grade packaging, and the 564 I/O count supports high-channel-count antenna arrays. Embedded DSP blocks accelerate FFT and matrix inversion operations that are computationally intensive in real-time signal intelligence. The industrial -40C to +100C temperature rating allows deployment in unconditioned outdoor and avionics enclosures.
Recommended
Wireline Backhaul and High-Speed Serial Aggregation
The EP4SGX360FF35I3 integrates up to 24 multi-gigabit transceivers supporting CPRI, OBSAI, and 10G Ethernet protocols used in cellular backhaul equipment. With 564 user I/Os and 23 Mbit embedded RAM, the device can aggregate multiple SFP+ and QSFP optical modules while performing Layer-2 switching and timing synchronization. The 0.9 V core minimizes dynamic power, and the FCBGA package ensures signal-integrity compliance at line rates up to 8.5 Gbps. Designers typically implement CPRI front-haul with the FPGA plus an external OTN framer such as the NXP MSC8156.
Recommended
ASIC Prototyping and Emulation
The EP4SGX360FF35I3's 353,600 logic elements provide sufficient capacity to prototype ASIC designs containing 5-10 million gates when combined with partition-based synthesis. The Flip-Chip FBGA package offers generous pin counts for multi-FPGA debug and emulation systems, and the integrated transceivers allow prototyping of high-speed SerDes interfaces. Quartus Prime software supports time-domain multiplexing across multiple Stratix IV devices, making the EP4SGX360FF35I3 a common element in commercial emulation platforms such as the Synopsys ZeBu and Cadence Palladium families.
Recommended
Broadcast Video Processing and Display Walls
Broadcast video processing systems use the EP4SGX360FF35I3 to perform real-time color-space conversion, scaling, and genlocking across multiple video streams at resolutions up to 4K. The device's 564 I/Os accept SDI, HDMI, and DisplayPort inputs simultaneously, while embedded RAM buffers full frames for cross-stream compositing. The industrial temperature grade supports outdoor LED display-wall controllers and broadcast OB vans where thermal management is constrained. Estimated: a single EP4SGX360FF35I3 can process eight 3G-SDI streams with one frame of buffering at 60 Hz each.
Recommended
High-Performance Computing and Hardware Acceleration
High-performance computing nodes use the EP4SGX360FF35I3 as a hardware accelerator for low-latency trading, scientific simulation, and database query acceleration. The 23 Mbit embedded RAM supports large lookup tables for HFT order-book caching, and the multi-gigabit transceivers provide direct PCIe Gen2 x8 connectivity to host CPUs via hard IP blocks. The industrial temperature grade suits colocation data-center deployments where intake air temperatures can exceed 35C. Pairing the FPGA with a QDR-II+ SRAM network enables sub-microsecond access latency for in-memory analytics.
Recommended
Medical Imaging and Diagnostic Equipment
In medical imaging modalities such as ultrasound, CT, and MRI, the EP4SGX360FF35I3 performs real-time beamforming, image reconstruction, and DICOM-compliant processing pipelines. The 353,600 logic elements are sufficient to host a complete front-end channelizer for 128-channel ultrasound at 40 MHz per channel, while embedded RAM holds line buffers for back-projection. The industrial temperature grade and high-reliability Flip-Chip FBGA package support long-life medical equipment deployments where field upgrades are impractical. Estimated: a single EP4SGX360FF35I3 can process 256 ultrasound channels at 30 fps with 16-tap apodization.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FF35I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FF35C3N | EP4SGX360FF35C4N | EP4SGX360HF35I3G | EP4SGX360FF35C2XN |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/O Count | 564 | 564 | 564 | 564 | 564 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | I3 | C3 (faster) | C4 (faster) | I3 (HF bin) | C2 (slower) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-speed industrial-temperature variant in the Stratix IV GX FF35 package (vs EP4SGX360FF35C3N)
- Same die and package as the C3N/C4N commercial variants, simplifying migration (vs EP4SGX360FF35C4N)
- Wider logic capacity vs lower-cost Stratix IV E devices (vs EP4SE530H35C4N)
Design Notes
The 1152-ball Flip-Chip FBGA package uses a 1.0 mm ball pitch and requires a multilayer PCB with laser-drilled microvias for fan-out routing. Use at least 8 PCB layers with dedicated ground and power planes directly beneath the BGA. Route the multi-gigabit transceiver channels as 100-ohm differential pairs with continuous reference planes; per the Stratix IV GX PCB guidelines, target a maximum trace length mismatch of 150 mil between P and N for 8.5 Gbps operation.
Estimated: with all 24 transceivers active at 8.5 Gbps, the Stratix IV GX consumes approximately 8-12 W from the 0.9 V core. The FCBGA package exposes a thermal lid, which should be bonded to a heatsink with thermal-interface material rated for at least 3 W/m-K. In enclosed chassis, provide at least 200 LFM airflow to keep the junction below 100C; derate by 10% for every 1000 m altitude above sea level.
Separate digital I/O banks from the transceiver (XCVR) banks by at least 100 mil of ground-copper moat. Provide independent decoupling for each bank: 0.1 uF X7R capacitors within 100 mil of every VCCIO/VCCPT/VCCAUX pin, plus bulk 22 uF and 100 uF tantalum or polymer capacitors. The PLL analog supply (VCCA_PLL) requires a ferrite bead and an additional 10 uF decoupling capacitor for noise isolation.
Do not confuse the Stratix IV GX (with transceivers) and Stratix IV E (without transceivers) families - they are pin-incompatible at the same FF35 ball map for some variants. Also verify the speed-grade suffix: I3 denotes the slowest industrial bin, while C3/C4 are commercial-only faster bins. Mismatched temperature grade is a common reason for field failures.
Compliance Information
RoHS, REACH, lead-free and halogen-free status not explicitly stated in the verified web data for the EP4SGX360FF35I3. Conflict Minerals compliance per Intel's CMRT filings. AEC-Q100 is not applicable for an FPGA of this class.
