EP4SGX360HF35C2 vs EP4SGX360HF35C2N Comparison
Detailed side-by-side comparison of EP4SGX360HF35C2 by Intel and EP4SGX360HF35C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 β Active
Specification Comparison
| Parameter | EP4SGX360HF35C2 | EP4SGX360HF35C2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,750.00 | $3,295.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | 353,600 | β |
| LABs/CLBs | 14,144 | β |
| Number of I/O | 564 (max 532 user I/O) | 564 |
| Embedded Memory (bits) | 23,105,536 | β |
| Number of Logic Cells | 353,600 | β |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm CMOS |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | β |
| Package Type | 1152-pin FC-FBGA | β |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | β |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration | JTAG / Active Serial (external config device) | β |
| Design Tool | Quartus II / Quartus Prime | β |
| Number of Logic Elements/Cells | β | 353,600 |
| Number of LABs/CLBs | β | 14,144 |
| Total RAM Bits | β | 23,105,536 |
| DSP Performance | β | 800 MHz |
| Package | β | 1152-BBGA, FCBGA (HF35) |
| Lead Free | β | Yes |
| Speed Grade | β | 35 (HF35) |
| Power/Temperature Grade | β | C2 |
| Embedded Transceivers | β | Yes (multi-gigabit) |
| DSP Blocks | β | Yes (variable-precision) |