EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
MPN: EP4SGX360HF35C2 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12120.2 | $12,120.20 |
| 10 | $11500 | $115,000.00 |
| 50 | $10800 | $540,000.00 |
| 100 | $10250 | $1,025,000.00 |
| 500 | $9750 | $4,875,000.00 |
EP4SGX360HF35C2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be reconfigured by the designer after manufacture. In the system hierarchy it sits above fixed-function ASICs and below general-purpose microcontrollers for parallel data-path tasks: FPGAs deliver deterministic latency, massive parallelism, and on-chip high-speed transceivers, which makes them a sub-category of programmable logic devices within the broader semiconductor landscape.
The EP4SGX360HF35C2 delivers up to 532 user I/O pins, 18x18-bit hardware multipliers, and dedicated transceiver channels supporting protocols such as PCI Express Gen1/Gen2, XAUI, CEI-6G, Serial RapidIO, and 1G/10G Ethernet. The 40 nm process technology and 0.9 V core voltage provide a balance of high performance and moderate power for compute-intensive designs, while the Flip-Chip BGA substrate supports the high pin count and signal-integrity requirements of multi-gigabit serial links.
Typical applications include high-speed data acquisition and processing cards, telecom backplane bridging, ASIC prototyping, military and aerospace signal processing, and high-performance DSP pipelines. The transceiver-rich architecture makes it particularly suitable for systems that aggregate and switch multiple 1G/10G Ethernet links or drive FPGA Mezzanine Card (FMC) sites. The HF35 package variant is rated for commercial (0C to +85C) ambient operation and is targeted at mainstream high-density designs.
When designing with this FPGA, allocate sufficient PCB layers for the 1152-ball FCBGA (typically 12+ layers with buried vias), include multiple decoupling capacitor values near the balls, and follow Altera/Intel power-tree guidelines for the 0.9 V core rail. Programming is supported via JTAG or the Active Serial configuration scheme using an external configuration device; Quartus II or Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Stratix IV GX family alternatives, comparison data, and practical design notes not found in the manufacturer datasheet alone, giving buyers and engineers a faster path to component selection and PCB bring-up.
Drop-in alternatives for EP4SGX360HF35C2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360HF35C2 (same form factor and footprint) β differing in Package, Speed Grade, Family, Operating Temperature, DSP Blocks.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX360HF35C2X
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EP4SGX360HF35C2N
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$3295 / Unit
View Datasheet βEP4SGX360HF35C3N
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$1180 / Unit
View Datasheet βEP4SGX360HF35C4N
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$3700 / Unit
View Datasheet βEP4SGX360HF35I3N
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$1925 / Unit
View Datasheet βEP4SGX360HF35C2 Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV GX FPGA |
| Logic Elements (LEs) | 353,600 |
| LABs/CLBs | 14,144 |
| Number of I/O | 564 (max 532 user I/O) |
| Embedded Memory (bits) | 23,105,536 |
| Number of Logic Cells | 353,600 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Type | 1152-pin FC-FBGA |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| RoHS Status | Compliant |
| Configuration | JTAG / Active Serial (external config device) |
| Design Tool | Quartus II / Quartus Prime |
EP4SGX360HF35C2 hf35 (35x35 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4SGX360HF35C2 (hf35 (35x35 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360HF35C2.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360HF35C2 is suitable for 6 applications: 10G/40G Ethernet Aggregation Card, ASIC Prototyping Platform, High-Channel-Count DSP Pipeline, Industrial Video Broadcast Switcher, Test & Measurement Instrumentation, Aerospace & Defense Signal Processing.
10G/40G Ethernet Aggregation Card
The EP4SGX360HF35C2 is well-suited for line-card aggregation in telecom and data-center platforms where 10G Ethernet uplinks must be merged into higher-bandwidth fabric links. Its integrated multi-gigabit transceivers support XAUI and 10G Ethernet physical interfaces, while the 23,105,536 bits of embedded memory enable deep packet-buffer queues and statistics counters without external RLDRAM. With 353,600 logic elements the FPGA can run custom MAC and traffic-management pipelines alongside the transceiver cores. Designers typically place the device on a high-layer-count PCB adjacent to QSFP+ cages and route controlled-impedance differential lanes per the Stratix IV GX handbook recommendations for transceiver signal integrity. The result is a deterministic-latency aggregation stage that offloads the host CPU.
Recommended
ASIC Prototyping Platform
The EP4SGX360HF35C2 is widely deployed as a multi-FPGA ASIC prototyping substrate because it provides 353,600 logic elements plus transceivers that can partition and bridge a large ASIC netlist across multiple devices. The HF35 1152-ball FC-FBGA exposes 564 user I/Os, allowing dense TDM interconnect between FPGAs on the prototyping board to emulate the target ASIC pin-out. The embedded 23 Mbit of block memory and on-chip DSP blocks map efficiently to most ASIC compute cores. A typical bring-up flow uses Quartus Prime for synthesis and TimeQuest for timing closure, then maps the bitstream onto daughter cards. Compared to custom ASICs, this approach cuts prototype lead-time from months to weeks at higher per-unit cost.
Recommended
High-Channel-Count DSP Pipeline
The EP4SGX360HF35C2 is a strong fit for digital signal processing chains such as radar baseband processing, software-defined radio channelizers, and medical imaging front ends. The 40 nm architecture pairs 18x18-bit hardware multipliers with on-chip block RAM to deliver 18x18 MAC throughput well into the GMACS range, while the 0.9 V core keeps dynamic power manageable. Multi-gigabit transceivers move raw ADC samples into the device at line rate, and 564 user I/Os feed downstream DACs or host interfaces. Engineers typically instantiate FFT/iFFT cores, polyphase filter banks, or beamforming weights in the FPGA fabric and pair it with high-speed ADCs like the AD9680. The result is a deterministic, low-latency DSP pipeline that outperforms general-purpose DSPs on parallel kernels.
Recommended
Industrial Video Broadcast Switcher
The EP4SGX360HF35C2 is frequently chosen for broadcast video switchers and routers that must transport SDI, HDMI, and DisplayPort streams in parallel. Its 353,600 logic elements can implement multiple scalers, color-space converters, and audio embedders in a single device, and the 23 Mbit of block memory store frame buffers for cross-point switching. The transceivers drive 3G/HD-SDI links directly via external cable drivers, while the 564 I/Os accommodate HDMI/DisplayPort TMDS channels and audio I/O. Broadcast vendors favor this part because it can ingest 4K signals in real time without dropping frames and integrates format conversion, genlocking, and audio shuffling in one fabric. The HF35 commercial temperature grade is sufficient for controlled studio environments.
Recommended
Test & Measurement Instrumentation
The EP4SGX360HF35C2 is a popular FPGA core for high-end oscilloscopes, logic analyzers, and protocol analyzers where parallel sample acquisition and on-the-fly analysis are required. Its multi-gigabit transceivers can pull samples directly from high-speed ADC front ends at rates up to several Gsps, while 353,600 logic elements run trigger engines, decoders, and display pipelines in parallel. The 23 Mbit of block memory acts as deep acquisition buffer and decouples the trigger logic from the display refresh path. The HF35 35x35 mm BGA package provides ample ground and power balls for the cleanest possible signal-integrity stack-up. Compared to discrete DSP+CPU solutions, this FPGA delivers deterministic trigger latency that traditional processors cannot match.
Recommended
Aerospace & Defense Signal Processing
The EP4SGX360HF35C2 is used in avionics, electronic warfare, and secure communications subsystems where deterministic latency and on-chip encryption acceleration are needed. The 40 nm process delivers a balance of high logic density, military-grade reliability, and reasonable power for SWaP-constrained platforms, while the integrated transceivers link the device to RF converters and other FPGAs over rapidIO or 10G Ethernet. Designers appreciate the Altera/Intel cryptography IP (AES, SHA) that can be paired with the logic fabric to build inline encryption without external accelerators. For harsh-environment applications the industrial-grade EP4SGX360HF35I3N variant extends the temperature range, while the commercial HF35 grade suits aircraft-cabin and ground-station equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360HF35C2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360HF35C2X | EP4SGX360HF35C2N | EP4SGX360HF35C3N | EP4SGX360HF35C4N | EP4SGX360HF35I3N |
|---|---|---|---|---|---|---|
| Package | 1152-pin FC-FBGA (HF35, 35x35 mm) | 1152-pin FC-FBGA (HF35, 35x35 mm) - same | 1152-pin FC-FBGA (HF35, 35x35 mm) - same | 1152-pin FC-FBGA (HF35, 35x35 mm) - same | 1152-pin FC-FBGA (HF35, 35x35 mm) - same | 1152-pin FC-FBGA (HF35, 35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/O | 564 | 564 | 564 | 564 | 564 | 564 |
| Speed Grade | C2 (-2 fastest bin) | C2X (extended, same speed) | C2N (lead-free) | C3 (-1 bin slower) | C4 (-2 bin slowest) | I3 (industrial, -1 bin slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lead-Free Finish | Yes | Yes | Yes (N-suffix explicitly lead-free) | Yes (N-suffix explicitly lead-free) | Yes (N-suffix explicitly lead-free) | Yes (N-suffix explicitly lead-free) |
Key Differentiators
- Highest-density Stratix IV GX in commercial C2 speed grade (vs EP4SGX360HF35C3N)
- Trades temperature range for speed bin (vs EP4SGX360HF35I3N)
- Same die and package footprint across all speed grades (vs EP4SGX360HF35C4N)
Design Notes
The 1152-ball FC-FBGA package requires a high-layer-count PCB (12+ layers typical) with microvias or stacked microvias to fan out the 1.0 mm ball pitch. Estimated: 12 signal/ground layers plus dedicated core, PLL, and transceiver supply planes are typically needed for a clean power-delivery network. Use the Stratix IV GX handbook pin-out tables to assign ball-side escape routing, and allocate continuous ground stitching vias every 2-3 balls along the periphery to control return-current paths for multi-gigabit lanes.
Power delivery must follow Altera's Stratix IV PowerPlay recommendations: a dedicated 0.9 V core plane with 30+ bulk MLCC capacitors (220 uF polymer + 22 uF/10 uF/1 uF ceramics) per device is typical. Estimated: the 40 nm core at full utilization draws 8-15 W depending on toggle rate; pair with a multi-phase PWM controller such as the LTM4676 or ISL6549. Transceiver and I/O rails must be sequenced per the handbook; failure to sequence may trigger inrush currents that latch-up the device.
Multi-gigabit transceiver channels demand tightly coupled 100-ohm differential routing with length matching within 5 mils of intra-pair mismatch and within 150 mils of inter-pair mismatch. Estimated: 10-15 cm maximum trace length per lane to keep within the Stratix IV GX pre-emphasis and equalization budget. Use the Altera MegaWizard or transceiver toolkit to tune TX de-emphasis and RX CTLE per channel after PCB fab. Avoid routing non-transceiver signals through the transceiver ball rows to keep reference-plane continuity intact.
Compliance Information
RoHS compliance per Intel/Altera product page. Lead-free finish on C2N/C3N/C4N/I3N N-suffix variants explicitly confirmed. AEC-Q100 not applicable - this is a high-end FPGA, not an automotive-grade IC.
