EP4SGX360KF40C2 vs EP4SGX360HF35C2 Comparison
Detailed side-by-side comparison of EP4SGX360KF40C2 by Intel and EP4SGX360HF35C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 β ActiveSpecification Comparison
| Parameter | EP4SGX360KF40C2 | EP4SGX360HF35C2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,400.00 | $9,750.00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | β |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | β |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | β |
| User I/O Count | 744 | β |
| Transceiver Count | Up to 24 | β |
| Max Transceiver Data Rate | 8.5 Gbps | β |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | β |
| DSP Blocks | 1,040 (variable precision) | β |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | β |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Package | 1517-ball FCBGA, 42.5 x 42.5 mm | β |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| MSL Level | MSL3 (per JEDEC J-STD-020) | β |
| RoHS Status | Compliant | Compliant |
| Series | β | Stratix IV GX |
| Logic Elements (LEs) | β | 353,600 |
| LABs/CLBs | β | 14,144 |
| Number of I/O | β | 564 (max 532 user I/O) |
| Embedded Memory (bits) | β | 23,105,536 |
| Number of Logic Cells | β | 353,600 |
| Transceivers | β | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Type | β | 1152-pin FC-FBGA |
| Package Code | β | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | β | JTAG / Active Serial (external config device) |
| Design Tool | β | Quartus II / Quartus Prime |