EP4SGX530HH35C3 vs EP4SGX530HH35C4 Comparison
Detailed side-by-side comparison of EP4SGX530HH35C3 by Intel and EP4SGX530HH35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35C3 | EP4SGX530HH35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,398.00 | $3,120.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | β |
| Logic Elements (LE) | 531,200 | β |
| LABs / CLBs | 21,248 | β |
| Total RAM Bits | 28,033,024 | β |
| User I/O Count | 564 | β |
| Package | 1152-BBGA / FCBGA (HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Core Voltage | 0.87 V to 0.93 V | β |
| Process Technology | 40 nm CMOS | 40 nm |
| Transceivers | 24 channels, up to 8.5 Gbps | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | 1024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Operating Temperature | 0C to +85C (Commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | C3 | HH35 |
| Mounting Type | Surface Mount | Surface Mount (flip-chip BGA) |
| RoHS Status | Compliant | Compliant |
| Device Type | β | FPGA |
| Logic Elements | β | 531,200 |
| Adaptive Logic Modules (ALMs) | β | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | β | 28,033,024 |
| Maximum User I/O Pins | β | 564 |
| Core Supply Voltage | β | 0.9 V |
| PLLs | β | 8 fractional PLLs |
| MSL Level | β | MSL3 (per BGA package standard) |