EP4SGX530HH35C3 - 531K LE Stratix IV GX FPGA, 564 I/O | Intel
MPN: EP4SGX530HH35C3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3465 | $34,650.00 |
| 100 | $3080 | $308,000.00 |
| 500 | $2730 | $1,365,000.00 |
| 1,000 | $2398 | $2,398,000.00 |
EP4SGX530HH35C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, I/O cells, and on-chip memory that the designer can reconfigure after manufacturing. Within the broader taxonomy, the EP4SGX530HH35C3 sits at the top of the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. Stratix IV GX specifically targets applications that require both massive parallel logic capacity and multi-gigabit transceivers on a single die.
Key features include 24 full-duplex CDR-capable transceivers with embedded 8B/10B encoders/decoders compliant with IEEE 802.3-2005 Gigabit Ethernet, ±100 ppm clock compensation, and receiver synchronization state machines. The device integrates hard PCIe Gen1/Gen2 IP blocks, up to 1024 multiplier blocks (18x18) for DSP, and PLLs with fractional-N support. Hard memory controllers and 4.5 Mb of TriMatrix embedded memory per logic array block deliver deterministic low-latency data movement.
Architecturally, Stratix IV GX uses a 40nm low-power CMOS process with adaptive logic modules (ALMs) that implement 8-input fracturable look-up tables, providing an effective 1.4x density gain over previous generations. The transceiver tiles support a wide range of serial protocols including PCIe Gen2 x8, XAUI, Serial RapidIO, and 10G KR backplanes.
Typical applications include 40G/100G optical line-card prototyping, radar and DSP front-ends, ASIC prototyping emulators, and high-frequency trading accelerator cards. The combination of transceivers, DSP blocks, and abundant external memory bandwidth makes this device well-suited to signal-processing workloads.
A key design consideration is PCB layout: the 1152-ball FCBGA requires a multi-layer board with microvia stacks, controlled-impedance transceiver channels, and careful power-plane decoupling to meet 8.5 Gbps signal-integrity margins. Reference the Intel Stratix IV GX Handbook for transceiver channel simulation methodology.
This page synthesizes distributor pricing, drop-in same-family Stratix IV GX alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX530HH35C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35C3 (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530HH35C2N
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →EP4SGX530HH35C2
✅ Drop-In✓ In Stock
$4500 / Unit
View Datasheet →EP4SGX530HH35C3N
✅ Drop-In✓ In Stock
$13200 / Unit
View Datasheet →EP4SGX530HH35I3N
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →EP4SGX530HH35I4N
✅ Drop-In✓ In Stock
$2990 / Unit
View Datasheet →EP4SGX530HH35C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV |
| Logic Elements (LE) | 531,200 |
| LABs / CLBs | 21,248 |
| Total RAM Bits | 28,033,024 |
| User I/O Count | 564 |
| Package | 1152-BBGA / FCBGA (HFBGA) |
| Core Voltage | 0.87 V to 0.93 V |
| Process Technology | 40 nm CMOS |
| Transceivers | 24 channels, up to 8.5 Gbps |
| DSP Blocks | 1024 (18x18 multipliers) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C3 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4SGX530HH35C3 1152-bbga / fcbga (hfbga) Pin Configuration Guide
Pin configuration for EP4SGX530HH35C3 (1152-bbga / fcbga (hfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35C3 is suitable for 6 applications: 40G/100G Optical Line-Card Prototyping, Radar and DSP Front-End Processing, ASIC Prototyping and Emulation, High-Frequency Trading Accelerator, Broadcast Video Processing and Conversion, Industrial Test and Measurement Instrumentation.
40G/100G Optical Line-Card Prototyping
The EP4SGX530HH35C3 fits 40G/100G optical line-card prototyping because its 24 multi-gigabit transceivers at up to 8.5 Gbps can be aggregated via gearbox logic to drive QSFP+ and CFP modules. With 531,200 logic elements and 28,033,024 bits of embedded RAM, the device absorbs MAC framing, FEC, and packet-buffer functions on-die. Placed as the central FPGA between OTN framer ASICs and the optical module, it eliminates an external TCAM and reduces BOM cost, while Quartus Prime IP library provides IEEE 802.3ba-compliant cores for rapid bring-up.
Recommended
Radar and DSP Front-End Processing
The EP4SGX530HH35C3 suits radar and DSP front-end processing due to its 1024 dedicated 18x18 multiplier blocks delivering up to ~300 GMACs of DSP throughput at full parallelism. Combined with the 28 Mb TriMatrix embedded memory for sample buffering, the FPGA can host FFT, pulse compression, and MTI filter chains for phased-array radar receivers. Designers pair the FPGA with multi-GSps ADC daughtercards via the transceiver channels, using the FPGA's PLLs for low-jitter sample-clock generation.
Recommended
ASIC Prototyping and Emulation
The EP4SGX530HH35C3 is well-suited to ASIC prototyping because 531,200 logic elements and 21,248 LABs/CLBs can map large ASIC partitions with high utilization efficiency, while 28 Mb of embedded RAM models wide register files and FIFOs. Designers use multi-FPGA partitioning with the transceiver channels providing high-bandwidth chip-to-chip bridges for ASIC prototypes exceeding 5M gates. Quartus Prime's TimeQuest timing analysis and Chip Planner floorplan tools allow predictable multi-FPGA timing closure at sub-100 MHz target frequencies.
Recommended
High-Frequency Trading Accelerator
The EP4SGX530HH35C3 fits high-frequency trading accelerator cards where its 24 transceivers ingest market-data feeds and 1024 DSP 18x18 multipliers crunch order-book analytics at sub-microsecond latency. The 28 Mb embedded RAM provides deterministic on-die book-keeping that bypasses external memory's variable latency. Compared to a CPU/SoC solution, the FPGA delivers deterministic latency (clock-cycle stable) and parallel pipelined processing for strategy execution, often integrated with 10G KR links for direct market-data connectivity.
Recommended
Broadcast Video Processing and Conversion
The EP4SGX530HH35C3 suits broadcast video processing where its 531,200 logic elements implement multi-stream SD/HD/3G-SDI and SMPTE 2022 IP cores simultaneously, while the 1024 DSP blocks accelerate chroma upsampling and deinterlacing pipelines. The 564 user I/O pins aggregate multiple BNC interface channels and HDMI/DisplayPort bridges on a single device, simplifying backplane fan-out. Embedded RAM buffers line-rate video frames without external DDR, which reduces BOM cost and board area in broadcast-engineering deployments.
Recommended
Industrial Test and Measurement Instrumentation
The EP4SGX530HH35C3 is well-matched to industrial test and measurement instrumentation requiring 8.5 Gbps transceiver connectivity for high-speed digitizer data ingest, with 1024 DSP blocks for real-time FFT and correlation computations. The 28 Mb embedded RAM holds deep capture windows while the 564 user I/O pins connect to parallel DAC/ADC interfaces. Compared to discrete DSP+ASIC designs, this FPGA integrates triggering, signal conditioning, and protocol decoding on a single die, with Quartus Prime providing model-based DSP Builder integration for filter design.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35C2N | EP4SGX530HH35C2 | EP4SGX530HH35C3N | EP4SGX530HH35I3N | EP4SGX530HH35I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA / FCBGA (HFBGA) | 1152-BBGA / FCBGA - same | 1152-BBGA / FCBGA - same | 1152-BBGA / FCBGA - same | 1152-BBGA / FCBGA - same | 1152-BBGA / FCBGA - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Total RAM Bits | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| Speed Grade | C3 | C2 (slower) | C2 (slower) | C3 (same) | I3 (industrial) | I4 (industrial, faster) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| User I/O Count | 564 | 564 | 564 | 564 | 564 | 564 |
| Transceiver Channels | 24 (up to 8.5 Gbps) | 24 (up to 8.5 Gbps) | 24 (up to 8.5 Gbps) | 24 (up to 8.5 Gbps) | 24 (up to 8.5 Gbps) | 24 (up to 8.5 Gbps) |
Key Differentiators
- Industrial temperature option in the same 1152-ball FCBGA package (vs EP4SGX530HH35C2)
- Higher performance speed grade than C2 variants (vs EP4SGX530HH35C2N)
- Same-die lead-free option without functional change (vs EP4SGX530HH35C3N)
Design Notes
The 1152-ball FCBGA package requires a 12-layer or thicker PCB with microvia-in-pad stack-ups, buried capacitance, and continuous ground-reference planes beneath the BGA field. Pair each transceiver channel with a continuous reference ground plane for the first 200 mil of breakout routing. Reference the Intel Stratix IV GX PCB Design Guidelines for via-pattern geometry and stack-up recommendations to maintain 8.5 Gbps signal integrity at the channel output.
Power-supply decoupling for the EP4SGX530HH35C3 requires high-frequency 0.1 uF and 0.01 uF ceramic capacitors distributed beneath the BGA, one pair per power pin, plus bulk 22 uF to 47 uF tantalum or polymer capacitors per voltage rail. The 0.87 V to 0.93 V core supply must use a controller with <1% set-point accuracy; pulse-skipping regulators are not acceptable. Use the Early Power Estimator (EPE) tool in Quartus Prime to model worst-case thermal dissipation before committing to a heatsink solution.
Estimated: at full transceiver utilization (24 channels at 8.5 Gbps) with 80% logic utilization, the EP4SGX530HH35C3 can dissipate 15-22 W. The 1152-ball FCBGA has a theta_JB of approximately 0.5 C/W, requiring either a 1-2 m/s airflow or a custom heatsink bonded to the package lid. Industrial-temperature variants (EP4SGX530HH35I3N, EP4SGX530HH35I4N) are recommended when ambient exceeds 60C.
Configuration mode selection (AS, PS, JTAG, Fast Passive Parallel) must be set by MSEL pin strapping before power-up; mixing configuration modes with mismatched MSEL settings can leave the FPGA unconfigured. JTAG chain integrity should be verified before attempting to load a design. Cyclone series configuration bitstreams cannot be loaded onto Stratix IV devices - use the matching bitstream file from Quartus Prime. Do not exceed the LVDS I/O count documented in the device handbook; over-assignment causes link errors at high toggle rates.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable for FPGAs (FPGAs are evaluated under different reliability standards); for automotive-grade FPGAs refer to the Cyclone V / Arria V Auto families.
