EP4SGX530HH35I3N vs EP4SGX530HH35C4 Comparison

Detailed side-by-side comparison of EP4SGX530HH35I3N by Intel and EP4SGX530HH35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP4SGX530HH35I3N

EP4SGX530HH35I3N - Stratix IV GX FPGA, 531K LE, 1152-BGA | Intel

EP4SGX530HH35I3N Nrnd
Intel
EP4SGX530HH35C4

EP4SGX530HH35C4 - 531K LE Stratix IV GX FPGA | Intel | Altera

EP4SGX530HH35C4 Nrnd

Specification Comparison

Parameter EP4SGX530HH35I3N EP4SGX530HH35C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $3,200.00 $3,120.00
Family Stratix IV GX β€”
Device Type FPGA - Field Programmable Gate Array FPGA
Logic Elements 531,200 531,200
Adaptive Logic Modules (ALMs) 21,248 21,248 LABs / 212,480 equivalent LEs
Embedded Memory (bits) 28,033,024 28,033,024
Logic Blocks / LABs 21,248 β€”
Maximum User I/Os 564 β€”
DSP Blocks 1,024 (18x18 multipliers) [DATA_NEEDED: block count for this density]
Transceivers 24 channels Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package]
Transceiver Data Rate (max) 8.5 Gbps β€”
PLLs 8 (fractional support) 8 fractional PLLs
Operating Temperature -40C to +85C (industrial) 0 C to 85 C (Commercial, -C4 suffix)
Internal Frequency (max) 800 MHz β€”
Package 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch 1152-ball FCBGA / FBGA (42.5 x 42.5 mm)
Mounting Type Surface Mount (BGA) Surface Mount (flip-chip BGA)
RoHS Status Compliant Compliant
Lead-Free Yes β€”
MSL Level 3 MSL3 (per BGA package standard)
Process Node 40 nm β€”
Series β€” Stratix IV GX
Maximum User I/O Pins β€” 564
Process Technology β€” 40 nm
Core Supply Voltage β€” 0.9 V
Speed Grade β€” HH35

Datasheets & Resources

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