EP4SGX530HH35I3N - Stratix IV GX FPGA, 531K LE, 1152-BGA | Intel
MPN: EP4SGX530HH35I3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4200 | $42,000.00 |
| 100 | $3850 | $385,000.00 |
| 500 | $3500 | $1,750,000.00 |
| 1,000 | $3200 | $3,200,000.00 |
EP4SGX530HH35I3N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, interconnect fabric, and dedicated silicon resources such as block RAM, DSP slices, and (in modern families) hardened transceivers and processor cores. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-performance FPGA -> system-on-chip FPGA. Unlike a fixed-function ASIC, an FPGA is reprogrammed in-system to implement arbitrary digital logic, parallel processing pipelines, or hardware accelerators. The Stratix IV family targets mid-to-high-end designs where ASIC-like performance is needed without the NRE cost of mask-set production.
Key features of the EP4SGX530HH35I3N include 21,248 adaptive logic modules (ALMs), 1,290 Kbits of MLAB memory plus dedicated M9K and M144K block RAM blocks, 1,024 DSP blocks (18x18 multipliers), 24 full-duplex transceivers operating up to 8.5 Gbps, and eight PLLs with fractional support. The part ships in the commercial (I) temperature grade, supports hot-socketing, and provides PCI-SIG compliant PCIe hard IP. Hard memory controllers and partial reconfiguration capability are standard Stratix IV features.
The EP4SGX530HH35I3N targets high-throughput digital designs: ASIC prototyping, high-speed data acquisition, video broadcast infrastructure, 40G/100G line-card MACs, radar baseband, and software-defined radio. With PCIe Gen2 x4/x8 hard IP and 8.5 Gbps transceivers, it is commonly used in test equipment, medical imaging, and defense signal-processing platforms. The 1152-ball FCBGA package requires a 1.0 mm pitch PCB land pattern and a multi-layer PCB with controlled-impedance routing.
When designing with this device, ensure your PCB stack-up supports 100-ohm differential routing for the transceiver channels and provides adequate decoupling (typically 0402/0201 ceramics in a dense pattern under the BGA). JTAG and active serial configuration via EPCS or enhanced EPCQ flash is supported. Quartus II design software (v13.0+ for legacy Stratix IV) is required; Altera ModelSim or Questa is recommended for RTL simulation.
This page synthesizes distributor pricing, verified drop-in Stratix IV GX siblings, and practical design considerations not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX530HH35I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35I3N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Transceivers, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530HH35C4N
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View Datasheet →EP4SGX530HH35I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 |
| Embedded Memory (bits) | 28,033,024 |
| Logic Blocks / LABs | 21,248 |
| Maximum User I/Os | 564 |
| DSP Blocks | 1,024 (18x18 multipliers) |
| Transceivers | 24 channels |
| Transceiver Data Rate (max) | 8.5 Gbps |
| PLLs | 8 (fractional support) |
| Operating Temperature | -40C to +85C (industrial) |
| Internal Frequency (max) | 800 MHz |
| Package | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 |
| Process Node | 40 nm |
EP4SGX530HH35I3N 1152-ball fcbga (hbga), 42.5 x 42.5 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4SGX530HH35I3N (1152-ball fcbga (hbga), 42.5 x 42.5 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35I3N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, 40G/100G Line-Card MAC Processing, Software Defined Radio (SDR) Baseband, Medical Imaging (CT/MRI Reconstructors), Video Broadcast and Production Infrastructure.
ASIC Prototyping and Emulation
The EP4SGX530HH35I3N's 531K logic elements and 28 Mbits of block RAM make it ideal for ASIC prototyping where designers map millions of gates of ASIC RTL into FPGA fabric for verification before tape-out. With 1,024 DSP blocks operating at up to 550 MHz, the device can emulate DSP-heavy ASICs (e.g. baseband modems, video codecs, cryptographic accelerators) at near-ASIC speed. Quartus II incremental compilation and partial reconfiguration allow multiple engineers to iterate independently on the same silicon. For multi-FPGA partitioning, the 24 transceivers provide the high-speed chip-to-chip links needed to bridge multiple FPGAs in an emulation farm.
Recommended
High-Speed Data Acquisition Systems
The EP4SGX530HH35I3N's 24 transceivers at 8.5 Gbps aggregate to >200 Gbps of serial I/O bandwidth, suitable for high-speed digitizer cards, oscilloscope front-ends, and radar baseband digitizers. The 1,024 DSP blocks enable real-time FFTs, channelization, and beam-forming at multi-GSPS sample rates without external DSPs. The large embedded memory (28 Mbits) buffers deep capture windows before host transfer. PCIe Gen2 x8 hard IP provides >3 GB/s host throughput for real-time streaming to CPU/GPU processing pipelines.
Recommended
40G/100G Line-Card MAC Processing
In telecom line-card applications, the EP4SGX530HH35I3N implements 40G/100G Ethernet MACs, OTN framer/mappers, and packet processors. The device's hard PCIe Gen2 and 8.5 Gbps transceivers map cleanly to OTU2/OTU3 client-side optics (CFP/CFP2 modules) via SFP+ breakout or direct attach. Multiple MAC instances (up to ~20-30 10G ports) fit comfortably thanks to 531K logic elements and abundant block RAM for packet buffering. The industrial temperature grade supports outdoor telecom equipment deployments.
Recommended
Software Defined Radio (SDR) Baseband
The EP4SGX530HH35I3N is widely deployed in military and commercial SDR baseband processing where wideband ADC/DAC data streams must be channelized, demodulated, and decoded in real time. The 1,024 DSP blocks (18x18 multipliers at 550 MHz) deliver ~2.4 TMACS of DSP throughput, sufficient for multiple wideband DDC/DUC channels and physical-layer processing of LTE/WiMAX/UMTS waveforms. Transceivers connect directly to RF front-end ADCs/DACs (e.g. AD9680, AD9144) at JESD204B data rates. Partial reconfiguration enables runtime waveform switching.
Recommended
Medical Imaging (CT/MRI Reconstructors)
In CT and MRI image reconstruction systems, the EP4SGX530HH35I3N performs back-projection and iterative reconstruction algorithms in real time at sub-second frame rates. The 531K logic elements and abundant DSP slices accelerate FDK cone-beam and iterative reconstruction kernels. PCI-SIG-compliant PCIe Gen2 hard IP simplifies interface to the host workstation. The 1152-FCBGA package is suitable for board-mount in chassis-resident imaging cards. Medical-grade designs benefit from the -40C to +85C industrial temperature range for reliability in controlled-environment installations.
Recommended
Video Broadcast and Production Infrastructure
The EP4SGX530HH35I3N is widely used in video broadcast routers, multi-viewers, and contribution codecs where uncompressed 3G-SDI / 12G-SDI / IP-video streams need real-time processing. Up to 24 transceivers handle dozens of SDI streams or multiple 10G Ethernet video channels. The block RAM serves as line/frame buffers for video processing pipelines, while the 1,024 DSP blocks accelerate video scaling, color-space conversion, and compression pre-processing. PCI Express Gen2 links to host CPUs for playlist and control integration.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35C4N | EP4SGX530HH35C3N | EP4SGX530HH35I3 | EP4SGX530HH35C2N | EP4SGX530HH35C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FCBGA (HH35), 42.5x42.5 mm | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same | 1152-ball FCBGA (HH35) - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Embedded Memory (Mbits) | 27.36 (28,033,024 bits) | 27.36 | 27.36 | 27.36 | 27.36 | 27.36 |
| DSP Blocks | 1,024 | 1,024 | 1,024 | 1,024 | 1,024 | 1,024 |
| Speed Grade | I3 | C4 (fastest) | C3 | I3 | C2 (slower) | C4 |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 24 channels @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density member of Stratix IV GX HH35 package line (vs EP4SGX360HF35I3N)
- Industrial -40C to +85C temperature range (vs EP4SGX530HH35C4N)
- Same-die family enables transparent Quartus recompilation (vs EP4SGX230KF40I3N)
Design Notes
The 1152-ball FCBGA at 1.0 mm pitch demands a 12+ layer PCB stack-up with controlled-impedance routing for the 24 transceiver channels. Use 100-ohm differential pairs with length matching to within 5 mils for transceiver traces. Provide dense power decoupling (10uF bulk + 0.1uF/0.01uF/0.001uF ceramics) under the BGA. Estimated: total PCB thickness ~3.2 mm with 4 ground/power planes to deliver clean power and minimize crosstalk on SERDES lanes.
Estimated: at full utilization (531K LE @ ~70% toggle, 24 transceivers active), the EP4SGX530HH35I3N can dissipate 15-25 W. The FCBGA package theta_JA is approximately 0.5 C/W with a properly designed heat-sink-attached thermal solution, requiring forced airflow (at least 200 LFM) for reliable operation. Use thermal interface material rated for the -40C to +85C industrial range. Without active cooling, junction temperature can exceed 100C, triggering thermal throttle or damage.
Place the EPCQ configuration flash within 2 inches of the FPGA's active serial (AS) configuration pins to minimize signal integrity issues. JTAG chain needs TCK pull-down and TMS pull-up; route the JTAG signals away from noisy power planes. Differential transceiver pairs should reference a continuous ground plane and avoid layer transitions where possible. Estimated: total transceiver channel loss budget of ~10 dB at 8.5 Gbps for typical FR-4 traces less than 8 inches.
Do not assume the EP4SGX530HH35I3N is in active production - confirm NRND status before committing to long-term designs; Intel recommends Stratix V (5SGXEA7K1F40C2N) or newer for new platforms. Configuration mode mismatch (AS vs JTAG vs PS) is a common failure cause; verify MSEL pins are set correctly per the configuration scheme used. The I3 speed grade is the slowest of the I-grade family; do not substitute I2/I1 (which do not exist) and verify timing closure before tape-out.
Compliance Information
RoHS compliant per Altera/Intel product declaration (suffix 'N'). Not AEC-Q100 qualified - FPGAs are not typical AEC-Q100 parts. Lead-free terminal finish per RoHS requirements.
