EPF10K100ARI240-3N vs EPF10K100EBC356-1X Comparison
Detailed side-by-side comparison of EPF10K100ARI240-3N by Intel and EPF10K100EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
EPF10K100ARI240-3N β Last Time BuySpecification Comparison
| Parameter | EPF10K100ARI240-3N | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $86.40 | $165.00 |
| Family | FLEX 10KA | β |
| Logic Elements / Cells | 4,992 | β |
| Typical Gate Count | 100,000 gates | β |
| Embedded RAM Bits | 24,576 bits | β |
| Logic Array Blocks (LABs) | 624 | 624 |
| User I/Os | 189 | β |
| Package | 240-RQFP Exposed Pad (32x32 mm) | β |
| Pins | 240 | β |
| Propagation Delay (tpd) | 0.6 ns | β |
| Maximum Internal Frequency | 125 MHz | β |
| Process Technology | 0.30 Β΅m CMOS SRAM | β |
| Supply Voltage (VCCINT) | 3.3 V | β |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | β |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) | 0 C to +70 C (Commercial) |
| Speed Grade | -3N (industrial) | -1X |
| Mounting Type | Surface Mount (RQFP, gull-wing) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | β | FLEX 10KE |
| Logic Elements | β | 4,992 |
| Typical Gates | β | 100,000 |
| Embedded Array Blocks (EABs) | β | 12 |
| Total RAM Bits | β | 49,152 |
| User I/O Count | β | 274 |
| Propagation Delay | β | 0.6 ns |
| Logic Family | β | CMOS |
| Core Process Technology | β | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | β | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | β | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | β | 356-LBGA (BGA-356) |
| Package Dimensions | β | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | β | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |