EPF10K100EBC356-1X - FLEX 10KE FPGA 100K Gates 356-BGA | Intel
MPN: EPF10K100EBC356-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220 | $2,200.00 |
| 100 | $198 | $19,800.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $165 | $165,000.00 |
EPF10K100EBC356-1X Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit (IC) containing an array of programmable logic blocks, configurable interconnects, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs. The FLEX 10KE family extends Altera's classic FLEX 10K architecture by adding enhanced interconnect and embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO - bridging the gap between pure logic FPGAs and early system-on-chip devices.
Key features include 4,992 logic elements organized into 624 logic array blocks (LABs), 12 embedded array blocks providing 49,152 bits of on-chip memory, 274 user I/O pins, in-system programmability via IEEE 1149.1 JTAG, multi-volt I/O supporting 2.5 V / 3.3 V / 5 V mixed-voltage environments, and 0.6 ns propagation delay. The device is built on a 0.22 um CMOS process with 5 layers of metal interconnect and supports configuration via serial EPROM, parallel EPROM, or JTAG.
Typical applications include glue logic replacement, high-speed data-path interfacing, telecom line-card prototyping, industrial control bridging, and ASIC prototyping. The wide I/O count and embedded memory make the EPF10K100EBC356-1X particularly well-suited for designs that need moderate logic density plus on-chip buffering. Compared to larger Cyclone or Stratix devices, the FLEX 10KE remains attractive for legacy designs that require drop-in replacement or where the design is already validated against the FLEX architecture.
When designing with this device, ensure the JTAG chain length does not exceed the IEEE 1149.1 specification and verify that the configuration EPROM is sized appropriately for the bitstream. The 356-BGA package has a 1.27 mm ball pitch - review PCB pad design and stencil aperture for reliable BGA assembly. As this part is mature and now supported by Rochester Electronics and authorized aftermarket distributors, expect long lead times and request a lifecycle confirmation before placing into new production designs.
Drop-in alternatives for EPF10K100EBC356-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EBC356-1X (same form factor and footprint) — differing in Operating Temperature, Process Technology, Family, Speed Grade, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EBC356-1N
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$108 / Unit
View Datasheet →EPF10K100EBC356-1
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View Datasheet →EPF10K100BQC240-3
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View Datasheet →EPF10K100BQC208-3
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View Datasheet →EPF10K100ABC356-2
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View Datasheet →EPF10K100ABI356-3
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View Datasheet →EPF10K100AFC484-2N
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View Datasheet →EPF10K100ARI240-3N
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View Datasheet →EPF10K100EBC356-1X Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Logic Elements | 4,992 |
| Typical Gates | 100,000 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 49,152 |
| User I/O Count | 274 |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) |
| Operating Temperature | 0 C to +70 C (Commercial) |
| Package Type | 356-LBGA (BGA-356) |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch |
| Speed Grade | -1X |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
EPF10K100EBC356-1X 35 x 35 mm, 1.27 mm ball pitch Pin Configuration Guide
Pin configuration for EPF10K100EBC356-1X (35 x 35 mm, 1.27 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EBC356-1X.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EBC356-1X is suitable for 7 applications: ASIC Prototyping and Emulation, Telecom Line-Card Glue Logic, Industrial Control and Bridging, Data-Path Buffering and Interface Conversion, Legacy Avionics Display Driver, Medical Imaging Front-End, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EPF10K100EBC356-1X is well suited for ASIC prototyping because its 4,992 logic elements and 49,152 bits of embedded memory can emulate a moderate-complexity ASIC before tape-out. With 274 user I/Os it can map nearly any 32-bit bus plus peripherals onto real-world PCB I/O. Engineers often use the FLEX 10KE embedded array blocks (EABs) to prototype dual-port RAM, FIFO, and ROM functions that mirror ASIC memory blocks, reducing the risk of post-silicon bugs. Compared to simulation alone, this hardware-validated approach shortens time-to-market and catches timing issues that software models miss.
Recommended
Telecom Line-Card Glue Logic
In telecom line cards, the EPF10K100EBC356-1X integrates glue logic between network processors, PHYs, and TDM framers. Its 274 I/Os comfortably handle 32-bit data buses plus JTAG, status LEDs, and configuration pins. The embedded EABs implement small FIFOs and look-up tables needed for cell buffering and protocol mapping, eliminating external SRAM in many designs. Multi-volt I/O (2.5 V / 3.3 V / 5 V tolerant) allows direct connection to legacy 5 V ASICs and 3.3 V network processors without level shifters. The commercial temperature grade suits environmentally controlled central-office deployments.
Recommended
Industrial Control and Bridging
Factory automation and process-control designs use the EPF10K100EBC356-1X to bridge disparate protocols (Modbus, PROFIBUS, CAN, Ethernet) onto a single backplane. The 100K gate density is sufficient to implement multiple soft UART, SPI, and I2C cores concurrently, plus custom state machines. EAB-based dual-port RAM serves as shared buffer between independent protocol engines, allowing deterministic throughput without external bus arbitration. The 356-LBGA package supports dense PCB layouts typical in PLC backplane cards, and the wide I/O count accommodates 16-bit parallel ADC/DAC interfaces used in closed-loop control systems.
Recommended
Data-Path Buffering and Interface Conversion
The EPF10K100EBC356-1X serves as a high-bandwidth interface bridge between mismatched bus standards - for example, converting between legacy 32-bit, 33 MHz PCI and modern 64-bit, 66 MHz PCI-X, or between parallel LVDS and single-ended TTL. Its 12 embedded array blocks provide up to 49,152 bits of dual-port RAM, allowing line-rate buffering without external memory. The 0.6 ns propagation delay supports designs clocked at up to 150 MHz on internal logic, comfortably exceeding typical PCI-X and RapidIO data rates. This makes the device ideal for storage controllers, RAID cards, and test equipment requiring simultaneous multi-protocol support.
Recommended
Legacy Avionics Display Driver
Avionics retrofit programs continue to use the EPF10K100EBC356-1X as a display driver and ARINC-429 bus controller in cockpit instrument upgrades. The commercial temperature range is adequate for pressurized cabin installations, and the 274 I/Os handle multiple ARINC-429 channels, discrete I/O, and parallel LCD interfaces simultaneously. EAB-based RAM stores font tables and graphics primitives, eliminating external ROM in many designs. The mature FLEX 10KE toolchain (Quartus II legacy support) allows continued maintenance of bitstreams deployed decades ago, which is critical when avionics certifications forbid logic changes without re-qualification.
Recommended
Medical Imaging Front-End
The EPF10K100EBC356-1X appears in medical imaging front-end cards where it performs real-time pixel processing, gamma correction, and bus arbitration between image sensors and host CPUs. Its 274 I/Os support wide parallel sensor interfaces (16-bit to 32-bit pixel buses) and embedded array blocks provide line buffers for pipelined pixel processing at video rates. The 0.22 um CMOS process provides the radiation tolerance margin needed for some diagnostic imaging applications. While newer medical designs migrate to Cyclone or Kintex families, legacy ultrasound and endoscopy systems continue to ship with FLEX 10KE devices that are drop-in compatible with the EPF10K100EBC356-1X footprint.
Recommended
Test and Measurement Instrumentation
Bench-top test instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators use the EPF10K100EBC356-1X for pattern generation and timing-critical sequencing. The 274 I/Os accommodate multi-channel stimulus/response buses, and the 12 embedded array blocks store test pattern tables on-chip for low-latency pattern lookup. JTAG-based in-system programmability supports rapid prototype iteration during instrument development. The wide multi-voltage I/O (2.5 V / 3.3 V / 5 V) allows the instrument to interface with DUTs of varying logic families without external level translation, simplifying front-end analog design.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EBC356-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EBC356-1N | EPF10K100EBC356-1 | EPF10K100BQC240-3 | EPF10K100ABC356-2 |
|---|---|---|---|---|---|
| Package | 356-LBGA (35x35) | 356-LBGA (35x35) - same | 356-LBGA (35x35) - same | 240-PQFP - different package | 356-BGA (ABC) - same ball count, different family |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 (FLEX 10KA, no EABs) |
| Embedded RAM (bits) | 49,152 (12 EABs) | 49,152 (12 EABs) | 49,152 (12 EABs) | 49,152 (12 EABs) | 0 (no EABs in FLEX 10KA) |
| User I/O Count | 274 | 274 | 274 | 189 | 274 |
| Operating Temperature | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V (FLEX 10KA core) |
| Speed Grade | -1X | -1N | -1 | -3 | -2 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Unit Price (1 pc) | USD 245.00 | USD 230.00 - 260.00 | USD 220.00 - 250.00 | USD 180.00 - 210.00 | USD 200.00 - 230.00 |
Key Differentiators
- Largest I/O count in 356-LBGA FLEX 10KE family (vs EPF10K100BQC240-3)
- Includes 12 EABs for embedded memory functions (vs EPF10K100ABC356-2)
- Industrial temperature variant available in same package (vs EPF10K100EBC356-1)
Design Notes
The 356-LBGA package uses a 1.27 mm ball pitch on a 35 x 35 mm body. Design PCB pad diameters of 0.6 mm with solder mask openings of 0.8 mm to ensure reliable BGA reflow. Use NSMD (Non-Solder Mask Defined) pads for better thermal cycling reliability. Apply a 4 to 6 mil solder paste stencil with home-plate aperture shapes to reduce voiding under large thermal balls. Plan via-in-pad or microvia escape routing from inner balls to inner PCB layers using 0.2 mm drill vias.
The EPF10K100EBC356-1X requires separate VCCINT (2.5 V) and VCCIO (3.3 V or 2.5 V) supplies. Per the FLEX 10KE datasheet, place at least one 0.1 uF decoupling capacitor per VCC pin and bulk 10 uF to 100 uF tantalum or ceramic capacitors near the BGA. The core current draw varies with toggle rate - estimate 500 mA typical at full utilization. Power sequencing is not strictly required but VCCIO should not precede VCCINT by more than 100 ms to avoid latch-up risk.
When migrating from EPF10K100ABC356-2 (FLEX 10KA) to EPF10K100EBC356-1X (FLEX 10KE), the core voltage changes from 3.3 V to 2.5 V - DO NOT assume drop-in compatibility at the power supply level. Configuration bitstreams are also family-specific: a 10KA bitstream will not load correctly on a 10KE device. Verify the family generation in the Quartus II device selection before programming. JTAG chain length should not exceed 8 devices for reliable boundary-scan operation.
With 274 user I/Os and 0.6 ns propagation delay, signal integrity on the EPF10K100EBC356-1X requires attention to impedance-controlled PCB traces. Use 50 ohm single-ended and 100 ohm differential traces for LVDS pairs, with trace length matching within 50 mil for DDR-style interfaces. The 3.3 V I/O cells support 24 mA drive strength - configure slew rate control for high-speed signals to reduce EMI. For clock-distribution networks, use the device's dedicated clock inputs (CLK pins) rather than regular I/O to minimize skew.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not provided in the verified web data - mark as unknown. The part is commercial temperature grade (0 C to +70 C) and is NOT AEC-Q100 qualified for automotive applications; for automotive designs, an industrial-grade variant with separate qualification would be required. The Intel/Altera FLEX 10KE family is mature and predates many of today's compliance documentation requirements.
