EPF10K100EBC356-2 vs EPF10K100EBC356-1X Comparison

Detailed side-by-side comparison of EPF10K100EBC356-2 by Intel and EPF10K100EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-2 EPF10K100EBC356-1X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $59.95 $165.00
Series FLEX-10KE FLEX 10KE
Family Embedded Programmable Logic Device (PLD) β€”
Typical Gates 100,000 100,000
Maximum System Gates 158,000 β€”
Logic Elements (LEs) 4,992 β€”
Number of LABs/CLBs 624 β€”
Embedded Array Blocks (EABs) 12 12
Total RAM Bits 49,152 49,152
User I/O Pins 274 β€”
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) β€”
Propagation Delay (tPD) 0.5 ns β€”
Internal Operating Frequency up to 250 MHz β€”
Process Technology CMOS, SRAM-based β€”
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) 356-LBGA (BGA-356)
Operating Temperature 0 C to 70 C (Commercial) 0 C to +70 C (Commercial)
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Method SRAM, JTAG (IEEE 1149.1) Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1)
Speed Grade -2 -1X
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] β€”
Logic Elements β€” 4,992
Logic Array Blocks (LABs) β€” 624
User I/O Count β€” 274
Propagation Delay β€” 0.6 ns
Logic Family β€” CMOS
Core Process Technology β€” 0.22 um CMOS, 5 metal layers
Core Supply Voltage β€” 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage β€” 3.3 V (multi-volt tolerant to 5 V)
Package Dimensions β€” 35 x 35 mm, 1.27 mm ball pitch
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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