EPF10K100EBC356-2 vs EPF10K100EBC356-3 Comparison

Detailed side-by-side comparison of EPF10K100EBC356-2 by Intel and EPF10K100EBC356-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-2 EPF10K100EBC356-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $59.95 $62.50
Series FLEX-10KE β€”
Family Embedded Programmable Logic Device (PLD) FLEX-10KE
Typical Gates 100,000 β€”
Maximum System Gates 158,000 β€”
Logic Elements (LEs) 4,992 β€”
Number of LABs/CLBs 624 β€”
Embedded Array Blocks (EABs) 12 β€”
Total RAM Bits 49,152 β€”
User I/O Pins 274 β€”
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) 2.5 V (2.375 V to 2.625 V)
Propagation Delay (tPD) 0.5 ns β€”
Internal Operating Frequency up to 250 MHz β€”
Process Technology CMOS, SRAM-based 0.22 micron CMOS
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) β€”
Operating Temperature 0 C to 70 C (Commercial) 0 C to 70 C (Commercial)
Mounting Type Surface Mount Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) β€”
Speed Grade -2 -3
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance status]
Lead-Free [DATA_NEEDED: lead-free status] β€”
Logic Elements / Cells β€” 4,992
Total Gates β€” ~100,000
Logic Array Blocks (LABs) β€” 624
Embedded Memory (RAM bits) β€” 49,152
User I/Os β€” 274
Propagation Delay (typical) β€” 0.6 ns
Maximum Internal Frequency β€” 200 MHz
Configuration Technology β€” SRAM (volatile)
Package β€” 356-LBGA (35 x 35 mm)

Datasheets & Resources

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