EPF10K130EBC600-2 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K130EBC600-2 by Altera and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K130EBC600-2 EPF10K200EBC600-2
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $455.00 $198.00
Family FLEX-10KE β€”
Typical Gates 130,000 β€”
Logic Array Blocks (LABs) 832 1248
User I/Os 424 β€”
Embedded Memory (EAB) 4 kbit per EAB 98304 bits (96 Kbits)
Core Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal) β€”
I/O Voltage (VCCIO) MultiVolt: 1.8 V / 2.5 V / 3.3 V β€”
Process Technology SRAM CMOS, 0.25 um 0.30 Β΅m CMOS
Speed Grade -2 β€”
Pin-to-Pin Delay 0.5 ns β€”
Package 600-BGA (45 x 45 mm) β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 C to +70 C (Commercial) 0Β°C to +70Β°C (Commercial)
Configuration Method Serial / Parallel / JTAG JTAG (IEEE 1149.1), EPC2 serial PROM
RoHS Status Compliant unknown
MSL Level 3 (168 hours) β€”
Supply Current (Quiescent) 10 mA typical β€”
Series β€” FLEX-10KE
Logic Family β€” CMOS (SRAM-based)
Typical Gate Count β€” 200,000 gates
Logic Elements (LEs) β€” 9984
Maximum User I/O β€” 470 pins
Propagation Delay β€” 0.4 ns
Supply Voltage β€” 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards β€” LVTTL, LVCMOS, PCI, GTL+
Package Type β€” 600-ball BGA (BGA-600)
Package Dimensions β€” 45 Γ— 45 mm
Ball Pitch β€” 1.27 mm
Package Height β€” 1.1 mm max
Part Status β€” Obsolete

Datasheets & Resources

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