EPF10K130EFC484-3 vs EPF10K130EFC484-1 Comparison

Detailed side-by-side comparison of EPF10K130EFC484-3 by Intel and EPF10K130EFC484-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K130EFC484-3 EPF10K130EFC484-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $178.92 $92.00
Family FLEX 10KE FLEX-10KE
Logic Elements (LEs) 6,656 β€”
Typical Gate Count 130,000 system gates β€”
Logic Array Blocks (LABs) 832 832
Embedded Memory (EABs) 16 x 4,096 bits (65,536 bits total) β€”
Maximum User I/O 369 β€”
Supply Voltage (Core) 3.3 V β€”
I/O Voltage Support 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) β€”
Propagation Delay 0.6 ns (per LE) 0.6 ns
Speed Grade -3 -1 (slower commercial bin)
Operating Temperature 0 C to +70 C (commercial) 0C to +70C (Commercial)
Package 484-pin FBGA (FineLine BGA) β€”
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method SRAM-based, serial or parallel, requires external configuration device β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Family CMOS (SRAM-based) CMOS
Series β€” FLEX-10KE
Typical Gates β€” 130,000
Logic Elements β€” 6,656
Embedded Memory (EAB) β€” 65,536 bits (64 Kbit)
User I/Os β€” 369
Maximum Frequency β€” 333.33 MHz
Core Supply Voltage β€” 2.5 V
I/O Supply Voltage β€” 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant)
Package Type β€” FineLine BGA-484
Package Dimensions β€” 23 x 23 mm
Ball Pitch β€” 1.0 mm
Configuration Interface β€” JTAG (IEEE 1149.1 / IEEE 1532)

Datasheets & Resources

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