EPF10K130EFC484-3 vs EPF10K130EFC484-3N Comparison
Detailed side-by-side comparison of EPF10K130EFC484-3 by Intel and EPF10K130EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K130EFC484-3
EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera
EPF10K130EFC484-3 NrndIntel
EPF10K130EFC484-3N
EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA
EPF10K130EFC484-3N NrndSpecification Comparison
| Parameter | EPF10K130EFC484-3 | EPF10K130EFC484-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $178.92 | $109.25 |
| Family | FLEX 10KE | β |
| Logic Elements (LEs) | 6,656 | β |
| Typical Gate Count | 130,000 system gates | 130000 |
| Logic Array Blocks (LABs) | 832 | β |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | β |
| Maximum User I/O | 369 | β |
| Supply Voltage (Core) | 3.3 V | β |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | β |
| Propagation Delay | 0.6 ns (per LE) | β |
| Speed Grade | -3 | -3 (faster timing bin) |
| Operating Temperature | 0 C to +70 C (commercial) | β |
| Package | 484-pin FBGA (FineLine BGA) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | β |
| Series | β | FLEX-10KE |
| Number of Logic Elements / Cells | β | 6656 |
| Total RAM Bits | β | 65536 |
| Number of I/O | β | 369 |
| Number of LABs/CLBs | β | 832 |
| Number of Embedded Array Blocks (EABs) | β | 72 |
| Operating Temperature Grade | β | Commercial (0C to +70C) |
| Core Voltage | β | 2.5 V |
| Process Technology | β | 0.22 Β΅m CMOS |
| Package Type | β | 484-BBGA (FineLine BGA) |
| Package Dimensions | β | 23 x 23 mm |
| Ball Pitch | β | 1.0 mm |
| Configuration Memory | β | SRAM-based (volatile, requires config device) |
| Configuration Interface | β | JTAG / PS / PPS / Altera serial |