EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA
MPN: EPF10K130EFC484-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $138 | $1,380.00 |
| 100 | $128.5 | $12,850.00 |
| 500 | $118.75 | $59,375.00 |
| 1,000 | $109.25 | $109,250.00 |
EPF10K130EFC484-3N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric. Modern FPGAs also embed hard IP such as block RAM, PLLs, and high-speed transceivers. Positioned in the broader programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA), FPGAs deliver the highest logic density and are used when ASIC-like performance is required but design flexibility must be preserved.
Key features of the EPF10K130EFC484-3N include 6,656 logic elements, 65,536 bits of embedded SRAM, 72 embedded array blocks (EABs) for memory-intensive functions, and 369 maximum user I/O. The device is built on a 0.22 µm CMOS process and operates from a 2.5 V core supply with multi-voltage I/O support. The 484-ball FineLine BGA (23 × 23 mm, 1.0 mm pitch) provides ample signal breakout for high-pin-count designs while remaining compatible with conventional PCB assembly.
Architecturally, the FLEX 10KE family combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions, giving designers a balanced mix of distributed and block memory. The 2.5 V core with hot-socketing-capable I/O simplifies multi-voltage interfacing, and the in-system programmability via SRAM configuration cells allows rapid design iteration without rework.
Typical applications include telecom line-card glue logic, industrial control and instrumentation, prototype ASIC verification, and high-density data-path implementation such as image processing and protocol bridging. The combination of 130 K typical gates and 369 user I/O also makes it suitable for legacy designs migrating from older Altera FLEX 8000 devices that need higher I/O and memory bandwidth.
When designing with the EPF10K130EFC484-3N, ensure the configuration scheme (PS, PPS, JTAG, or Altera serial) is selected early in the design cycle, since the configuration pins are multiplexed with user I/O and require careful Quartus II fitter planning. The 484-BGA package also demands controlled-impedance PCB layout and thermal vias under the die for reliable operation in space-constrained boards.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K130EFC484-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K130EFC484-3N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K130EFC484-3
✅ Drop-In✓ In Stock
$178.92 / Unit
View Datasheet →EPF10K130EFC484-2N
✅ Drop-In✓ In Stock
$799 / Unit
View Datasheet →EPF10K130EFC484-2
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K130EFC484-1
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EPF10K100EFC484-3N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K100EFC484-3
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K130EFC484-3N Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KE |
| Number of Logic Elements / Cells | 6656 |
| Total RAM Bits | 65536 |
| Typical Gate Count | 130000 |
| Number of I/O | 369 |
| Number of LABs/CLBs | 832 |
| Number of Embedded Array Blocks (EABs) | 72 |
| Speed Grade | -3 (faster timing bin) |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Package Type | 484-BBGA (FineLine BGA) |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires config device) |
| Configuration Interface | JTAG / PS / PPS / Altera serial |
EPF10K130EFC484-3N 23 x 23 mm Pin Configuration Guide
Pin configuration for EPF10K130EFC484-3N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K130EFC484-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K130EFC484-3N is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial Control and Instrumentation, ASIC Prototype Verification, Image Processing Pipelines, Protocol Bridging and Bus Conversion, Legacy FLEX 8000 Design Migration.
Telecom Line-Card Glue Logic
The EPF10K130EFC484-3N's 369 user I/O and 65,536 bits of embedded SRAM make it well suited as glue logic on telecom line cards where it bridges parallel data buses, implements framing and protocol adaptation, and provides state-machine control between PHY devices and backplane ASICs. The 130 K typical gate count absorbs mid-density logic functions that would otherwise require multiple 74-series devices, simplifying board layout. The 2.5 V core with multi-voltage I/O simplifies interfacing to legacy 3.3 V and 5 V peripherals common in central-office equipment. Designers typically pair it with serializer/deserializer (SerDes) companion devices and configure the FPGA via JTAG during board bring-up, using one of the 72 EABs to implement small FIFO buffers between clock domains.
Recommended
Industrial Control and Instrumentation
In industrial automation systems, the EPF10K130EFC484-3N provides deterministic logic for motion controllers, sensor aggregation, and high-speed signal conditioning. Its 6,656 logic elements handle encoder decoding, PWM generation, and PID loop computation while the embedded EABs serve as lookup tables for non-linear sensor calibration curves. The 369 I/O pins accommodate multi-axis servo feedback and parallel ADC/DAC interfaces. The FLEX 10KE architecture's hot-socketing capable I/O and JTAG boundary-scan support simplify in-field programming and production test. Designers should select the industrial-temperature "-I" variant for environments outside 0C to +70C; the commercial "-3N" is intended for controlled cabinet installations.
Recommended
ASIC Prototype Verification
The EPF10K130EFC484-3N serves as a high-density verification platform for ASIC designs pre-tapeout. With 130 K typical gates it accommodates sub-blocks of larger ASICs, allowing hardware-software co-verification and real-world I/O stressing. The FLEX 10KE family is supported by the original Altera MAX+PLUS II and early Quartus II toolchains, preserving design files from legacy verification campaigns. The 484-BGA footprint maps to standard verification daughter boards, and the device's 0.22 µm CMOS process gives realistic timing for back-annotated gate-level simulations. Designers often combine it with EPF10K100EFC484-3N on the same test fixture for density-versus-cost trade-off studies.
Recommended
Image Processing Pipelines
The 72 Embedded Array Blocks of the EPF10K130EFC484-3N provide 65 Kbits of dual-port RAM that can be partitioned into line buffers, convolution windows, or histogram accumulators for real-time image processing. Combined with the device's 6,656 logic elements, designers implement mid-resolution pipeline stages for filtering, color-space conversion, and edge detection at video rates. The 369 user I/O accommodate 16-bit-wide pixel buses plus synchronization and control signals to image sensors and frame buffers. The 484-BGA package provides the signal breakout needed for 32-bit external memory interfaces; designers typically pair it with SSRAM or SDRAM companion memories for full-frame buffering.
Recommended
Protocol Bridging and Bus Conversion
The EPF10K130EFC484-3N's I/O-rich 484-BGA package and reconfigurable logic fabric make it a flexible protocol bridge between legacy parallel buses (PCI, VME, ISA) and modern serial interfaces (I2C, SPI, UART, custom LVDS). The 130 K typical gate budget accommodates stateful protocol stacks with DMA engines, while 65 Kbits of embedded RAM holds descriptor rings and packet buffers. JTAG-based in-system reprogramming allows field upgrades when endpoint protocols change. Designers can drop in the same-footprint EPF10K130EFC484-2N when lower timing margin is acceptable, and migrate to higher-density EPF10K200SFC484-3N as traffic scales.
Recommended
Legacy FLEX 8000 Design Migration
Designers migrating from the older FLEX 8000 family can drop the EPF10K130EFC484-3N into a 484-BGA footprint as a higher-density, lower-power successor. The FLEX 10KE family offers 2.5 V core (vs 5 V on FLEX 8000) while maintaining architectural compatibility for Look-Up Table based logic and JTAG-based configuration flow. The 6,656 LEs provide roughly 1.5x the density of the largest FLEX 8000 device, and the 369 user I/O outpace legacy 8000-series packages. Migration typically requires only a Quartus II recompile and power-rail review; PCB layout is preserved for designs already using the 484-BGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K130EFC484-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K130EFC484-3 | EPF10K130EFC484-2N | EPF10K130EFC484-2 | EPF10K130EFC484-1 | EPF10K100EFC484-3N | EPF10K100EFC484-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) |
| Series | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE |
| Logic Elements | 6656 | 6656 | 6656 | 6656 | 6656 | 4992 | 4992 |
| Total RAM Bits | 65536 | 65536 | 65536 | 65536 | 65536 | 49152 | 49152 |
| Maximum User I/O | 369 | 369 | 369 | 369 | 369 | 369 | 369 |
| Speed Grade | -3 (faster) | -3 (faster) | -2 | -2 | -1 (slowest) | -3 (faster) | -3 (faster) |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Top-of-family logic density with full I/O retention (vs EPF10K100EFC484-3N)
- Faster speed grade for higher clock margin (vs EPF10K130EFC484-2N)
- Lead-free terminal finish for RoHS-friendly assembly (vs EPF10K130EFC484-3)
Design Notes
The FLEX 10KE core operates at 2.5 V while supporting multi-voltage I/O banks. Decouple the 2.5 V supply with at least one 10 µF bulk capacitor plus 0.1 µF high-frequency ceramic per power pin pair, placed as close to the BGA balls as the layout allows. The 484-BGA package concentrates supply balls in dedicated rings; route split power planes for VCCINT (2.5 V) and VCCIO (1.8/2.5/3.3 V selectable) to avoid IR drop on dense switching events. Estimated: at 50 % toggle rate and 100 MHz operation, the device draws approximately 0.5-1 A from VCCINT; verify against Quartus II PowerPlay early in the design.
The 484-BGA FineLine package requires thermal vias under the die for reliable operation. Provide at least a 4×4 array of 0.3 mm thermal vias on the center BGA balls (typically GND) to a copper pour on the opposite side of the PCB. For designs sustained at > 85 % utilization with high toggle rates, attach a small heatsink or use forced airflow; the FLEX 10KE family is rated for a maximum junction temperature of 125 C and the NRND status means reliability data is fixed - thermal margin matters more than for newer parts.
The 484-FBGA has a 1.0 mm ball pitch and 23 × 23 mm body, requiring microvia or via-in-pad technology for escape routing on standard 4-layer PCBs. Use a 0.5 mm trace/space rule and place ground stitching vias around signal breakouts to maintain controlled impedance for LVDS and clock signals. Trace length matching within ± 25 mil is recommended for bus interfaces to the EABs and global clock network; the FLEX 10KE has 4 dedicated clock input pins (CLK0-CLK3) that should drive matched-length traces to avoid skew.
Do not assume that any FLEX 10KE in 484-BGA is footprint-compatible with any other Altera/Intel 484-BGA FPGA - the Cyclone and Cyclone II 484-BGA variants use a different ball map and will not drop into the same PCB. Verify the pinout against the FLEX 10KE datasheet (Altera document dsf10ke.pdf) before reuse. The "-N" suffix indicates lead-free terminal finish but the part is still NRND - verify RoHS compliance explicitly with the manufacturer for new designs, as we have no authoritative RoHS data on file.
Compliance Information
Lead-free terminal finish indicated by 'N' suffix per industry convention; RoHS/REACH/conflict-mineral data is not present in the verified web data and should be confirmed with the manufacturer for new designs.
