EPF10K130EFC484-3 vs EPF10K130EFI484-2 Comparison
Detailed side-by-side comparison of EPF10K130EFC484-3 by Intel and EPF10K130EFI484-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFC484-3 | EPF10K130EFI484-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $178.92 | $92.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | β |
| Typical Gate Count | 130,000 system gates | β |
| Logic Array Blocks (LABs) | 832 | β |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | β |
| Maximum User I/O | 369 | β |
| Supply Voltage (Core) | 3.3 V | β |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | β |
| Propagation Delay | 0.6 ns (per LE) | 0.6 ns |
| Speed Grade | -3 | β |
| Operating Temperature | 0 C to +70 C (commercial) | 0 Β°C to 70 Β°C (commercial) |
| Package | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | β |
| Logic Elements / Cells | β | 6,656 |
| Equivalent Gate Count | β | 130,000 gates |
| Total RAM Bits | β | 65,536 bits |
| User I/Os | β | 274 |
| Number of Logic Array Blocks | β | 1,664 LABs |
| Number of Embedded Array Blocks | β | [DATA_NEEDED: EAB count] |
| Internal Clock Frequency | β | 333.33 MHz |
| Core Supply Voltage | β | 2.5 V |
| I/O Supply Voltage | β | 3.3 V (PCI-compliant) |
| Process Technology | β | 0.22 Β΅m CMOS |
| MSL Level | β | [DATA_NEEDED: MSL rating] |