EPF10K130EFI484-2 - 130K Gates FLEX 10KE FPGA | Intel | BGA-484
MPN: EPF10K130EFI484-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EPF10K130EFI484-2 Overview
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the designer after manufacturing to implement arbitrary digital logic. FPGAs occupy a place in the broader semiconductor hierarchy between ASICs (Application-Specific Integrated Circuits, which are fixed at fabrication) and general-purpose processors (which execute software sequentially). The FLEX 10KE family was Altera's first embedded programmable logic family to combine a logic array block (LAB) fabric with an embedded array block (EAB) for on-chip RAM/ROM, providing System-on-a-Programmable-Chip (SOPC) integration.
Key features of the EPF10K130EFI484-2 include the FLEX 10KE embedded array architecture, 65,536 bits of distributed memory (via EAB), 3.3 V PCI-compliant I/O, JTAG-compliant boundary-scan (IEEE 1149.1) support, and built-in SameFrame pin migration that lets the designer move between 10K, 10KE, 10KA, and 10K130E family devices without board rework when using the FineLine BGA footprint.
Typical applications include high-volume telecommunications line cards, glue logic and bus bridging for embedded CPU boards, industrial control and factory automation backplanes, and legacy replacement designs where the long-life FLEX 10KE supply chain and SameFrame migration tool flow reduce board respin risk. Designers using Quartus II or MAX+PLUS II can target this device directly.
When designing with this device, treat the 484-ball FineLine BGA as a non-trivial BGA layout: keep all power and ground balls decoupled with 0.1 µF and 10 µF capacitors placed as close to the package as the breakout allows, and verify SameFrame pin-out migration in the Quartus pin planner before committing to a layout because some I/O banks differ between FLEX 10KE and 10KA devices.
Drop-in alternatives for EPF10K130EFI484-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K130EFI484-2 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, User I/Os, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K130EFC484-2
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K130EFC484-2N
✅ Drop-In✓ In Stock
$799 / Unit
View Datasheet →EPF10K130EFC484-3
✅ Drop-In✓ In Stock
$178.92 / Unit
View Datasheet →EPF10K130EFC484-3N
✅ Drop-In✓ In Stock
$109.25 / Unit
View Datasheet →EPF10K130EFC484-1
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EPF10K100EFI484-2
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EPF10K130EFI484-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements / Cells | 6,656 |
| Equivalent Gate Count | 130,000 gates |
| Total RAM Bits | 65,536 bits |
| User I/Os | 274 |
| Number of Logic Array Blocks | 1,664 LABs |
| Internal Clock Frequency | 333.33 MHz |
| Propagation Delay | 0.6 ns |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (PCI-compliant) |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature | 0 °C to 70 °C (commercial) |
| Package | 484-ball FineLine BGA (FBGA-484) |
| Mounting Type | Surface Mount |
EPF10K130EFI484-2 484-ball fineline bga (fbga-484) Pin Configuration Guide
Pin configuration for EPF10K130EFI484-2 (484-ball fineline bga (fbga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K130EFI484-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K130EFI484-2 is suitable for 6 applications: Telecommunications Line Cards, Embedded CPU Bus Bridging, Industrial Control and Automation, Legacy Avionics and Defense Spares, Test and Measurement Equipment, Medical Imaging Backplanes.
Telecommunications Line Cards
The EPF10K130EFI484-2 is well suited to legacy telecom line-card designs that need 130K gates of glue logic, 274 user I/Os for parallel bus multiplexing, and PCI-compliant 3.3 V I/O for backplane interfaces. The 484-ball FineLine BGA exposes enough I/Os to drive multiple E1/T1 framers, UART banks, and HDLC controllers simultaneously. The 0.6 ns propagation delay and 333 MHz internal clock let the FPGA meet typical 50 MHz backplane timing budgets with margin to spare. Designers targeting this application should plan for the BGA breakout and use Quartus II's SameFrame pin migration to move between 10K100 and 10K130 dies on the same board layout.
Recommended
Embedded CPU Bus Bridging
Industrial single-board computers and SBCs frequently use a FLEX 10KE FPGA as a bus bridge between a host CPU (PowerPC, MIPS, or x86) and peripheral buses (PCI, ISA, local-bus). The EPF10K130EFI484-2's 274 I/Os and PCI-compliant 3.3 V banks directly support PCI 33 MHz target/initiator interfaces, while the embedded array blocks (EABs) provide up to 65,536 bits of on-chip RAM for FIFO buffers. This eliminates an external SRAM in many designs and reduces BOM cost while keeping timing deterministic. Designers should verify that the Quartus II fitter can place-and-route the PCI core within the 1,664 LABs available.
Recommended
Industrial Control and Automation
Factory-floor controllers, PLCs, and motor-drive front-ends use FLEX 10KE FPGAs for high-speed encoder decoding, PWM generation, and deterministic I/O expansion. The EPF10K130EFI484-2's commercial 0 °C to 70 °C operating range and PCI-compliant I/O tolerance make it a fit for cabinet-mounted control boards, while the 65,536 bits of EAB memory allow look-up-based waveform synthesis and PID controller coefficient storage without external memory. The FineLine BGA-484 footprint provides rugged solder joint reliability for industrial vibration environments when assembled with proper BGA underfill or corner-bond adhesive.
Recommended
Legacy Avionics and Defense Spares
Long-life military and avionics platforms that were designed around the FLEX 10KE family in the late 1990s and early 2000s still require the EPF10K130EFI484-2 as a form-fit-function replacement when fielded systems are refurbished. The 130K-gate logic capacity, JTAG 1149.1 boundary scan support, and 274 user I/Os match the original design intent exactly, and SameFrame pin compatibility lets depot-level repairs migrate between 10K, 10KE, 10KA, and 10K130E die revisions without board rework. Lead times and traceability (lot date code, country of origin) are the dominant procurement constraints for this application.
Recommended
Test and Measurement Equipment
ATE (Automatic Test Equipment) chassis and bench-top instruments use FLEX 10KE FPGAs for pattern generation, timing-edge synthesis, and parallel digital capture. The EPF10K130EFI484-2's 333 MHz internal clock and 0.6 ns propagation delay support sub-nanosecond edge placement when combined with the device's dedicated FastIO input registers, while 274 user I/Os allow 32+ channels of 8-bit pattern I/O with margin. The 65,536-bit EAB memory can hold stimulus vectors on-chip to reduce external memory access during repetitive test cycles, and JTAG support allows in-system programming through the test head.
Recommended
Medical Imaging Backplanes
Ultrasound, CT, and MRI backplanes rely on deterministic FPGA logic to aggregate data from multiple transducer arrays and route it to high-speed ADCs and processors. The EPF10K130EFI484-2's 130K gates and 274 I/Os can multiplex 16+ channels of LVDS data while the EAB blocks buffer acquisition bursts, and PCI-compliant 3.3 V I/O interfaces directly to host CPUs. Commercial 0 °C to 70 °C operation fits the controlled thermal environment of a medical cart or rack chassis. Designers should validate EMI behaviour at the BGA-484 ball grid with proper ground-return stitching to avoid common-mode noise on the LVDS pairs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K130EFI484-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K130EFC484-2 | EPF10K130EFC484-2N | EPF10K130EFC484-3 | EPF10K130EFC484-3N | EPF10K130EFC484-1 | EPF10K100EFI484-2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FineLine BGA (FBGA-484) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Equivalent Gate Count | 130,000 gates | 130,000 gates | 130,000 gates | 130,000 gates | 130,000 gates | 130,000 gates | 100,000 gates (-23%) |
| Logic Cells | 6,656 | 6,656 | 6,656 | 6,656 | 6,656 | 6,656 | 4,992 (-25%) |
| User I/Os | 274 | 274 | 274 | 274 | 274 | 274 | 274 |
| Internal Clock Frequency | 333.33 MHz | 333.33 MHz | 333.33 MHz | ~300 MHz (-3 speed grade) | ~300 MHz (-3 speed grade) | ~370 MHz (-1 speed grade) | 333.33 MHz |
| Propagation Delay | 0.6 ns | 0.6 ns | 0.6 ns | ~0.7 ns (-3 speed grade) | ~0.7 ns (-3 speed grade) | ~0.5 ns (-1 speed grade) | 0.6 ns |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Key Differentiators
- Same-die commercial-temperature variant on the FineLine BGA-484 footprint (vs EPF10K130EFC484-2)
- Pin-compatible speed-grade variants for design margin flexibility (vs EPF10K130EFC484-3 (slower) vs EPF10K130EFC484-1 (faster))
- Drop-in migration path to a smaller 100K-gate die on the same footprint (vs EPF10K100EFI484-2)
Design Notes
The FLEX 10KE core runs on 2.5 V and the I/O banks on 3.3 V (PCI-compliant). Use a low-dropout linear regulator (e.g. a 1.5 A LDO such as the LP3965 or TPS7A45) to derive the 2.5 V core rail from the 3.3 V bus, and place 0.1 µF high-frequency decoupling within 3 mm of every VCCINT/VCCIO ball plus 10 µF bulk capacitors on each supply plane. Estimated: at full 130K-gate utilization the core draws approximately 200-400 mA DC and the I/O banks another 100-300 mA depending on switching activity; design the supply for at least 1 A continuous to stay within regulation at worst-case load.
The 484-ball FineLine BGA has a θJA of roughly 15-20 °C/W on a 4-layer JEDEC test board with thermal vias. Estimated: at full utilization and 200 mA core current, internal dissipation is approximately 0.5 W, yielding a junction rise of about 10 °C above ambient - well within the 70 °C commercial ceiling. If you plan to operate near 70 °C ambient, add a copper heat-spreader or thermal pad under the package centre to reduce hot-spot temperature and improve BGA solder-joint reliability.
FineLine BGA-484 uses 1.0 mm ball pitch, which demands 0.5 mm via-pad diameter and 0.2 mm trace/space on at least the top layer. Fan-out via-in-pad is recommended to escape the inner rows; otherwise route dog-bone fanouts and accept the larger breakout area. Match trace impedance to 50 Ω single-ended / 100 Ω differential for LVDS and 3.3 V PCI signalling, and stitch a ground guard via every 3-4 signal vias to provide a clean return path.
Do not assume SameFrame pin migration is automatic between FLEX 10K, 10KE, 10KA, and 10K130E dies - always open the Quartus II pin planner and verify each signal is in a valid pin on the target device, because some I/O banks differ between family members. Also note that the -1/-2/-3 speed-grade suffix only changes Fmax, not pin-out or electrical limits. Finally, confirm lead-free vs lead-bearing BGA balls before assembly: N-suffix parts (e.g. EPF10K130EFC484-2N) are Pb-free, while older non-N lots are SnPb and require different reflow profiles.
Compliance Information
RoHS / lead-free status not stated in available data [DATA_NEEDED]. Many FLEX 10KE parts were originally Pb-bearing and were later re-released as Pb-free (N-suffix). Verify by lot date code or by requesting a Certificate of Compliance from the distributor.
