EPF10K130EFC484-3N vs EPF10K130EFC484-3 Comparison

Detailed side-by-side comparison of EPF10K130EFC484-3N by Intel and EPF10K130EFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K130EFC484-3N EPF10K130EFC484-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $109.25 $178.92
Series FLEX-10KE β€”
Number of Logic Elements / Cells 6656 β€”
Total RAM Bits 65536 β€”
Typical Gate Count 130000 130,000 system gates
Number of I/O 369 β€”
Number of LABs/CLBs 832 β€”
Number of Embedded Array Blocks (EABs) 72 β€”
Speed Grade -3 (faster timing bin) -3
Operating Temperature Grade Commercial (0C to +70C) β€”
Core Voltage 2.5 V β€”
Process Technology 0.22 Β΅m CMOS β€”
Package Type 484-BBGA (FineLine BGA) β€”
Package Dimensions 23 x 23 mm β€”
Ball Pitch 1.0 mm β€”
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial β€”
Family β€” FLEX 10KE
Logic Elements (LEs) β€” 6,656
Logic Array Blocks (LABs) β€” 832
Embedded Memory (EABs) β€” 16 x 4,096 bits (65,536 bits total)
Maximum User I/O β€” 369
Supply Voltage (Core) β€” 3.3 V
I/O Voltage Support β€” 5.0 V / 3.3 V / 2.5 V (multi-volt I/O)
Propagation Delay β€” 0.6 ns (per LE)
Operating Temperature β€” 0 C to +70 C (commercial)
Package β€” 484-pin FBGA (FineLine BGA)
Configuration Method β€” SRAM-based, serial or parallel, requires external configuration device
Logic Family β€” CMOS (SRAM-based)

Datasheets & Resources

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