EPF10K130EFC484-3N vs EPF10K50VFC484-3N Comparison

Detailed side-by-side comparison of EPF10K130EFC484-3N by Intel and EPF10K50VFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K130EFC484-3N EPF10K50VFC484-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $109.25 $24.00
Series FLEX-10KE β€”
Number of Logic Elements / Cells 6656 β€”
Total RAM Bits 65536 40,960
Typical Gate Count 130000 β€”
Number of I/O 369 β€”
Number of LABs/CLBs 832 β€”
Number of Embedded Array Blocks (EABs) 72 β€”
Speed Grade -3 (faster timing bin) β€”
Operating Temperature Grade Commercial (0C to +70C) β€”
Core Voltage 2.5 V β€”
Process Technology 0.22 Β΅m CMOS 0.42 Β΅m CMOS, SRAM-based
Package Type 484-BBGA (FineLine BGA) β€”
Package Dimensions 23 x 23 mm β€”
Ball Pitch 1.0 mm β€”
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial β€”
Family β€” FLEX-10K
Logic Elements β€” 2,880
Typical Gates β€” 50,000
Embedded Array Blocks (EABs) β€” 12
Logic Array Blocks (LABs) β€” 10
Maximum User I/Os β€” 291
Supply Voltage (VCCINT) β€” 3.0 V to 3.6 V (3.3 V nominal)
I/O Voltage Standards β€” 5.0 V, 3.3 V, 2.5 V (MultiVolt)
Internal Frequency β€” 125 MHz
Propagation Delay (per LE) β€” 0.6 ns
Package β€” 484-FBGA (23 x 23 mm, 1.27 mm pitch)
Operating Temperature β€” 0 Β°C to +70 Β°C (commercial)
Configuration Modes β€” Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG
JTAG Support β€” IEEE 1149.1 Boundary Scan

Datasheets & Resources

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