EPF10K200EBC600-1 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EBC600-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $322.17 $198.00
Product Type Field Programmable Gate Array (FPGA) β€”
Device Family FLEX-10KE β€”
Logic Elements 9,984 β€”
Embedded Memory 98,304 bits β€”
Logic Array Blocks 1,248 LABs β€”
I/O Count 470 I/O β€”
Supply Voltage 2.5 V 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
Package 600-BGA β€”
Technology Mixed CMOS β€”
Commercial Temperature 85 C β€”
Propagation Delay 0.4 ns 0.4 ns
Embedded Array Enhanced embedded array β€”
Memory Feature Dual-port memory β€”
RoHS Status unknown unknown
Configuration Interface [DATA_NEEDED: configuration interface] β€”
Package Dimensions [DATA_NEEDED: package dimensions] 45 Γ— 45 mm
Operating Current [DATA_NEEDED: operating current] β€”
Pinout [DATA_NEEDED: 600-BGA ball map] β€”
Moisture Sensitivity Level [DATA_NEEDED: MSL level] β€”
Series β€” FLEX-10KE
Logic Family β€” CMOS (SRAM-based)
Process Technology β€” 0.30 Β΅m CMOS
Typical Gate Count β€” 200,000 gates
Logic Elements (LEs) β€” 9984
Logic Array Blocks (LABs) β€” 1248
Embedded Memory (EAB) β€” 98304 bits (96 Kbits)
Maximum User I/O β€” 470 pins
I/O Standards β€” LVTTL, LVCMOS, PCI, GTL+
Package Type β€” 600-ball BGA (BGA-600)
Ball Pitch β€” 1.27 mm
Package Height β€” 1.1 mm max
Operating Temperature β€” 0Β°C to +70Β°C (Commercial)
Mounting Type β€” Surface Mount
Configuration Method β€” JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status β€” Obsolete

Datasheets & Resources

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