EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
MPN: EPF10K200EBC600-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $322.17445 | $322.17 |
| 10 | $322.17445 | $3,221.74 |
| 100 | $322.17445 | $32,217.45 |
| 500 | $322.17445 | $161,087.23 |
| 1,000 | $322.17445 | $322,174.45 |
EPF10K200EBC600-1 Overview
A field-programmable gate array is a programmable logic device containing configurable logic blocks, routing resources, and programmable I/O that implement digital functions. In the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware parallelism and timing control without requiring a custom silicon mask. Embedded memory, logic, and I/O resources let a system combine control logic, interface adaptation, and datapath functions in one programmable device.
The EPF10K200EBC600-1 provides 9,984 logic elements, 1,248 LABs, 470 I/O, and 98,304 bits of embedded memory according to the verified distributor listings. These resources support moderate-to-large digital designs, including glue logic, bus controllers, protocol bridges, and custom peripherals. The 600-BGA package is a high-density surface-mount package, but its ball map and package dimensions are not included in the supplied data.
The FLEX-10KE architecture combines programmable logic with embedded array functions. The supplied description references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. These features make the part suitable for designs needing configurable datapaths and memory, although exact memory organization, operating-current limits, propagation-delay grades, and supported configuration modes are not available in the provided snippets.
Typical applications include industrial control equipment, communications-interface hardware, test equipment, and legacy digital systems. Its 470 I/O make it useful where a design must connect many parallel or serialized external signals, while 9,984 logic elements provide capacity for glue logic, state machines, protocol handling, and custom arithmetic. The 98,304-bit embedded-memory figure also supports buffering and state-storage functions when the design is compiled for the FLEX-10KE architecture.
A critical design step is to verify the exact package ball map, power sequencing, configuration interface, and timing specification before layout or production release. The verified data provides the 600-BGA package name and 470-I/O count, but not a ball-by-ball pinout. Designers should also confirm whether the target design requires the -1 speed grade, a different temperature grade, or a specific revision-compatible source.
This page combines verified distributor specifications, package-level information, pricing references, and engineering-focused context to support component selection. Where the supplied data does not expose a parameter, the value is marked as needed rather than estimated.
Drop-in alternatives for EPF10K200EBC600-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EBC600-1 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EBC600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200SFC484-1
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K200EBC600-1 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | FLEX-10KE |
| Logic Elements | 9,984 |
| Embedded Memory | 98,304 bits |
| Logic Array Blocks | 1,248 LABs |
| I/O Count | 470 I/O |
| Supply Voltage | 2.5 V |
| Package | 600-BGA |
| Technology | Mixed CMOS |
| Commercial Temperature | 85 C |
| Propagation Delay | 0.4 ns |
| Embedded Array | Enhanced embedded array |
| Memory Feature | Dual-port memory |
| RoHS Status | unknown |
EPF10K200EBC600-1 600-bga Pin Configuration Guide
Pin configuration for EPF10K200EBC600-1 (600-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200EBC600-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200EBC600-1 is suitable for 6 applications: Industrial Control Logic, Communications Interface Bridge, Legacy Test and Measurement Equipment, Embedded System-on-a-Programmable-Chip Platform, Digital Signal and Data-Path Conditioning, Legacy Peripheral and Bus Controller.
Industrial Control Logic
The EPF10K200EBC600-1 fits industrial-control systems that need substantial programmable logic and many external interfaces. Its verified capacity includes 9,984 logic elements, 1,248 LABs, and 470 I/O, allowing the FPGA to consolidate state machines, sequencing logic, alarm handling, and machine-control functions. The 98,304 bits of embedded memory can support buffers and control state when configured through the FLEX-10KE design flow. Use the device between sensors, actuators, communication controllers, and a supervisory processor. Confirm industrial temperature requirements, I/O electrical limits, and the exact configuration interface before production.
Recommended
Communications Interface Bridge
The EPF10K200EBC600-1 is suitable for communications-interface bridging because its 470 I/O and 9,984 logic elements can implement parallel-to-serial conversion, protocol framing, timing recovery support, and device-control logic. The FLEX-10KE architecture combines programmable logic with embedded-array functions, while the verified data identifies 98,304 bits of embedded memory for buffering and control storage. In a system, the FPGA can sit between a processor bus and one or more external communications devices. Validate I/O voltage compatibility, clocking constraints, propagation timing, and the configuration method, because the supplied data does not provide complete AC or pin-level specifications.
Recommended
Legacy Test and Measurement Equipment
The EPF10K200EBC600-1 can support legacy test and measurement equipment that requires deterministic hardware control, many instrument signals, and configurable timing logic. The verified 1,248 LAB count and 470 I/O provide capacity for trigger distribution, signal routing, instrument sequencing, and custom measurement functions. Its 98,304 bits of embedded memory can be used for capture buffers or control tables when the selected architecture supports the required implementation. Place the FPGA close to the controlled measurement path and preserve controlled-clock timing. Because the part is obsolete, existing boards should document the exact ordering code, package revision, and bitstream before any repair or redesign.
Recommended
Embedded System-on-a-Programmable-Chip Platform
The EPF10K200EBC600-1 is appropriate for embedded system-on-a-programmable-chip designs that combine custom logic, memory functions, and peripheral interfaces. The supplied family description specifically references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. With 9,984 logic elements, 1,248 LABs, and 98,304 bits of embedded memory, the device can implement control blocks and dataflow functions around a host processor. Use the FPGA for deterministic hardware functions rather than general-purpose software replacement. Verify supported memory modes, configuration memory, reset timing, and the exact embedded-array organization in the official family documentation.
Recommended
Digital Signal and Data-Path Conditioning
The EPF10K200EBC600-1 can serve in digital signal and data-path conditioning systems that need parallel processing, custom timing, and configurable memory structures. Its verified 9,984 logic elements and 470 I/O support datapath control, sample routing, buffering, and interface adaptation. The 98,304-bit embedded-memory figure is useful for temporary data storage, while the programmable logic can implement state-dependent filtering or channel management. The FLEX-10KE family is an older FPGA family, so achievable clock rate and utilization must be confirmed through the supported toolchain and timing analysis. Do not infer real-time performance from the supplied 0.4 ns figure without the datasheet’s test conditions and timing definitions.
Recommended
Legacy Peripheral and Bus Controller
The EPF10K200EBC600-1 fits a legacy peripheral or bus-controller role when a board needs custom bus timing, address decoding, interrupt aggregation, or adapter logic. The verified 470-I/O count provides broad connectivity, and 9,984 logic elements provide capacity for state machines and protocol handling. The FPGA can be placed between a processor or backplane bus and slower peripheral devices, reducing the need for multiple fixed-function components. Confirm signal-level compatibility, clock-domain behavior, setup and hold margins, and the exact I/O assignments using the official 600-BGA package data. Because the part is obsolete, preserve a validated configuration image and document any replacement impact.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EBC600-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EBC600-2 | EPF10K200SFC484-1 |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 600-BGA | 600-BGA | 600-BGA |
| Supply Voltage | 2.5 V | 2.5 V family context | 2.5 V family context |
Key Differentiators
- Large verified programmable-logic capacity (vs EPF10K200SFC484-1)
- Established FLEX-10KE architecture for embedded logic (vs EPF10K200EBC600-2)
- High verified external-connectivity count (vs EPF10K200SFC484-1)
- Embedded memory and enhanced-array functions (vs EPF10K200SFC484-1)
Design Notes
The supplied data identifies a 2.5 V FLEX-10KE device but does not provide operating-current, power-consumption, power-up sequencing, or auxiliary-rail tables. Before schematic release, obtain the official electrical-characteristics and recommended-operating-condition sections. Use the manufacturer’s power-estimation procedure with the actual design utilization, clock rates, toggle rates, memory usage, and I/O loading. Treat all calculated dissipation and junction-temperature values as estimates until validated on hardware. Include local decoupling according to the reference design, confirm power-good and reset sequencing, and avoid relying on the family voltage label as a substitute for complete rail limits.
The verified package is 600-BGA, but the complete ball map, package dimensions, land pattern, and ball numbering are not present in the supplied data. Obtain the official package drawing and the exact pinout before PCB layout. Check all power and ground balls, configuration pins, clock inputs, differential pairs, and user-I/O banks. Follow the manufacturer footprint recommendations rather than copying a generic 600-ball pattern. Verify solder-paste aperture, escape routing, via-in-pad policy, and high-speed signal transitions with the assembly house. A package label of 600-BGA alone is insufficient evidence that two devices share a drop-in footprint.
The 470-I/O count makes signal-integrity planning important, especially when the device connects buses, clocks, or communications interfaces. Assign I/O standards and directions only after reviewing the official I/O-bank and electrical tables. Use controlled-impedance routing for fast single-ended or differential signals, provide return-path continuity, and keep clock and high-transition signals away from sensitive inputs. Calculate timing with the supported toolchain and verify setup, hold, propagation delay, and clock uncertainty at the receiving device. The supplied 0.4 ns figure is not a substitute for the full timing model, test conditions, and load assumptions.
Do not select a replacement based only on FPGA capacity, I/O count, or a distributor’s generic “equivalent” label. The supplied data does not verify that EPF10K200EBC600-2 or EPF10K200SFC484-1 has the same 600-BGA ball map, electrical limits, timing grade, configuration interface, or software support as EPF10K200EBC600-1. Also do not assume that a distributor listing proves current production, factory-new condition, or a supported lifecycle. For a new design, use an authorized current FPGA or complete a full board and firmware requalification. For legacy maintenance, preserve the original bitstream, document the ordering code, and validate every replacement through a controlled engineering change.
Compliance Information
The supplied data identifies mixed CMOS and commercial temperature information but does not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 status is not stated and is treated as not applicable to the supplied information, not as a qualified claim.
