EPF10K200EBC600-2 vs EPF10K200EBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200EBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-2 EPF10K200EBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $322.17
Series FLEX-10KE β€”
Logic Family CMOS (SRAM-based) β€”
Process Technology 0.30 Β΅m CMOS β€”
Typical Gate Count 200,000 gates β€”
Logic Elements (LEs) 9984 β€”
Logic Array Blocks (LABs) 1248 β€”
Embedded Memory (EAB) 98304 bits (96 Kbits) β€”
Maximum User I/O 470 pins β€”
Propagation Delay 0.4 ns 0.4 ns
Supply Voltage 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) 2.5 V
I/O Standards LVTTL, LVCMOS, PCI, GTL+ β€”
Package Type 600-ball BGA (BGA-600) β€”
Package Dimensions 45 Γ— 45 mm [DATA_NEEDED: package dimensions]
Ball Pitch 1.27 mm β€”
Package Height 1.1 mm max β€”
Operating Temperature 0Β°C to +70Β°C (Commercial) β€”
Mounting Type Surface Mount β€”
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM β€”
Part Status Obsolete β€”
RoHS Status unknown unknown
Product Type β€” Field Programmable Gate Array (FPGA)
Device Family β€” FLEX-10KE
Logic Elements β€” 9,984
Embedded Memory β€” 98,304 bits
Logic Array Blocks β€” 1,248 LABs
I/O Count β€” 470 I/O
Package β€” 600-BGA
Technology β€” Mixed CMOS
Commercial Temperature β€” 85 C
Embedded Array β€” Enhanced embedded array
Memory Feature β€” Dual-port memory
Configuration Interface β€” [DATA_NEEDED: configuration interface]
Operating Current β€” [DATA_NEEDED: operating current]
Pinout β€” [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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