EPF10K200EBC600-3 vs EPF10K200EBC600-2 Comparison
Detailed side-by-side comparison of EPF10K200EBC600-3 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete
Specification Comparison
| Parameter | EPF10K200EBC600-3 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $575.00 | $198.00 |
| Family | FLEX 10KE | β |
| Series | FLEX-10KE | FLEX-10KE |
| System Gates | 200,000 | β |
| Logic Elements / Cells | 9,984 | β |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EABs) | 24,576 bits | β |
| Maximum User I/O | 470 | 470 pins |
| Number of PLLs | 4 | β |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | β |
| Process Technology | 0.22 micrometer SRAM | 0.30 Β΅m CMOS |
| Speed Grade | -3 (commercial) | β |
| Package | 600-ball FineLine BGA, 45 x 45 mm | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0C to +70C (commercial) | 0Β°C to +70Β°C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | unknown |
| Logic Family | β | CMOS (SRAM-based) |
| Typical Gate Count | β | 200,000 gates |
| Logic Elements (LEs) | β | 9984 |
| Embedded Memory (EAB) | β | 98304 bits (96 Kbits) |
| Propagation Delay | β | 0.4 ns |
| Supply Voltage | β | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | β | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | β | 600-ball BGA (BGA-600) |
| Package Dimensions | β | 45 Γ 45 mm |
| Ball Pitch | β | 1.27 mm |
| Package Height | β | 1.1 mm max |
| Configuration Method | β | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | β | Obsolete |