EPF10K200EBC600-3 vs EPF10K250EBI600-3 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-3 by Intel and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K250EBI600-3 EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K200EBC600-3 EPF10K250EBI600-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $575.00 $110.00
Family FLEX 10KE FLEX 10KE
Series FLEX-10KE β€”
System Gates 200,000 β€”
Logic Elements / Cells 9,984 β€”
Logic Array Blocks (LABs) 1248 β€”
Embedded Memory (EABs) 24,576 bits β€”
Maximum User I/O 470 470
Number of PLLs 4 β€”
Core Voltage 2.5 V (2.375 V to 2.625 V) 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT]
Process Technology 0.22 micrometer SRAM 0.22 Β΅m CMOS, 4-layer metal
Speed Grade -3 (commercial) -3 (fastest)
Package 600-ball FineLine BGA, 45 x 45 mm 600-ball BGA (HBGA)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0C to +70C (commercial) Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range]
JTAG Support Yes (IEEE 1149.1 boundary-scan) β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] Not specified (SnPb / tin-lead finish per legacy distributor listing)
Logic Elements β€” 12,160
Typical Gate Count β€” 250,000 system gates
Embedded System Blocks (ESBs) β€” 12
Dedicated Inputs β€” 4
PLLs β€” 4
On-chip RAM β€” Up to 40 Kbits
Ball Pitch β€” 1.93 mm
Configuration Method β€” SRAM, requires external configuration device (EPC series)
Lead-free β€” no (legacy tin-lead per distributor description)

Datasheets & Resources

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