EPF10K200EBI600-2 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBI600-2 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBI600-2 EPF10K200EBC600-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $198.00
Family FLEX 10KE β€”
System Gates 200,000 β€”
Logic Elements (LEs) 9,984 9984
Logic Array Blocks (LABs) 1,248 1248
Embedded RAM 98,304 bits β€”
Embedded Array Blocks (EABs) 12 (typical for this density) β€”
User I/O Pins 470 β€”
Supply Voltage (VCCINT) 2.5 V β€”
Propagation Delay 0.4 ns (per -2 speed grade) 0.4 ns
Operating Temperature 0 C to 70 C (commercial) 0Β°C to +70Β°C (Commercial)
Package BGA-600, 45 x 45 mm, 1.27 mm pitch β€”
Logic Family CMOS, SRAM-based CMOS (SRAM-based)
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method JTAG / ByteBlaster (SRAM configuration) JTAG (IEEE 1149.1), EPC2 serial PROM
RoHS Status Compliant (lead-free package) unknown
Series β€” FLEX-10KE
Process Technology β€” 0.30 Β΅m CMOS
Typical Gate Count β€” 200,000 gates
Embedded Memory (EAB) β€” 98304 bits (96 Kbits)
Maximum User I/O β€” 470 pins
Supply Voltage β€” 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards β€” LVTTL, LVCMOS, PCI, GTL+
Package Type β€” 600-ball BGA (BGA-600)
Package Dimensions β€” 45 Γ— 45 mm
Ball Pitch β€” 1.27 mm
Package Height β€” 1.1 mm max
Part Status β€” Obsolete

Datasheets & Resources

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