EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
MPN: EPF10K200EBI600-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $198 | $198,000.00 |
EPF10K200EBI600-2 Overview
A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing via a programmable interconnect fabric and configurable logic blocks; modern FPGAs combine programmable logic with embedded multipliers, transceivers, and ARM/SoC cores. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced embedded array blocks (EABs) that implement dual-port RAM, ROM, and FIFO operations in silicon, making the EPF10K200EBI600-2 suitable for both glue logic and larger datapath functions in communication and industrial designs.
Key features include 200,000 system gates, 9,984 logic elements, 1248 LABs, 470 user I/O pins, 98,304 bits of embedded RAM, 0.4 ns propagation delay (per part number designation), 2.5 V core supply, and a commercial 0 C to 70 C operating temperature grade. The device is offered in a 45 x 45 mm, 1.27 mm pitch, 600-ball BGA package, the largest in the FLEX 10KE family, enabling maximum I/O density for high-pin-count ASIC and ASIC-replacement designs.
The architecture pairs four Logic Elements (LEs) per LAB with EABs that can be configured as SRAM (2048 bits each), ROM, or multiplier blocks; routing resources are arranged in FastTrack Interconnect rows and columns. Designers use the Quartus (or legacy MAX+PLUS II) toolchain with HDL or schematic entry to map logic, run static timing analysis, and generate programming files (.sof/.pof) for byte-blaster configuration via JTAG.
Typical applications include industrial automation controllers, telecommunications line cards and DSLAM backplanes, military and aerospace digital signal processing subsystems, and ASIC prototyping where high I/O count and embedded memory blocks are required. The 600-pin BGA also supports large pin-migration paths via SameFrame pin-out compatibility.
When designing with this device, ensure the BGA land pattern follows JEDEC MS-034 with proper microvia stacking and a 6+ layer PCB for power-integrity. Decouple each VCCINT/VCCIO bank with 0.1 uF and 10 uF capacitors placed within 5 mm of the balls, and respect simultaneous-switching-output (SSO) limits for the 2.5 V I/O banks to maintain signal-integrity above 50 MHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EPF10K200EBI600-2 not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K200EBI600-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EBI600-2 (same form factor and footprint) — differing in Package, Process Technology, RoHS Status, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EBC600-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200EBC600-3
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EPF10K200EBC600-1
✅ Drop-In✓ In Stock
$322.17445 / Unit
View Datasheet →EPF10K200SBC600-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SBC600-1
✅ Drop-In✓ In Stock
$425 / Unit
View Datasheet →EPF10K200EBI600-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| System Gates | 200,000 |
| Logic Elements (LEs) | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded RAM | 98,304 bits |
| Embedded Array Blocks (EABs) | 12 (typical for this density) |
| User I/O Pins | 470 |
| Supply Voltage (VCCINT) | 2.5 V |
| Propagation Delay | 0.4 ns (per -2 speed grade) |
| Operating Temperature | 0 C to 70 C (commercial) |
| Package | BGA-600, 45 x 45 mm, 1.27 mm pitch |
| Logic Family | CMOS, SRAM-based |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) |
| RoHS Status | Compliant (lead-free package) |
EPF10K200EBI600-2 bga-600, 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200EBI600-2 (bga-600, 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200EBI600-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200EBI600-2 is suitable for 7 applications: Telecommunications Line Cards, Industrial Automation Controllers, ASIC Prototyping and ASIC Replacement, Digital Signal Processing Front-End, Military and Aerospace Avionics Bus Interfaces, Test and Measurement Instrumentation, Legacy Storage Area Network Controllers.
Telecommunications Line Cards
The EPF10K200EBI600-2 fits telecommunications line card applications because it delivers 470 user I/O pins for parallel bus aggregation and 98,304 bits of embedded RAM for cell/frame buffering in DSLAM and SDH/SONET line interfaces. Its 12 EABs can be configured as dual-port SRAM FIFOs that absorb packet bursts at line rate, while the 9,984 logic elements implement HDLC framing, ATM SAR, or Ethernet MAC datapath functions. The 2.5 V core and 3.3 V-tolerant I/O banks simplify interfacing to legacy line-card transceivers, and the FLEX 10KE SRAM-based configuration supports in-system reprogramming via JTAG for field upgrades. Compared to discrete ASIC + glue-logic implementations, this single-chip solution reduces board area and BOM cost on high-density line cards.
Recommended
Industrial Automation Controllers
The EPF10K200EBI600-2 is well suited to industrial PLC and motion-controller applications where 470 user I/Os handle high-channel-count sensor and actuator fan-out, and the 9,984 logic elements implement ladder-logic, PWM, and encoder-capture functions. The 0 C to 70 C commercial temperature grade supports cabinet-installed controllers, while the embedded EABs implement PID lookup tables and trajectory buffers in dual-port RAM. Its SRAM-based configuration enables on-site firmware updates via ByteBlaster without removing the module from the chassis, supporting field-serviceability. Compared to microcontroller-based PLCs, the FPGA solution delivers deterministic sub-microsecond response for high-speed motion loops.
Recommended
ASIC Prototyping and ASIC Replacement
The EPF10K200EBI600-2 with 200K system gates is the go-to FLEX 10KE density for ASIC prototyping and small-volume ASIC replacement designs. Engineers port RTL from ASIC synthesis libraries to the Quartus FLEX 10KE flow to validate logic, then use the 470 user I/O and 600-ball BGA to map the ASIC pin-out for early software development and hardware-in-the-loop testing. The embedded EABs emulate ASIC SRAM blocks, while the 1248 LABs absorb control logic and registered datapaths. Compared to older FLEX 10K parts, the FLEX 10KE provides 2x logic density at the same 2.5 V supply, enabling single-chip prototypes of multi-chip ASIC sets.
Recommended
Digital Signal Processing Front-End
The EPF10K200EBI600-2 fits DSP front-end designs because the 12 embedded array blocks can be configured as multipliers and coefficient ROMs that implement FIR filters, FFT butterflies, or digital down-converters without external DSP chips. The 9,984 logic elements handle control state machines and address generation, while the 470 user I/Os aggregate high-speed ADC/DAC data buses. The 0.4 ns propagation delay at the -2 speed grade supports sample rates above 100 MHz for moderate-channel-count radar, sonar, or software-defined radio front-ends. Compared to fixed-function DSP processors, the FPGA implementation delivers deterministic latency and parallel-channel processing without per-channel licensing cost.
Recommended
Military and Aerospace Avionics Bus Interfaces
The EPF10K200EBI600-2 is used in military avionics for MIL-STD-1553, ARINC 429, and FireWire bus interface boards where 470 I/O pins connect multiple redundant bus channels and the 9,984 logic elements implement protocol stacks. The FLEX 10KE architecture supports triple-voting redundancy for fault-tolerant designs, and the 600-ball BGA's SameFrame pin compatibility simplifies migration between industrial and military temperature grades (with separate part numbers). The SRAM configuration is loaded via JTAG on power-up from on-board PROMs, enabling field updates of bus protocol tables.
Recommended
Test and Measurement Instrumentation
The EPF10K200EBI600-2 is a strong fit for test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers where 470 I/Os drive high-channel-count probe heads and the 98,304 embedded RAM bits implement deep capture buffers. The 0.4 ns propagation delay supports sampling rates above 200 MHz, while the EABs implement pattern generators and PRBS polynomials. Designers can reconfigure the FPGA in seconds via JTAG to switch between test personalities, eliminating the need for multiple dedicated ASICs. Compared to fixed-function ATE hardware, this single-chip solution reduces bench-instrument cost and time-to-market for new test standards.
Recommended
Legacy Storage Area Network Controllers
The EPF10K200EBI600-2 was widely adopted in Fibre Channel and SCSI RAID controllers of the early 2000s where 470 user I/Os aggregate multiple drive channels and 9,984 logic elements implement XOR parity engines and command queuing. The 12 EABs implement RAID parity lookup tables and CRC generators, while the FLEX 10KE SRAM configuration supports on-the-fly firmware updates for new drive protocols. The 2.5 V core and 3.3 V I/O banks simplify level shifting to legacy drive electronics. For long-lifecycle SAN deployments in industrial and military storage, this FLEX 10KE device remains in service via the secondary market.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EBI600-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EBC600-2 | EPF10K200EBC600-3 | EPF10K200EBC600-1 | EPF10K200SBC600-2X | EPF10K200SBC600-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-600 (FineLine) | BGA-600 (FineLine) - same | BGA-600 (FineLine) - same | BGA-600 (FineLine) - same | BGA-600 (FineLine) - same | BGA-600 (FineLine) - same |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| User I/O | 470 | 470 | 470 | 470 | 470 | 470 |
| Embedded RAM | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits |
| Speed Grade | -2 | -2 | -3 | -1 (faster) | -2 | -1 (faster) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O count in the FLEX 10KE family (vs EPF10K130EFC672-2)
- Maximized embedded RAM for buffering (vs EPF10K100EQC208-2)
- 200K gates in a single-chip ASIC replacement (vs EPF10K200SBC600-2X)
Design Notes
The 600-ball FineLine BGA at 1.27 mm pitch requires a 6+ layer PCB with 0.4-0.6 mm diameter laser-drilled microvias for breakout, and a 1.0-1.5 oz copper plane on dedicated VCCINT and VCCIO layers for power integrity. Follow JEDEC MS-034 land-pattern guidelines for the BGA pad diameter and solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pad geometry. Place at least 20 via-stitched thermal balls under the package center for heat dissipation.
Estimated: VCCINT draw at 100% utilization and 200 MHz toggling reaches approximately 1.5 A on the 2.5 V rail. Place one 0.1 uF X7R ceramic and one 10 uF tantalum within 5 mm of every VCCINT ball bank, with a low-ESR bulk capacitor at the regulator output. Add a ferrite bead in series with the 2.5 V rail to suppress switching noise from the EAB and LAB logic switching.
Respect the simultaneous-switching-output (SSO) limits per I/O bank documented in the FLEX 10KE datasheet; drive no more than 8-12 outputs simultaneously in adjacent balls to limit ground-bounce below 0.4 V. Use controlled-impedance (50 ohm) microstrip routing on outer layers for clock and global signals, and series-damping resistors (22-33 ohm) on heavily-loaded outputs.
Do not apply power before the CONFIG_DONE pin is high or the device will draw excessive current in undefined logic states. Always sequence VCCINT (2.5 V) before VCCIO (2.5/3.3 V) per the datasheet power-on sequence. JTAG programming via ByteBlaster requires a 10 kohm pull-up on TCK, TMS, and TDI to avoid spurious configuration on noisy boards.
Compliance Information
RoHS-compliant per Altera FLEX 10KE datasheet and current distributor listings. Not AEC-Q100 qualified; for automotive applications use a different FPGA family. Lifecycle status: obsolete as of 2026-09-11.
