EPF10K200EBI600-2 vs EPF10K250EBI600-3 Comparison
Detailed side-by-side comparison of EPF10K200EBI600-2 by Intel and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 β Last Time BuySpecification Comparison
| Parameter | EPF10K200EBI600-2 | EPF10K250EBI600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $110.00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | β |
| Logic Elements (LEs) | 9,984 | β |
| Logic Array Blocks (LABs) | 1,248 | β |
| Embedded RAM | 98,304 bits | β |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | β |
| User I/O Pins | 470 | β |
| Supply Voltage (VCCINT) | 2.5 V | β |
| Propagation Delay | 0.4 ns (per -2 speed grade) | β |
| Operating Temperature | 0 C to 70 C (commercial) | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Package | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball BGA (HBGA) |
| Logic Family | CMOS, SRAM-based | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | SRAM, requires external configuration device (EPC series) |
| RoHS Status | Compliant (lead-free package) | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Logic Elements | β | 12,160 |
| Typical Gate Count | β | 250,000 system gates |
| Embedded System Blocks (ESBs) | β | 12 |
| Maximum User I/O | β | 470 |
| Dedicated Inputs | β | 4 |
| PLLs | β | 4 |
| On-chip RAM | β | Up to 40 Kbits |
| Ball Pitch | β | 1.93 mm |
| Core Voltage | β | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| Speed Grade | β | -3 (fastest) |
| Process Technology | β | 0.22 Β΅m CMOS, 4-layer metal |
| Lead-free | β | no (legacy tin-lead per distributor description) |