EPF10K200EFC672-2 vs EPF10K130EFC672-2X Comparison

Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K130EFC672-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-2 EPF10K130EFC672-2X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $210.00 $92.00
Family FLEX 10KE β€”
Logic Elements 9,984 β€”
Typical Gates 200,000 β€”
Maximum User I/Os 470 β€”
Embedded Memory 98,304 bits β€”
Embedded Array Blocks (EABs) 12 β€”
Logic Array Blocks (LABs) 624 β€”
Package 672-BBGA (FineLine BGA) 672-FBGA (FineLine BGA, 27x27 mm)
Package Dimensions 45 x 45 mm β€”
Ball Pitch 1.27 mm 1.0 mm
Process Technology 0.22 um CMOS 0.22 ΞΌm CMOS SRAM
Speed Grade -2 β€”
Propagation Delay 0.4 ns β€”
Operating Temperature 0 C to 70 C 0C to +70C (commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] β€”
Programmability JTAG (IEEE 1149.1) / in-system β€”
RoHS Status Compliant (per distributor listing) [DATA_NEEDED: RoHS compliance status]
Logic Family CMOS CMOS, SRAM-based
Series β€” FLEX 10KE
Number of Logic Elements (LEs) β€” 6656
Number of Logic Array Blocks (LABs) β€” 832
Total RAM Bits β€” 65536
Number of User I/Os β€” 413
Number of DLLs β€” 4
Core Supply Voltage β€” 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage β€” 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V)
Configuration Method β€” Serial configuration device, JTAG
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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