EPF10K200EFC672-3 vs EPF10K250EFC672-1 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K250EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-3 EPF10K250EFC672-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $115.00 $115.00
Series FLEX 10KE β€”
Number of Logic Elements / Cells 9,984 β€”
Number of LABs / CLBs 1248 β€”
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) β€”
Number of I/O 470 β€”
Number of Gates (typical) 200,000 β€”
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) β€”
Process Technology 0.22 Β΅m CMOS β€”
Maximum Operating Frequency 166.67 MHz β€”
Propagation Delay 0.4 ns 0.4 ns
Package / Case 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0C to +70C (Commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) β€”
Number of PLLs 4 β€”
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: MSL level] β€”
Lead-Free [DATA_NEEDED: lead-free status] β€”
Family β€” FLEX 10KE
Logic Family β€” CMOS
Typical System Gates β€” 250,000
Maximum User I/Os β€” 470
Total Pins β€” 672
Package Type β€” BGA-672
Package Size β€” 45 x 45 mm
Ball Pitch β€” 1.27 mm
Package Shape β€” Square
Terminal Form β€” Ball
Programming Technology β€” In-system, SRAM-based
Configuration Interface β€” Serial (passive/active)
Speed Grade β€” -1

Datasheets & Resources

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