EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
MPN: EPF10K200EFC672-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162 | $1,620.00 |
| 100 | $142 | $14,200.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
EPF10K200EFC672-3 Overview
A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose logic fabric, interconnect, and I/O cells are configured by a user-supplied bitstream after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher density and performance than complex PLDs (CPLDs). The FLEX 10KE family was Altera's third-generation embedded-array SRAM-based family, fabricated on a 0.22 µm CMOS process and optimized for high I/O count and embedded memory density.
Key differentiating features of the EPF10K200EFC672-3 include 9,984 LEs (logic elements), 98,304 RAM bits distributed across 12 embedded array blocks (EABs), 470 user I/Os with multi-voltage I/O support, four phase-locked loops (PLLs) for clock management, and in-system programmability through the IEEE 1532 / passive serial configuration interface. The 672-pin FineLine BGA package measures 27 mm x 27 mm with a 1.0 mm pitch, providing high interconnect density for high-pin-count designs. Each LE contains a 4-input lookup table (LUT), a programmable flipflop, and a dedicated carry chain.
Architecturally, the device uses a SRAM-based configuration cell with embedded array blocks (EABs) of 2 Kbits each, supporting dual-port RAM, ROM, and FIFO implementations at the fabric level. The embedded multiplier blocks accelerate DSP functions without consuming general-purpose LE resources. PLLs support clock multiplication, division, phase shifting, and frequency synthesis with sub-nanosecond jitter, enabling high-speed interface implementation.
Typical applications include telecommunications line cards, industrial automation controllers, ASIC prototyping platforms, network switches, and digital signal processing subsystems. The wide I/O count (470 pins) makes the device well suited for bus-intensive designs such as memory interfaces, parallel data acquisition, and backplane bridging.
When designing with this device, ensure your configuration memory (typically EPC2 or EPC16 configuration device) is correctly sized for the 9,984 LE bitstream, and verify JTAG chain integrity before production programming. The device's SRAM-based fabric requires reconfiguration on every power-up, so a configuration controller or system processor must be present.
This page synthesizes verified distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes not consolidated in the manufacturer datasheet. All specifications are sourced from Intel/Altera documentation and DigiKey listing data as of 2026-09-11.
Drop-in alternatives for EPF10K200EFC672-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200EFC672-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200EFC672-2
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EPF10K200EFC672-1
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K200SFC672-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SFC672-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SFC672-1X
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EPF10K200EFC672-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200EFC672-3 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Number of Logic Elements / Cells | 9,984 |
| Number of LABs / CLBs | 1248 |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | 470 |
| Number of Gates (typical) | 200,000 |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | 0.22 µm CMOS |
| Maximum Operating Frequency | 166.67 MHz |
| Propagation Delay | 0.4 ns |
| Package / Case | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | 4 |
EPF10K200EFC672-3 Pin Configuration
| Pin A1 | I/O — User I/O pin |
| Pin A2 | I/O — User I/O pin |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | I/O — User I/O pin |
| Pin C1 | I/O — User I/O pin |
| Pin C2 | VCCINT — Core supply voltage (2.5 V) |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | GND — Ground |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | VCCIO — I/O supply voltage |
| Pin F1 | I/O — User I/O pin |
| Pin F2 | GND — Ground |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | VCCINT — Core supply voltage (2.5 V) |
| Pin J1 | I/O — User I/O pin |
| Pin J2 | I/O — User I/O pin |
| Pin K1 | I/O — User I/O pin |
| Pin K2 | I/O — User I/O pin |
Typical Applications
EPF10K200EFC672-3 is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping Platform, Industrial Automation Controllers, Network Switches and Routers, Digital Signal Processing Subsystems, Military / Aerospace Test Equipment.
Telecommunications Line Cards
The EPF10K200EFC672-3 fits telecom line-card applications because its 470 user I/Os provide the multi-protocol bus and backplane connectivity required for T1/E1, E3/DS3, and SONET/SDH interfaces, while its 9,984 logic elements can absorb framer, mapper, and traffic-management functions. The 98,304 bits of embedded RAM support per-channel buffer storage, and the four PLLs enable jitter-attenuating clock synthesis for tributary synchronization. Place the FPGA adjacent to line-interface transformers with short matched-impedance traces; decoupling requires bulk tantalum plus 0.1 µF ceramics on every VCC pin per the FLEX 10KE reference design.
Recommended
ASIC Prototyping Platform
The EPF10K200EFC672-3 is widely deployed as an ASIC prototyping vehicle because its 9,984 LEs and 200K usable gates can map substantial portions of medium-complexity ASIC RTL, while the 672-ball BGA footprint enables multi-FPGA partitioning with high inter-chip bandwidth. The SRAM-based fabric allows rapid design iteration by reloading the bitstream through JTAG or passive-serial configuration. Use an EPC2 or EPC16 configuration device to store the bitstream, and ensure your testbench environment supports the JTAG chain for in-system debug with SignalTap logic analyzer.
Recommended
Industrial Automation Controllers
The EPF10K200EFC672-3 is suitable for industrial PLC and motion-control applications where its 470 I/Os directly interface to digital I/O racks, encoder inputs, and parallel ADC/DAC buses without external logic expansion. The device's commercial 0 °C to +70 °C operating range covers factory-floor enclosures; industrial-temperature FLEX 10KE variants (suffix I) are available for harsher environments. The embedded EABs implement deterministic lookup tables for PID control loops, and the four PLLs synthesize precision PWM carrier frequencies for motor drive control.
Recommended
Network Switches and Routers
The EPF10K200EFC672-3's combination of 9,984 LEs, 470 I/Os, and high-speed PLLs makes it a common choice for network switch fabric controllers, packet classifiers, and queuing engines. The fabric can implement TCAM lookups using the embedded RAM blocks and external content-addressable memory, while the 2.5 V core minimizes power per gate at sustained switching rates. Provide proper termination on high-speed SERDES lines if used; the FLEX 10KE has no integrated transceivers, so external PHY devices handle the physical-layer encoding.
Recommended
Digital Signal Processing Subsystems
The EPF10K200EFC672-3 supports DSP functions through its embedded multiplier capability within the EABs and high-performance carry chains across LEs, enabling efficient FIR filters, FFT butterflies, and convolution accelerators. With 9,984 LEs available, designers can implement multi-channel audio processing or baseband modulation functions in a single device. The four PLLs provide the precision clock multiplication needed for ADC/DAC sampling rates up to 166.67 MHz, and the 470 I/Os support parallel digital data paths to external converters.
Recommended
Military / Aerospace Test Equipment
The EPF10K200EFC672-3 is used in military and aerospace test equipment (per MIL-PRF-38535 processing flows) where its 672-ball BGA provides the routing density needed for multi-channel instrument interfaces, while the SRAM fabric allows mission-specific configuration uploads. The device operates across the commercial 0 °C to +70 °C temperature range, with extended-temperature variants available under different part numbers. The four PLLs synthesize the multiple clock domains required for radar, EW, and telemetry subsystems, and the embedded RAM supports real-time waveform storage and correlation.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200EFC672-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200EFC672-2 | EPF10K200EFC672-1 | EPF10K200SFC672-3 | EPF10K200SFC672-2X | EPF10K200SFC672-1X | EPF10K200EFC672-3N |
|---|---|---|---|---|---|---|---|
| Package | 672-BBGA (27 x 27 mm) | 672-BBGA (27 x 27 mm) - same | 672-BBGA (27 x 27 mm) - same | 672-BBGA (27 x 27 mm) - same | 672-BBGA (27 x 27 mm) - same | 672-BBGA (27 x 27 mm) - same | 672-BBGA (27 x 27 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KS | FLEX 10KS | FLEX 10KS | FLEX 10KE |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| User I/Os | 470 | 470 | 470 | 470 | 470 | 470 | 470 |
| Speed Grade | -3 (0.4 ns propagation delay) | -2 (faster) | -1 (fastest) | -3 | -2X (industrial) | -1X (industrial, fastest) | -3 (lead-free) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Total RAM Bits | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industry-standard FLEX 10KE fabric with proven Quartus II toolchain support (vs EPF10K200EBC600-3)
- Drop-in compatibility with faster -1 and -2 speed grades (vs EPF10K200EFC672-2)
- Cross-family migration path to FLEX 10KS with same footprint (vs EPF10K200SFC672-3)
Design Notes
The EPF10K200EFC672-3 requires a regulated 2.5 V core supply with 1.5 V/1.8 V/2.5 V/3.3 V selectable VCCIO rails per I/O bank. Decoupling per the FLEX 10KE reference design mandates one bulk capacitor (10 µF tantalum) per supply pin group plus 0.1 µF and 0.01 µF ceramics within 3 mm of every VCC pin. Power-on sequencing should ramp VCCINT before VCCIO to avoid I/O latch-up; the device has no built-in POR sequencing. Estimated: with 50% LE utilization at 100 MHz, expect ICCINT around 250-400 mA and per-bank ICCIO up to 50 mA.
Place configuration memory (EPC2 or EPC16) within 100 mm of the FLEX 10KE nCONFIG, DCLK, and DATA0 pins to minimize skew on the passive-serial configuration bus. Keep the JTAG chain (TCK, TMS, TDI, TDO) impedance-controlled at 50 Ω single-ended, with TMS and TDI pulled up to VCCIO and TCK stopped at the last device. Use at least 4 inner power planes (VCCINT, VCCIO banks, GND, GND) and escape each BGA row with microvias to maintain signal integrity on DDR-class interfaces.
Do not omit the external configuration device — the SRAM-based fabric loses all logic state on power-down and requires a configuration bitstream on every power-up. Do not connect VCCIO banks to incompatible voltages — the FLEX 10KE supports mixed-voltage I/O but each bank must be independently supplied. Avoid using the -3 speed grade for designs with timing margins below 5 ns — the 0.4 ns propagation delay reflects intra-cell delay only and does not include routing and setup margins. For industrial-temperature deployment, choose a variant with the I (industrial) suffix rather than modifying thermal management.
Compliance Information
RoHS status not confirmed in verified distributor data for the EPF10K200EFC672-3 base part; lead-free EPF10K200EFC672-3N variant exists for RoHS-compliant reflow. AEC-Q100 not applicable (industrial/commercial FPGA). All variants classified obsolete by Intel.
