EPF10K200EGC599-1 vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K200EGC599-1 by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EGC599-1 EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $880.00 $115.00
Family FLEX 10KE β€”
Logic Elements (LEs) 9,984 β€”
Typical Gates 200,000 β€”
Embedded Array Blocks (EABs) 470 β€”
Total RAM Bits 98,304 98,304 bits (12 EABs of 8 Kbits)
Core Supply Voltage 2.375 V to 2.625 V β€”
I/O Voltage Tolerance 5.0 V tolerant β€”
Pin Count 599 β€”
Package Type 599-BCPGA (Ceramic Pin Grid Array) β€”
Package Dimensions 62.48 x 62.48 mm β€”
Mounting Type Through-Hole (Socket or Solder) Surface Mount
Operating Temperature 0C to +70C (Commercial) 0 Β°C to +70 Β°C (commercial)
Programming Interface JTAG (IEEE 1149.1) β€”
PLLs 4 β€”
RoHS Status [DATA_NEEDED: RoHS status of ceramic CPGA variant] [DATA_NEEDED: rohs status]
Series β€” FLEX 10KE
Number of Logic Elements / Cells β€” 9,984
Number of LABs / CLBs β€” 1248
Number of I/O β€” 470
Number of Gates (typical) β€” 200,000
Supply Voltage - Operating β€” 2.3 V to 2.7 V (2.5 V nominal)
Process Technology β€” 0.22 Β΅m CMOS
Maximum Operating Frequency β€” 166.67 MHz
Propagation Delay β€” 0.4 ns
Package / Case β€” 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Configuration Memory β€” SRAM-based (volatile, requires external configuration device)
Number of PLLs β€” 4
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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