EPF10K200SBC356-1 vs EPF10K200SBC356-3 Comparison

Detailed side-by-side comparison of EPF10K200SBC356-1 by Intel and EPF10K200SBC356-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC356-1 EPF10K200SBC356-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $580.00 $87.50
Family FLEX 10K (Classic embedded array) FLEX 10K
Logic Elements / Cells 9,984 β€”
Number of LABs / CLBs 1,248 β€”
Total RAM Bits 98,304 β€”
Equivalent Gate Count 200,000 (system gates ~513,000) β€”
Number of User I/Os 274 β€”
Propagation Delay 0.4 ns (-1 speed grade) 0.4 ns
Core Supply Voltage 2.375 V to 2.625 V 2.375 V to 2.625 V
Operating Temperature 0 Β°C to 70 Β°C (commercial) 0 C to 70 C (Commercial)
Package 356-LBGA (35 x 35 mm, 1.27 mm pitch) PBGA-356 (35 x 35 mm, 1.27 mm pitch)
Mounting Type Surface Mount Surface Mount
Logic Family / Process CMOS SRAM LUT β€”
Configuration Method SRAM (volatile) - requires configuration device or JTAG β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
MSL Level [DATA_NEEDED: MSL level] β€”
Device Type β€” FPGA - Field Programmable Gate Array
Typical Gates β€” 200,000
Logic Elements (Cells) β€” 9,984
Logic Array Blocks (LABs) β€” 1,248
Embedded Array Blocks (EABs) β€” 12
Total EAB RAM β€” 98,304 bits
User I/Os β€” 470 (package exposes 274 bonded-out)
Flip-Flops β€” 4,992
Process Technology β€” 0.22 um CMOS, 4 metal layers
Internal Performance (fmax) β€” 250 MHz
Configuration Mode β€” Passive Serial / Passive Parallel / JTAG
MultiVolt I/O β€” 2.5 V / 3.3 V / 5.0 V
Logic Family β€” CMOS

Datasheets & Resources

Browse All Products Create BOM Request Quote