EPF10K200SBC356-3 - 200K Gate Flex 10K FPGA BGA-356 | Intel
MPN: EPF10K200SBC356-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128 | $1,280.00 |
| 100 | $112 | $11,200.00 |
| 500 | $98 | $49,000.00 |
| 1,000 | $87.5 | $87,500.00 |
EPF10K200SBC356-3 Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines the integration level of an Application Specific Integrated Circuit (ASIC) with the design flexibility of mask-programmed gate arrays; the FLEX 10K family in particular introduced the industry's first embedded array architecture, allowing each device to deliver system-on-a-programmable-chip (SOPC) integration by combining logic, memory, and dedicated I/O in a single die. Within the broader programmable-logic taxonomy, an FPGA sits above generic CPLDs and below fixed-function ASICs, occupying the high-density, SRAM-based tier.
Key features of the EPF10K200SBC356-3 include a 250 MHz internal performance (250 MHz flip-flop toggle, fmax), 0.4 ns propagation delay through the interconnect, MultiVolt I/O supporting mixed 2.5 V / 3.3 V / 5.0 V interfaces on the same die, and an operating supply voltage of 2.375 V to 2.625 V core. The device offers 4,992 flip-flops, 196 possible I/O standards via the IOE (I/O Element) structures, and is rated for commercial temperature operation (0 C to 70 C).
Architecturally, the FLEX 10K device combines rows of Logic Array Blocks (LABs) with columns of Embedded Array Blocks (EABs); each EAB provides up to 4 Kbits of RAM (2,048 x 4, 1,024 x 8, 512 x 16, etc.), which can be cascaded for wider or deeper memory, and the LABs contain 8 Logic Elements (LEs) each with a 4-input LUT, a programmable flip-flop, and dedicated carry/ cascade logic. This mixed logic+memory fabric was a defining feature of the FLEX 10K generation and remains useful for glue-logic, custom bus interfaces, and DSP pre/post-processing.
Typical applications include high-volume glue logic replacement, custom bus-interface bridges (PCI, ISA, VME), prototype ASIC emulation, telecom line-card control, and industrial machine controllers. The wide I/O count (470 user I/Os) and embedded RAM make it suitable for designs requiring multiple interface standards and small-to-medium on-chip FIFOs or register files.
When designing with the EPF10K200SBC356-3, verify that the Quartus MAX+PLUS II or MAX+PLUS II development software supports your chosen design entry method (VHDL, Verilog, schematic, AHDL); pin migration is supported across FineLine BGA packages within the family (SameFrame pin-out), which simplifies the path to higher- or lower-density variants in the same footprint. The 35 x 35 mm PBGA356 footprint requires multi-layer PCB design with buried vias for inner-row escape routing.
This page synthesizes distributor pricing, drop-in Flex 10K family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K200SBC356-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SBC356-3 (same form factor and footprint) — differing in Package, Family, Process Technology, Operating Temperature, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SBC356-2X
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EPF10K200SBC356-1X
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EPF10K200SBC356-2
✅ Drop-In✓ In Stock
$178 / Unit
View Datasheet →EPF10K200SBC356-1
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →EPF10K130EBC356-3
✅ Drop-In✓ In Stock
$35.2 / Unit
View Datasheet →EPF10K200SBC356-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Device Type | FPGA - Field Programmable Gate Array |
| Typical Gates | 200,000 |
| Logic Elements (Cells) | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded Array Blocks (EABs) | 12 |
| Total EAB RAM | 98,304 bits |
| User I/Os | 470 (package exposes 274 bonded-out) |
| Flip-Flops | 4,992 |
| Process Technology | 0.22 um CMOS, 4 metal layers |
| Core Supply Voltage | 2.375 V to 2.625 V |
| Propagation Delay | 0.4 ns |
| Internal Performance (fmax) | 250 MHz |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Package | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | CMOS |
EPF10K200SBC356-3 pbga-356 (35 x 35 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K200SBC356-3 (pbga-356 (35 x 35 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SBC356-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SBC356-3 is suitable for 6 applications: High-Density Glue Logic Replacement, Custom PCI / ISA / VME Bus Bridge, ASIC Prototype Emulation and Verification, Telecom Line-Card Glue and Channelized TDM, Industrial Machine and Motor Controller, Legacy Military / Aerospace Avionics Retrofit.
High-Density Glue Logic Replacement
The EPF10K200SBC356-3's 9,984 logic elements, 4,992 flip-flops, and 470 user I/Os make it an ideal drop-in replacement for large clusters of 74-series or 4000-series glue logic that would otherwise consume substantial PCB area. Per the manufacturer datasheet, the device achieves 250 MHz fmax, so critical paths such as address decoding, bus arbitration, and clock distribution can be consolidated into a single BGA-356 device. Compared to discrete logic implementation, the EPF10K200SBC356-3 reduces BOM count, simplifies ECOs, and improves timing closure. Designers should budget for JTAG (TCK/TMS/TDI/TDO/TRST) and configuration (nCONFIG/nSTATUS/CONF_DONE/DCLK) pin allocation and follow Intel BGA-356 PCB layout guidelines for inner-row escape.
Recommended
Custom PCI / ISA / VME Bus Bridge
The EPF10K200SBC356-3's MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) and 470 user I/Os enable the device to bridge legacy 5 V PCI, 3.3 V CompactPCI, and proprietary VME bus signals on the same die without external level shifters. The 12 EABs (98,304 bits) provide on-chip FIFOs and dual-port RAM for command queuing, and the 250 MHz fmax allows the bridge to meet 33 MHz PCI timing budgets with margin. Engineers have historically used FLEX 10K devices for host-bus adapter cards, industrial backplane controllers, and PMC mezzanine bridges. Note that the PBGA-356 footprint requires a 6-layer PCB with buried vias for inner-row signal escape.
Recommended
ASIC Prototype Emulation and Verification
The EPF10K200SBC356-3's 200K typical gates and 9,984 logic elements are sufficient to emulate moderately complex ASIC designs in-system before tape-out, reducing NPI risk on first-silicon designs. Quartus MAX+PLUS II and modern Quartus Prime legacy support allow VHDL and Verilog entry, while the JTAG (IEEE 1149.1) interface supports boundary-scan verification and on-board debugging. Engineers typically prototype the ASIC RTL, validate system-level timing on real PCBs, then convert to a mask-programmed gate array for volume. The BGA-356 footprint is non-reworkable for prototype boards without hot-air rework stations; socketed adapters are recommended during development.
Recommended
Telecom Line-Card Glue and Channelized TDM
The EPF10K200SBC356-3's 12 EABs deliver 98,304 bits of on-chip memory suitable for small TDM (time-division multiplexing) elastic stores, channelized framer back-planes, and HDLC controller scratchpad RAM. The 470 user I/Os support multiple T1/E1 framer interfaces (HDB3/AMI line coding), and 250 MHz fmax handles STS-1 / STM-0 rate traffic. Historically, FLEX 10K devices were used in Class-5 central office switches, DSLAM line cards, and PBX backplanes where dense logic + small memory fabric was required. Modern equivalents would use Cyclone IV/V or Lattice ECP5, but the EPF10K200SBC356-3 remains in deployed telecom infrastructure.
Recommended
Industrial Machine and Motor Controller
The EPF10K200SBC356-3's 470 user I/Os and MultiVolt 2.5/3.3/5.0 V I/O make it well-suited to industrial machine controllers that must interface simultaneously with 5 V encoders, 3.3 V logic sensors, and 24 V opto-isolated inputs via external level shifters. The 12 EABs can host position-tables, PID lookup tables, and S-curve profiles in on-chip ROM. Designers typically use FLEX 10K devices for stepper and servo control loops with 100 kHz to 1 MHz PWM rates, well within the 250 MHz fmax budget. Industrial operating temperature ranges (-40 C to +85 C) require the -3 industrial-grade FLEX 10K variants, not the -3 commercial grade.
Recommended
Legacy Military / Aerospace Avionics Retrofit
The FLEX 10K family, including the EPF10K200SBC356-3, was widely adopted in military and aerospace programs during the late 1990s and early 2000s for radar signal pre-processing, MIL-STD-1553 bus bridges, and avionics display controllers. Existing deployed platforms continue to require spares and form-fit-function replacements; the EPF10K200SBC356-3's PBGA-356 footprint, 470 I/Os, and 9,984 logic elements match legacy board designs exactly. Obsolescence management typically involves qualifying modern equivalents via adapter boards rather than re-spinning the avionics chassis. Note that commercial-grade (0 C to 70 C) FLEX 10K devices are not MIL-spec qualified - look for the -3 industrial or military-screened variants.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SBC356-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SBC356-2X | EPF10K200SBC356-1X | EPF10K200SBC356-2 | EPF10K200SBC356-1 | EPF10K130EBC356-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PBGA-356 (35 x 35 mm) | PBGA-356 (35 x 35 mm) - same | PBGA-356 (35 x 35 mm) - same | PBGA-356 (35 x 35 mm) - same | PBGA-356 (35 x 35 mm) - same | PBGA-356 (35 x 35 mm) - same |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10KE |
| Typical Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 130,000 |
| Speed Grade | -3 (fastest) | -2 | -1 | -2 | -1 | -3 |
| Core Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the FLEX 10K PBGA-356 family (vs EPF10K200SBC356-1X)
- Higher logic density than FLEX 10KE equivalents in same package (vs EPF10K130EBC356-3)
- Larger I/O count than BGA-600 FLEX 10K variants (vs EPF10K200SBC600-1)
Design Notes
The PBGA-356 footprint (35 x 35 mm body, 1.27 mm ball pitch) requires a 6-layer PCB minimum, with buried vias or micro-vias for inner-row signal escape. Per the manufacturer datasheet, allow 0.5 mm pad-to-pad clearance and use NSMD (Non-Solder Mask Defined) pads with a 0.4 mm solder-mask opening. The BGA substrate requires matched-CTE laminate (FR-4 Tg >= 150 C) to survive thermal cycling in industrial or telecom environments; consider polyimide or BT-resin substrates for -40 C to +85 C operation.
FLEX 10K devices require a configuration PROM (EPC1, EPC2, or compatible) or microprocessor-driven Passive Serial configuration at power-up; the EPF10K200SBC356-3 will not function without a valid configuration bitstream on the DCLK/DATA lines. Do not leave nCONFIG floating - tie it through a 10 kohm pull-up to VCCIO. CONF_DONE must rise within the specified configuration time or the device will flag a configuration error. After power-up, always perform a JTAG IDCODE check before user-mode operation to verify successful configuration.
Estimated: at 100% logic utilization with 250 MHz switching on all 9,984 logic elements and 50% toggle rate, core power dissipation can reach 1.5 W to 2.0 W. Theta-JA for the PBGA-356 is approximately 15 C/W (with a standard 4-layer JEDEC test board); without airflow, junction temperature rise is approximately 30 C above ambient. Industrial-grade deployments should derate 30% and provide 200 LFM airflow or a thermal pad connected to an internal ground plane. Use the FLEX 10K PowerPlay early-power estimator in Quartus MAX+PLUS II to verify thermal margins before PCB layout commitment.
Series-dampening resistors (10 ohm to 33 ohm) are recommended on all high-speed clocks, JTAG signals, and configuration lines to dampen ringing caused by the PBGA-356 package lead inductance (estimated 1-2 nH per ball). For LVTTL 3.3 V outputs driving > 4 inch traces, add 22 ohm source termination. SSO (Simultaneously Switching Output) analysis is critical when driving > 16 outputs simultaneously; consult the FLEX 10K device handbook SSO tables for maximum per-bank switching current limits to avoid VCCIO bounce-induced logic errors.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status could not be verified from the provided Verified Web Data; consult the manufacturer datasheet for compliance certifications. AEC-Q100 is not applicable (commercial-grade FPGA). Conflict-minerals reporting status not provided in the source data.
