EPF10K200SFC484-2N vs EPF10K200SFC484-3 Comparison

Detailed side-by-side comparison of EPF10K200SFC484-2N by Intel and EPF10K200SFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-2N EPF10K200SFC484-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $95.00 $195.00
Family FLEX 10KE FLEX 10K
Logic Elements / Cells 9,984 β€”
Gate Count 200,000 β€”
Logic Array Blocks (LABs) 1,248 1,248
Embedded RAM Bits 98,304 (96 Kbit) β€”
User I/O Pins 369 369
Number of I/Os (alt spec) 470 (per digchip datasheet summary) β€”
Core Supply Voltage 2.375 V to 2.625 V (2.5 V nominal) β€”
Internal Performance 200 MHz β€”
Propagation Delay 0.4 ns β€”
Process Technology 0.22 Β΅m CMOS 0.22 Β΅m CMOS SRAM
Operating Temperature 0Β°C to 70Β°C (Commercial) 0 Β°C to +70 Β°C (Commercial)
Package 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch 484-Ball FineLine BGA (PBGA484)
Mounting Type Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1), SRAM configuration β€”
I/O Standard Support 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V) β€”
Logic Family CMOS β€”
Compliance / Lead Status [DATA_NEEDED: RoHS status] β€”
Series β€” FLEX-10KS
System Gates β€” 200,000
Logic Cells β€” 9,984
Core Voltage β€” 2.375 V to 2.625 V
Maximum Internal Frequency β€” 166.67 MHz
Embedded Memory (RAM bits) β€” 40,960 (via EABs)
Global Clock Networks β€” 4
Package Dimensions β€” 23 mm Γ— 23 mm, 1.0 mm pitch
Configuration Method β€” SRAM, JTAG, EPC2 PROM
I/O Standards β€” 3.3 V LVTTL/LVCMOS, 5.0 V PCI
RoHS Status β€” [DATA_NEEDED: RoHS status]
Status β€” Obsolete (last shipped 2007-2010, available via brokers)

Datasheets & Resources

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