EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
MPN: EPF10K200SFC484-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268 | $2,680.00 |
| 100 | $239 | $23,900.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EPF10K200SFC484-3 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be reprogrammed to implement arbitrary digital logic. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel datapath workloads. The FLEX-10KS family is Intel/Altera's classic high-volume SRAM FPGA family that pioneered the embedded array block (EAB) concept - small dual-port RAM blocks distributed throughout the fabric to eliminate external memory in glue-logic and datapath applications.
Key features of the EPF10K200SFC484-3 include 1,248 LABs organized into rows and columns, 200K equivalent system gates, embedded array blocks for distributed SRAM and ROM, multi-voltage I/O support (3.3V, 5.0V PCI-compliant interfaces), four low-skew global clock networks, and JTAG-compliant IEEE 1149.1 boundary-scan test. The part is rated for the commercial temperature range and is offered in a 484-ball FineLine BGA (1.0 mm pitch, 23 mm × 23 mm body) suitable for high-density PCB designs.
Architecturally, the device uses a four-input look-up table per logic element, hierarchical interconnect with FastTrack continuous routing, and embedded array blocks providing up to 40,960 bits of on-chip RAM. The EABs can be configured as single-port RAM, dual-port RAM, ROM, or product-term logic, enabling efficient implementation of FIFOs, look-up tables, and arithmetic functions. The 0.22 µm process yields a maximum internal operating frequency of approximately 166.67 MHz, suitable for mid-speed glue logic, bridge, and bus-interface applications.
Typical applications include telecom line-card glue logic, industrial bus-bridging (PCI, ISA, VME), legacy ASIC prototyping, custom I/O expansion, and embedded control systems that require a deterministic hardware datapath. The FLEX-10KS family is well documented in reference designs, simplifying migration to the APEX and later Cyclone families.
When designing with this FPGA, note that the device requires a separate configuration PROM (EPC2 or compatible) for SRAM-based configuration storage, or can be configured via JTAG during development. Power sequencing must follow Altera's FLEX 10K reference design, and unused I/O pins should be configured as inputs with weak pull-ups to prevent oscillation.
This page synthesizes distributor pricing, FLEX-10KS family cross-references, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EPF10K200SFC484-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-3 (same form factor and footprint) — differing in Package, Family, Operating Temperature, Process Technology, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-2X
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EPF10K200SFC484-2N
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K200SFC484-1X
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K200SFC484-1N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EPF10K200SBC600-3
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EPF10K200SFC484-3 Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KS |
| Family | FLEX 10K |
| System Gates | 200,000 |
| Logic Cells | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| User I/O Pins | 369 |
| Core Voltage | 2.375 V to 2.625 V |
| Process Technology | 0.22 µm CMOS SRAM |
| Maximum Internal Frequency | 166.67 MHz |
| Embedded Memory (RAM bits) | 40,960 (via EABs) |
| Global Clock Networks | 4 |
| Package | 484-Ball FineLine BGA (PBGA484) |
| Package Dimensions | 23 mm × 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Configuration Method | SRAM, JTAG, EPC2 PROM |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V PCI |
| Status | Obsolete (last shipped 2007-2010, available via brokers) |
EPF10K200SFC484-3 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin A2 | I/O — User I/O pin |
| Pin A3 | I/O — User I/O pin |
| Pin A4 | I/O — User I/O pin |
| Pin A5 | I/O — User I/O pin |
| Pin A6 | I/O — User I/O pin |
| Pin A7 | I/O — User I/O pin |
| Pin A8 | I/O — User I/O pin |
| Pin A9 | VCCIO — I/O supply (bank voltage) |
| Pin A10 | I/O — User I/O pin |
| Pin A11 | I/O — User I/O pin |
| Pin B1 | GND — Ground |
| Pin B2 | I/O — User I/O pin |
| Pin B11 | I/O — User I/O pin |
| Pin C1 | I/O — User I/O pin |
| Pin D2 | VCCINT — Core supply (2.5V) |
| Pin F1 | DCLK — Configuration clock input |
| Pin F22 | CONF_DONE — Configuration complete (open-drain) |
| Pin G1 | nCONFIG — Configuration control (active-low) |
| Pin G22 | nSTATUS — Configuration status (active-low) |
| Pin T1 | TDI — JTAG Test Data In |
| Pin T22 | TCK — JTAG Test Clock |
| Pin U2 | TMS — JTAG Test Mode Select |
| Pin U21 | TDO — JTAG Test Data Out |
| Pin AB9 | GND — Ground |
Typical Applications
EPF10K200SFC484-3 is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial PCI/ISA/VME Bus Bridging, ASIC Prototyping and Emulation, Legacy Industrial Control Systems, Custom I/O Expansion and Signal Conditioning, Embedded Datapath and DSP Front-End.
Telecom Line-Card Glue Logic
The EPF10K200SFC484-3 fits telecom line-card glue logic because of its 200K system gates and 9,984 logic cells across 1,248 LABs, which are sufficient to integrate bus bridges, framer interfaces, and timing-control state machines on a single device. With 369 user I/Os, the FPGA can connect directly to H.110, TDM, and PCI bus signals without external transceivers. Placed between the line-card processor and the framer ASIC, it replaces 4-6 discrete glue-logic ICs and runs at internal frequencies up to 166.67 MHz, comfortably meeting mid-speed telecom datapath requirements. The 0.22 µm SRAM process and 2.5V core supply also keep dynamic power low compared to higher-density FPGAs.
Recommended
Industrial PCI/ISA/VME Bus Bridging
The EPF10K200SFC484-3 is well suited to industrial bus-bridging applications (PCI-to-ISA, PCI-to-VME) because of its 5.0V PCI-compliant I/O support and 200K gates, allowing complete bridge state machines, FIFOs, and interrupt controllers in one device. With 40,960 bits of embedded memory distributed across the EABs, the FPGA can implement dual-port FIFOs without external SRAM. The 369 I/Os accommodate wide bus multiplexing required by 32-bit PCI and VME subsystems. Operating at 166.67 MHz internal frequency, it handles 33 MHz PCI bus transfers with ample margin, and the 2.5V core combined with 3.3V/5.0V I/O matches industrial backplane voltage rails directly.
Recommended
ASIC Prototyping and Emulation
The EPF10K200SFC484-3 serves as an effective ASIC prototyping vehicle because of its 200K system gates, which map closely to mid-complexity ASIC designs in the 100K-150K gate range after accounting for FPGA overhead. Designers can prototype control logic, datapath elements, and on-chip bus structures with real-world timing margins, using the embedded array blocks (EABs) to model SRAM blocks from the ASIC. The 484-ball FineLine BGA provides high pin-count breakout for I/O-intensive ASICs, and Altera's MAX+PLUS II toolchain includes ASIC-to-FPGA partitioning support. Running at 166.67 MHz internal frequency, it allows reasonable pre-silicon validation of 50-100 MHz ASIC designs.
Recommended
Legacy Industrial Control Systems
The EPF10K200SFC484-3 is commonly deployed in legacy industrial control systems (factory automation, machine controllers, motor drives) where long-term field reliability and deterministic hardware response are critical. Its 200K gates accommodate PID controllers, encoder counters, and serial-protocol state machines in a single chip, while the 369 I/Os interface directly to industrial I/O modules. The commercial 0-70 °C temperature range covers most factory-floor environments, and the FLEX-10KS architecture has decades of proven field reliability in deployed systems. Placed between the controller CPU and the I/O backplane, it handles deterministic pulse-train outputs and quadrature decoding with sub-microsecond latency.
Recommended
Custom I/O Expansion and Signal Conditioning
The EPF10K200SFC484-3 is ideal for custom I/O expansion modules that require flexible level translation, signal conditioning, and protocol conversion across 100+ signals. With 369 user I/Os and multi-voltage I/O support (3.3V LVTTL/LVCMOS plus 5.0V PCI), the FPGA bridges between mixed-voltage subsystems without external level shifters. The 9,984 logic cells handle LVDS-to-LVCMOS conversion, parallel-to-serial multiplexing, and timing skew adjustment in a single device. Placed between an industrial backplane and downstream signal conditioning, it replaces 6-10 TTL/CMOS buffer ICs while reducing board area by approximately 60%.
Recommended
Embedded Datapath and DSP Front-End
The EPF10K200SFC484-3 handles embedded datapath and DSP front-end applications because its 40,960 bits of distributed EAB memory enable coefficient storage for FIR filters, lookup-table-based waveform generators, and small FFT engines. With 1,248 LABs operating at 166.67 MHz, it can implement 8-16 tap parallel FIR filters at audio-to-baseband sample rates (typically 1-10 MSPS). The 369 I/Os interface directly to ADC/DAC data buses, and the 2.5V core combined with 3.3V I/O matches common ADC/DAC logic levels. Used between the analog front-end and the host processor, it reduces DSP software load by offloading sample-rate conversion and pulse-shaping functions to dedicated hardware.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-2X | EPF10K200SFC484-2N | EPF10K200SFC484-1X | EPF10K200SFC484-1N | EPF10K200SBC600-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (FineLine BGA, 23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 600-BGA (different footprint, SameFrame pin migration required) |
| Speed Grade | -3 (slowest) | -2 | -2 industrial temp | -1 (fastest) | -1 industrial temp | -3 |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Cells | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| User I/O Pins | 369 | 369 | 369 | 369 | 369 | 469 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V | 2.375V to 2.625V |
| Temperature Range | Commercial (0°C to +70°C) | Commercial | Industrial (-40°C to +85°C) | Commercial | Industrial | Commercial |
| Approximate Unit Price (qty 1, USD) | 295.00 | 305.00 | 325.00 | 350.00 | 370.00 | 335.00 |
| Lifecycle Status | Obsolete (secondary market) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Slowest speed grade (-3) is the most economical option within the FLEX-10KS family (vs EPF10K200SFC484-1X (fastest -1 speed grade))
- Same 484-FBGA FineLine BGA footprint as the entire FLEX-10K family (vs EPF10K200EFC672-3 (672-BGA variant))
- Highest density FLEX-10KS option in 484-BGA package (vs EPF10K130EFC484-3 (130K gate variant))
Design Notes
The EPF10K200SFC484-3 requires VCCINT (2.5V core) and VCCIO (3.3V or 5.0V) rails with power sequencing: VCCIO must reach regulation before or concurrent with VCCINT to prevent I/O latch-up per the Altera FLEX 10K datasheet. Place a 0.1 µF decoupling capacitor within 5 mm of every VCCINT pin and a 10 µF bulk capacitor near each supply rail. Estimated ICCINT worst-case at 166.67 MHz internal activity is approximately 0.5-1.0 A; use a regulator rated for at least 1.5x this for transient margin.
Configure unused I/O pins as inputs with weak pull-ups in your MAX+PLUS II assignment file (or Quartus equivalent pin planner) to prevent floating-input oscillation that increases supply current and may cause reliability issues. Always include the nCONFIG reset supervisor and a configuration error handler in your design so that power-up glitches do not leave the SRAM-based FPGA in an undefined state. Use a JTAG header or ByteBlaster connection for in-system programming during prototype bring-up; production builds should use an EPC2/EPC4 configuration PROM.
The 484-ball FineLine BGA has a 1.0 mm pitch and 23 mm × 23 mm body. Use 0.5 mm drilled micro-vias on a 4-6 layer PCB with a continuous GND plane beneath the device for signal return and thermal dissipation. Route the four global clock nets (CLK0-CLK3) using impedance-controlled traces with matched length (±50 mil) and isolation from adjacent signal traces; place clock-input pins adjacent to GND balls for shortest return path. Leave BGA pads accessible for JTAG probes and include test points for VCCINT, VCCIO, and CONF_DONE.
Compliance Information
RoHS and lead-free status not verified in provided sources. Device was originally designed pre-RoHS; lead-free variants may exist (suffix 'N' typically denotes industrial-temp rather than lead-free). AEC-Q100 not applicable - this is a logic IC, not automotive qualified. Conflict minerals compliance per Intel's standard CMRT.
