EPF10K200SFI672-2N vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K200SFI672-2N by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFI672-2N EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $138.00 $115.00
Family FLEX 10KE β€”
Device Logic Elements 9,984 β€”
Typical Gates 200,000 β€”
Maximum System Gates [DATA_NEEDED: maximum system gates] β€”
Embedded Memory (EAB) 12 EABs, 98,304 bits total β€”
User I/Os 470 β€”
Process Technology 0.22 um CMOS 0.22 Β΅m CMOS
Core Supply Voltage 2.5 V β€”
I/O Supply Voltage 3.3 V (5.0 V tolerant) β€”
Operating Temperature Grade Industrial (-40C to +85C) β€”
Speed Grade -2 (mid) β€”
Package 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount Surface Mount
JTAG Boundary-Scan IEEE Std. 1149.1 compliant β€”
Configuration Method SRAM-based (requires external boot ROM) β€”
RoHS Status Lead-free (N suffix) [DATA_NEEDED: rohs status]
Series β€” FLEX 10KE
Number of Logic Elements / Cells β€” 9,984
Number of LABs / CLBs β€” 1248
Total RAM Bits β€” 98,304 bits (12 EABs of 8 Kbits)
Number of I/O β€” 470
Number of Gates (typical) β€” 200,000
Supply Voltage - Operating β€” 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency β€” 166.67 MHz
Propagation Delay β€” 0.4 ns
Package / Case β€” 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Operating Temperature β€” 0 Β°C to +70 Β°C (commercial)
Configuration Memory β€” SRAM-based (volatile, requires external configuration device)
Number of PLLs β€” 4
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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