EPF10K250EBI600-3 vs EPF10K200EBC600-3 Comparison

Detailed side-by-side comparison of EPF10K250EBI600-3 by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K250EBI600-3 EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K250EBI600-3 EPF10K200EBC600-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $110.00 $575.00
Family FLEX 10KE FLEX 10KE
Logic Elements 12,160 β€”
Typical Gate Count 250,000 system gates β€”
Embedded System Blocks (ESBs) 12 β€”
Maximum User I/O 470 470
Dedicated Inputs 4 β€”
PLLs 4 β€”
On-chip RAM Up to 40 Kbits β€”
Package 600-ball BGA (HBGA) 600-ball FineLine BGA, 45 x 45 mm
Ball Pitch 1.93 mm β€”
Core Voltage 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] 2.5 V (2.375 V to 2.625 V)
Operating Temperature Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] 0C to +70C (commercial)
Speed Grade -3 (fastest) -3 (commercial)
Process Technology 0.22 Β΅m CMOS, 4-layer metal 0.22 micrometer SRAM
Configuration Method SRAM, requires external configuration device (EPC series) β€”
Mounting Type Surface Mount Surface Mount
RoHS Status Not specified (SnPb / tin-lead finish per legacy distributor listing) [DATA_NEEDED: RoHS compliance status]
Lead-free no (legacy tin-lead per distributor description) β€”
Series β€” FLEX-10KE
System Gates β€” 200,000
Logic Elements / Cells β€” 9,984
Logic Array Blocks (LABs) β€” 1248
Embedded Memory (EABs) β€” 24,576 bits
Number of PLLs β€” 4
JTAG Support β€” Yes (IEEE 1149.1 boundary-scan)

Datasheets & Resources

Browse All Products Create BOM Request Quote