EPF10K250EFC672-3 vs EPF10K250EFI672-3 Comparison

Detailed side-by-side comparison of EPF10K250EFC672-3 by Intel and EPF10K250EFI672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFC672-3 EPF10K250EFI672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $99.50 $125.00
Product Type FPGA (Field Programmable Gate Array) β€”
Family FLEX 10KE FLEX 10KE
Maximum Typical Gates 250,000 β€”
Logic Elements (LEs) 12,160 β€”
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) β€”
Logic Array Blocks (LABs) 392 (8 LEs per LAB) β€”
User I/O Pins 470 470
Core Supply Voltage 2.5 V 2.5 V
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V 2.5 V / 3.3 V (multiVolt I/O)
Speed Grade -3 (fastest) β€”
Temperature Grade Commercial (0C to +70C) β€”
Package 672-ball FineLine BGA (FC) 672-ball FineLine BGA, 1.27 mm pitch
Ball Pitch 1.0 mm β€”
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM β€”
Process Technology 0.25 um CMOS, 5-layer metal CMOS, SRAM-based configuration
Mounting Type Surface Mount β€”
RoHS Status [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] Unknown (legacy Altera non-RoHS device)
Lead-Free [DATA_NEEDED: lead-free status] β€”
Typical Gates β€” 250,000
Logic Elements β€” [DATA_NEEDED: exact LE count]
Embedded Array Blocks (EABs) β€” 12
EAB Dual-Port Width β€” Up to 16-bit
Maximum EAB Memory β€” [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) β€” 0.4 ns (typical, -3 speed grade)
Configuration Interface β€” JTAG / ByteBlaster (EPC2/EPC8 PROM)
Operating Temperature β€” 0 Β°C to 70 Β°C (commercial)
Design Entry β€” EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

Datasheets & Resources

Browse All Products Create BOM Request Quote