EPF10K250EFI672-3 vs EPF10K200EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K250EFI672-3 by Intel and EPF10K200EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFI672-3 EPF10K200EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $125.00 $115.00
Family FLEX 10KE β€”
Typical Gates 250,000 β€”
Logic Elements [DATA_NEEDED: exact LE count] β€”
User I/O Pins 470 β€”
Embedded Array Blocks (EABs) 12 β€”
EAB Dual-Port Width Up to 16-bit β€”
Maximum EAB Memory [DATA_NEEDED: bits per EAB] β€”
Propagation Delay (tpd) 0.4 ns (typical, -3 speed grade) β€”
Core Supply Voltage 2.5 V β€”
I/O Supply Voltage 2.5 V / 3.3 V (multiVolt I/O) β€”
Package 672-ball FineLine BGA, 1.27 mm pitch β€”
Process Technology CMOS, SRAM-based configuration 0.22 Β΅m CMOS
Configuration Interface JTAG / ByteBlaster (EPC2/EPC8 PROM) β€”
Operating Temperature 0 Β°C to 70 Β°C (commercial) 0 Β°C to +70 Β°C (commercial)
Design Entry EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog β€”
RoHS Status Unknown (legacy Altera non-RoHS device) [DATA_NEEDED: rohs status]
Series β€” FLEX 10KE
Number of Logic Elements / Cells β€” 9,984
Number of LABs / CLBs β€” 1248
Total RAM Bits β€” 98,304 bits (12 EABs of 8 Kbits)
Number of I/O β€” 470
Number of Gates (typical) β€” 200,000
Supply Voltage - Operating β€” 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency β€” 166.67 MHz
Propagation Delay β€” 0.4 ns
Package / Case β€” 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Mounting Type β€” Surface Mount
Configuration Memory β€” SRAM-based (volatile, requires external configuration device)
Number of PLLs β€” 4
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

Browse All Products Create BOM Request Quote