EPF10K250EFI672-3 vs EPF10K250EFC672-3 Comparison

Detailed side-by-side comparison of EPF10K250EFI672-3 by Intel and EPF10K250EFC672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFI672-3 EPF10K250EFC672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $125.00 $99.50
Family FLEX 10KE FLEX 10KE
Typical Gates 250,000 β€”
Logic Elements [DATA_NEEDED: exact LE count] β€”
User I/O Pins 470 470
Embedded Array Blocks (EABs) 12 β€”
EAB Dual-Port Width Up to 16-bit β€”
Maximum EAB Memory [DATA_NEEDED: bits per EAB] β€”
Propagation Delay (tpd) 0.4 ns (typical, -3 speed grade) β€”
Core Supply Voltage 2.5 V 2.5 V
I/O Supply Voltage 2.5 V / 3.3 V (multiVolt I/O) MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Package 672-ball FineLine BGA, 1.27 mm pitch 672-ball FineLine BGA (FC)
Process Technology CMOS, SRAM-based configuration 0.25 um CMOS, 5-layer metal
Configuration Interface JTAG / ByteBlaster (EPC2/EPC8 PROM) β€”
Operating Temperature 0 Β°C to 70 Β°C (commercial) β€”
Design Entry EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog β€”
RoHS Status Unknown (legacy Altera non-RoHS device) [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Product Type β€” FPGA (Field Programmable Gate Array)
Maximum Typical Gates β€” 250,000
Logic Elements (LEs) β€” 12,160
Embedded Memory (EAB) β€” 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) β€” 392 (8 LEs per LAB)
Speed Grade β€” -3 (fastest)
Temperature Grade β€” Commercial (0C to +70C)
Ball Pitch β€” 1.0 mm
Configuration Mode β€” JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Mounting Type β€” Surface Mount
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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